Apparatus for cutting liquid crystal display panel

Abstract

An apparatus for cutting liquid crystal display panels is disclosed in the present invention. The apparatus includes at least one table receiving bonded mother substrates having a plurality of unit liquid crystal display panels, at least one cutting wheel forming a scribing line on a surface of the bonded mother substrates, and a suction unit coupled to the at least one cutting wheel and sucking in glass debris on the surface of the bonded mother substrates.

What is claimed is:  
     
         1 . An apparatus for cutting liquid crystal display panels, comprising: 
 at least one table receiving bonded mother substrates having a plurality of unit liquid crystal display panels;    at least one cutting wheel forming a scribing line on a surface of the bonded mother substrates; and    a suction unit coupled to the at least one cutting wheel and sucking in glass debris on the surface of the bonded mother substrates.    
     
     
         2 . The apparatus of  claim 1 , wherein the bonded mother substrates include a first mother substrate having a plurality of color filter substrates, and a second mother substrate having a plurality of thin film transistor substrates.  
     
     
         3 . The apparatus of  claim 1 , wherein the suction unit is synchronized with a motion of the cutting wheel.  
     
     
         4 . The apparatus of  claim 1 , further comprising at least one roll applying a pressure onto at least a part of the scribing line.  
     
     
         5 . The apparatus of  claim 4 , wherein the roll is synchronized with a motion of the cutting wheel.  
     
     
         6 . The apparatus of  claim 1 , wherein the at least one table includes a first table and a second table, and the bonded mother substrates are loaded on the first and second tables to be placed across a space formed between the first and second tables.  
     
     
         7 . The apparatus of  claim 6 , further comprising an air curtain above the space between the first table and the second table.  
     
     
         8 . The apparatus of  claim 1 , wherein the at least one table has at least one suction hole to hold the bonded mother substrates.  
     
     
         9 . The apparatus of  claim 8 , wherein the suction hole has a dot shape or a stripe shape.  
     
     
         10 . The apparatus of  claim 6 , wherein the first and second tables move away from each other.  
     
     
         11 . The apparatus of  claim 6 , further comprising a robot grip provided at the space formed between the first table and the second table for removing a dummy region from the bonded mother substrates.  
     
     
         12 . The apparatus of  claim 11 , further comprising a cover bonded to the robot grip.  
     
     
         13 . The apparatus of  claim 12 , wherein the cover is formed of one of urethane and vinyl.