Composite material, and manufacturing method and uses of same

Abstract

Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol.% cuprous oxide (Cu 2 O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10 −6 to 17×10 −6 /° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.

What is claimed is:  
     
         1 . A method of manufacturing a composite material comprising the steps of melting copper (Cu) and copper oxide (Cu 2 O) in an atmosphere of 10 −2  to 10 3  Pa of oxygen partial pressure, and solidifying the same.  
     
     
         2 . A method as set forth in  claim 1 , wherein the solidifying step is carried out by casting.  
     
     
         3 . A method as set forth in  claim 2 , wherein heat-treatment at 800 to 1,050° C., and cold or hot plastic working are carried out after the casting.  
     
     
         4 . A method as set forth in  claim 1 , wherein the copper and the copper oxide are dispersed with each other.  
     
     
         5 . A method as set forth in  claim 2 , wherein the copper and the copper oxide are dispersed with each other.  
     
     
         6 . A method as set forth in  claim 3 , wherein the copper and the copper oxide are dispersed with each other.