Method and apparatus for removeably coupling a heat rejection device with a heat producing device

Abstract

A method and apparatus for removeably coupling a heat rejecting device with a heat producing device, wherein a thermal interface material having a predetermined phase change temperature is between the heat rejecting device and the heat producing device, the method comprising: configuring the heat rejecting device to include at least one heating element; and energizing the at least one heating element for a predetermined amount of time through at least one electrical contact, wherein a current applied to the at least one heating element heats the at least one heating element until the thermal interface material substantially reaches the predetermined phase change temperature. The at least one heating element is located on an interface surface in contact with the thermal interface material, although alternatively on an opposite surface, or within the apparatus.

What is claimed is:  
     
         1 . A method of removeably coupling a heat rejecting device to a heat producing device comprising: 
 a. configuring the heat rejecting device to include at least one heating element;    b. applying a thermal interface material to an interface surface of the heat producing device, a first surface of the heating rejecting device in contact with the thermal interface material, the thermal interface material configured to allow engagement and disengagement of the heat rejecting device above a predetermined temperature; and    c. applying a current to the at least one heating element for a predetermined amount of time, wherein the at least one heating element heats the thermal interface material above the predetermined temperature.    
     
     
         2 . The method according to  claim 1  further comprising positioning the heat rejecting device at a predetermined location with respect to the heat producing device.  
     
     
         3 . The method according to  claim 1  wherein the thermal interface material undergoes a phase change between a first temperature below the predetermined temperature and a second temperature above the predetermined temperature.  
     
     
         4 . The method according to  claim 3  wherein engagement of the heat rejecting device with the heat producing device further comprises pressing the heat rejecting device and the thermal interface material against one another until the temperature of the thermal interface material is substantially at the first temperature.  
     
     
         5 . The method according to  claim 3  wherein disengagement of the heat rejecting device with the heat producing device further comprises removing the heat rejecting device and the thermal interface material against one another when the temperature of the thermal interface material is substantially at the second temperature.  
     
     
         6 . The method according to  claim 1  wherein the at least one heating element is positioned on the first surface of the heat rejecting device.  
     
     
         7 . The method according to  claim 1  wherein the at least one heating element is positioned on a heat rejecting device surface opposite of the first surface of the heat rejecting device.  
     
     
         8 . The method according to  claim 1  wherein the at least one heating element is positioned within the heat rejecting device.  
     
     
         9 . The method according to  claim 1  wherein the at least one heating element heats the thermal interface material in predetermined zone locations.  
     
     
         10 . The method according to  claim 1  wherein the at least one heating element applies heat to the thermal interface material in a substantially uniform manner.  
     
     
         11 . The method according to  claim 1  wherein the at least one heating element applies heat to the thermal interface material by a plurality of heat pulses, each heat pulse being of a predetermined time duration.  
     
     
         12 . The method according to  claim 1  further comprising configuring the heat rejecting device to include at least one electrical contact positioned on a predetermined surface, wherein the current is applied through the at least one electrical contact.  
     
     
         13 . A heat rejector device configured to be removeably coupled to a thermal interface material, the thermal interface material configurable to engage and disengage the heat rejector device above a predetermined temperature, the heat rejector device comprising at least one heating element, wherein a current applied to the at least one heating element for a predetermined amount of time produces an adequate amount of heat in the at least one heating element to heat the thermal interface material above the predetermined temperature.  
     
     
         14 . The heat rejector device according to  claim 13  wherein the thermal interface material undergoes a phase change between a first temperature below the predetermined temperature and a second temperature above the predetermined temperature.  
     
     
         15 . The heat rejector device according to  claim 14  wherein the thermal interface material engages the heat rejecting device by being pressed against the heat rejecting device until the thermal interface material reaches to the first temperature.  
     
     
         16 . The heat rejector device according to  claim 14  wherein the thermal interface material disengages the heat rejecting device by removing the heat rejecting device and the thermal interface material from one another when the thermal interface material is at the second temperature.  
     
