Multilayer substrate

Abstract

A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.

What is claimed is:  
     
         1 . A multilayer substrate device comprising: 
 a base substrate; and    a first metalization layer formed on the base substrate,    wherein the multilayer substrate is formed without firing.    
     
     
         2 . The multilayer substrate device of  claim 1 , further comprising a plurality of alternating dielectric layers and metalization layers formed over the first metalization layer.  
     
     
         3 . The multilayer substrate device of  claim 2 , wherein one of the plurality of the dielectric layers is alumina.  
     
     
         4 . The multilayer substrate device of  claim 2 , further comprising vias extending through one of the plurality of dielectric layers, wherein two of the metalization layers surrounding the one of the plurality dielectric layers make contact with each other through the via.  
     
     
         5 . The multilayer substrate device of  claim 2 , wherein two of the plurality of metalization layers and one of the plurality of the dielectric layers form a capacitor.  
     
     
         6 . The multilayer substrate device of  claim 1 , wherein the base substrate is glass.  
     
     
         7 . The multilayer substrate device of  claim 1 , wherein the base substrate is ceramic.  
     
     
         8 . A method for forming a multilayer substrate comprising: 
 obtaining a base substrate; and    forming a first metalization layer on the base substrate without firing.    
     
     
         9 . The method of  claim 8 , further comprising forming a plurality of alternating dielectric layers and metalization layers over the first metalization layer.  
     
     
         10 . The method of  claim 9 , wherein a layer of the plurality of dielectric layers is formed by ion beam assist deposition.  
     
     
         11 . The method of  claim 9 , wherein a layer of the plurality of dielectric layers is formed by sputtering.  
     
     
         12 . The method of  claim 9 , wherein a layer of the plurality of dielectric layers is formed by chemical vapor deposition.  
     
     
         13 . The method of  claim 9 , wherein a layer of the plurality of dielectric layers is formed by epitaxial deposition.  
     
     
         14 . The method of  claim 9 , wherein a layer of the plurality of dielectric layers is formed by evaporation.  
     
     
         15 . The method of  claim 9 , wherein forming a plurality of dielectric layers comprises: 
 forming an opening in a mask;    affixing the mask to a layer of the substrate;    depositing an active material in the openings;    removing the mask after the active material has been deposited;    forming a dielectric around the active material; and    removing the active material after the dielectric has been formed around the active material.    
     
     
         16 . The method of  claim 15 , wherein a height of the dielectric layer is less than a height of the active material.  
     
     
         17 . The method of  claim 16 , wherein the height of the dielectric layer is about one-half the height of the active material.  
     
     
         18 . The method of  claim 16 , wherein the height of the dielectric layer is about one-third the height of the active material.  
     
     
         19 . The method of  claim 15 , wherein forming the active material results in a formation of pillars on one of the plurality of metalization layers.  
     
     
         20 . The method of  claim 15 , wherein vias are formed through one of the plurality of dielectric layers when the active material is removed.  
     
     
         21 . The method of  claim 15 , wherein removing the active material after the dielectric has been formed around the active material comprises exposing the active material to a dissolving solution.  
     
     
         22 . The method of  claim 21 , the dissolving solution is ferric chloride.  
     
     
         23 . An assembly for fabricating substrates comprising: 
 first and second pressure plates for applying pressure;    first and second assembly plates, the first assembly plate located adjacent the first pressure plate and the second assembly plate located adjacent the second pressure plate;    first and second printing sheets for printing on a substrate, the first printing sheet located adjacent the first assembly plate and the second printing sheet located adjacent the second assembly plate; and    an enclosure surrounding the first and second assembly plates, the first and second printing sheets, and the substrate,    wherein the first pressure plate and the first printing sheet surround the first assembly plate and the second pressure plate and the second printing sheet surround the second assembly plate, and    wherein the first pressure plate, the first assembly plate and the first printing sheet are located adjacent a first side of the substrate and the second pressure plate, the second assembly plate and the second printing sheet are located adjacent a second side of the substrate.    
     
     
         24 . The assembly of  claim 23 , wherein a pressure applied by the first pressure plate and the second pressure plate acts through the first assembly plate and the second assembly plate to force ink in the first printing sheet and the second printing sheet through vias in the substrate.  
     
     
         25 . The assembly of  claim 23 , wherein the enclosure comprises a port for pulling a vacuum in the enclosure.  
     
     
         26 . The assembly of  claim 23 , wherein the first and second printing sheets are made from foam rubber.  
     
     
         27 . A method for filling vias in a substrate comprising: 
 forming an assembly around the substrate, the assembly including printing sheets for containing a conductive ink, the assembly further including pressure plates for applying pressure;    applying a vacuum about the assembly; and    applying pressure to the printing sheets;    wherein the conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.    
     
     
         28 . The method of  claim 27 , further comprising 
 printing a pattern on the substrate;    drying the substrate; and    firing the substrate.    
     
     
         29 . The method of  claim 27 , wherein forming an assembly around the substrate comprises: 
 positioning a first printing sheet adjacent a first side of the substrate;    positioning a first assembly plate adjacent the first printing sheet;    positioning a first pressure plate adjacent the first assembly plate;    positioning a second printing sheet adjacent a second side of the substrate;    positioning a second assembly plate adjacent the second printing sheet;    positioning a second pressure plate adjacent the second assembly plate; and    positioning an enclosure around at least the substrate and the first and second printing sheets.    
     
     
         30 . The method of  claim 27 , wherein applying a vacuum about the assembly comprises pulling a vacuum in the enclosure.  
     
     
         31 . The method of  claim 30 , wherein air is removed from the conductive ink when a vacuum is pulled in the enclosure.  
     
     
         32 . The method of  claim 27 , wherein applying a pressure to the printing sheets comprises applying a low pressure.  
     
     
         33 . The method of  claim 27 , wherein applying a pressure to the printing sheets comprises applying a high pressure.  
     
     
         34 . The method of  claim 33 , wherein applying a high pressure comprises applying about 1000 lbs.