Transfer method

Abstract

A rail-guided transfer system, capable of preventing the reduction of the operation rate of manufacturing equipments on a manufacturing line such as a semiconductor manufacturing line etc., is provided. Two RGVs 11 A and 11 B are arranged in advance on one transfer rail 3 laid between two stockers BS 1 and BS 2. For example, when maintenance of the manufacturing equipment EQ 8 provided between the stockers BS 1 and BS 2 is done, a transfer region MA 1 of the RGV 11 A is set from the stocker BS 1 to the manufacturing equipment EQ 7 and a transfer region MA 2 of the RGV 11 B is set from the stocker BS 2 to the manufacturing equipment EQ 9.

What is claimed is:  
     
         1 . A transfer method comprising the steps of: 
 using a single track connecting a plurality of manufacturing equipments, and a plurality of transfer means operating along said single track; and    transferring, to said manufacturing equipments, an object to be transferred,    wherein each of said transfer means has a transfer mode of a first step and a second step after said first step, and a first transfer region of each of said transfer means at said first step and a second transfer region of each of said second transfer means at said second step are different from each other in range.    
     
     
         2 . The transfer method according to  claim 1 , 
 wherein said first transfer region and said second transfer region of one of said plurality of transfer means are mutually separated from said first transfer region and said second transfer region of the other of said transfer means.    
     
     
         3 . The transfer method according to  claim 1 , 
 wherein said transfer means are RGVs moving on or along said single track.    
     
     
         4 . The transfer method according to  claim 1 , 
 wherein said object to be transferred is a semiconductor wafer lot with a diameter of 300 mm or larger.    
     
     
         5 . A transfer method comprising the steps of: 
 using a single track connecting a plurality of manufacturing equipments, and a plurality of transfer means operating along said single track; and    transferring, to said manufacturing equipments, an object to be transferred,    wherein at least one of said transfer means has a transfer mode of a first step and a second step being at the time of blocking off said single track, and a first transfer region of said at least one of the transfer means at said first step and a second transfer region of said at least one of the transfer means at said second step are different from each other in range.    
     
     
         6 . The transfer method according to  claim 5 , 
 wherein said first transfer region and said second transfer region of the one of said plurality of transfer means are mutually separated from said first transfer region and said second transfer region of the other of said transfer means.    
     
     
         7 . The transfer method according to  claim 5 , 
 wherein while doing maintenance of said manufacturing equipments or making a new or additional installation of at least one of said manufacturing equipments, said single track is blocked at a position of said maintenance or said new or additional installation.    
     
     
         8 . The transfer method according to  claim 5 , 
 wherein said transfer means are RGVs moving on or along said single track.    
     
     
         9 . The transfer method according to  claim 5 , 
 wherein said object to be transferred is a semiconductor wafer lot with a diameter of 300 mm or larger.    
     
     
         10 . A transfer method comprising the steps of: 
 using a single track connecting a plurality of manufacturing equipments, and a plurality of transfer means operating along said single track; and    transferring, to said manufacturing equipments, an object to be transferred,    wherein each of said transfer means has a transfer mode of a first step being at which a difference in operation rate occurs between said plurality of transfer means and a second step at which said difference in the operation rate is smaller than that at said first step, and a first transfer region of each of said transfer means at said first step and a second transfer region of each of said transfer means at said second step are different from each other in range.    
     
     
         11 . The transfer method according to  claim 10 , 
 wherein said first transfer region and said second transfer region of one of said plurality of transfer means are mutually separated from said first transfer region and said second transfer region of the other of said transfer means.    
     
     
         12 . The transfer method according to  claim 10 , wherein said second transfer region of each of said transfer means at the second step is set based on a processing time, frequency of the processing, and timing of the processing of said plurality of manufacturing equipments at said first step.  
     
     
         13 . The transfer method according to  claim 10 , 
 wherein said transfer means are RGVs moving on or along said single track.    
     
     
         14 . The transfer method according to  claim 10 , 
 wherein said object to be transferred is a semiconductor wafer lot with a diameter of 300 mm or larger.    
     
     
         15 . A transfer method comprising the steps of: 
 using a single track connecting a plurality of manufacturing equipments, and a plurality of transfer means operating along said single track; and    transferring, to said manufacturing equipments, an object to be transferred,    wherein each of said transfer means has a transfer mode of a first step at which there occurs a difference in the standby time until said object to be transferred is transferred to said plurality of manufacturing equipments and a second step at which said difference in the standby time is smaller than that at said first step, and a first transfer region of each of said transfer means at said first step and a second transfer region of each of said transfer means at said second step are different from each other in range.    
     
     
         16 . The transfer method according to  claim 15 , 
 wherein said first transfer region and said second transfer region of one of said plurality of transfer means are mutually separated from said first transfer region and said second transfer region of the other of said transfer means.    
     
     
         17 . The transfer method according to  claim 15 , 
 wherein said second transfer region of each of said transfer means at said second step is set based on a processing time, frequency of the processing, and timing of the processing of each of said plurality of manufacturing equipments at said first step.    
     
     
         18 . The transfer method according to  claim 15 , 
 wherein said transfer means are RGVs moving on or along said single track.    
     
     
         19 . The transfer method according to  claim 15 , 
 wherein said object to be transferred is a semiconductor wafer lot with a diameter of 300 mm or larger.