     
         17 . The heat rejector device according to  claim 13 , wherein the at least one heating element is configured to be in contact with the thermal interface material.  
     
     
         18 . The heat rejector device according to  claim 13  wherein the at least one heating element is positioned on a surface of the heat rejector device opposite of the thermal interface material.  
     
     
         19 . The heat rejector device according to  claim 13  wherein the at least one heating element is positioned within the heat rejector device.  
     
     
         20 . The heat rejector device according to  claim 13  wherein the at least one heating element heats the thermal interface material in predetermined zone locations.  
     
     
         21 . The heat rejector device according to  claim 13  wherein the at least one heating element applies heat to the thermal interface material in a substantially uniform manner.  
     
     
         22 . The heat rejector device according to  claim 13  wherein the at least one heating element applies heat to the thermal interface material by a plurality of heat pulses, each heat pulse being of a predetermined time duration.  
     
     
         23 . The heat rejector device according to  claim 13  further comprising at least one electrical contact positioned on a predetermined surface, wherein the current is applied through the at least one electrical contact.  
     
     
         24 . A heat rejector device coupled to an interface material, wherein the heat rejector device is secured to the interface material in a first phase state and configured to be removeable from the interface material in a second phase state, the heat rejector device comprising at least one heating element for applying a predetermined amount of heat to the interface material such that the interface material undergoes a phase change from the first phase state to the second phase state in response to the predetermined amount of heat applied thereto by the at least one heating element.  
     
     
         25 . The heat rejector device according to  claim 24  wherein the interface material is in the first phase state when below a predetermined phase change temperature.  
     
     
         26 . The heat rejector device according to  claim 25  wherein the interface material is in the second phase state when above the predetermined phase change temperature.  
     
     
         27 . The heat rejector device according to  claim 24  wherein the interface material undergoes the phase change between the first phase state and the second phase state within an appropriate amount of time.  
     
     
         28 . The heat rejector device according to  claim 24  wherein the at least one heating element heats the interface material in predetermined zone locations.  
     
     
         29 . The heat rejector device according to  claim 24  wherein the at least one heating element applies heat to the interface material in a substantially uniform manner.  
     
     
         30 . The heat rejector device according to  claim 24  wherein the at least one heating element applies heat to the interface material by a plurality of heat pulses, each heat pulse being of a predetermined time duration.  
     
     
         31 . The heat rejector device according to  claim 24  wherein the at least one heating element is configured to be in contact with the interface material.  
     
     
         32 . The heat rejector device according to  claim 24  wherein the at least one heating element is positioned on a surface of the heat rejector device opposite of the interface material.  
     
     
         33 . The heat rejector device according to  claim 24  wherein the at least one heating element is positioned within the heat rejector device.  
     
     
         34 . The heat rejector device according to  claim 24  further comprising at least one electrical contact positioned on a predetermined surface, wherein the current is applied through the at least one electrical contact.  
     
     
         35 . An assembly for removeably coupling a heat rejecting device to a heat producing device, wherein a thermal interface material having a predetermined phase change temperature is applied between the heat rejecting device and the heat producing device, the assembly comprising: 
 a. means for holding an interface surface of the heat rejecting device in contact with the thermal interface material, wherein at least one heating element configured on the interface surface is in contact with the thermal interface material; and    b. means for energizing the at least one heating element for a predetermined amount of time, wherein the at least one heating element transforms the thermal interface material to undergo a phase change the thermal interface material substantially reaches the predetermined phase change temperature.    
     
     
         36 . A method of removeably coupling a heat rejecting device with a heat producing device, wherein a thermal interface material having a predetermined phase change temperature is between the heat rejecting device and the heat producing device, the method comprising: 
 a. configuring the heat rejecting device to include at least one heating element; and    b. energizing the at least one heating element for a predetermined amount of time, wherein a current applied to the at least one heating element heats the at least one heating element until the thermal interface material substantially reaches the predetermined phase change temperature.