Article with electronic circuit formed and method of manufacturing the same

Abstract

A package is formed by covering a circuit board with a thermoplastics film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

What is claimed is:  
     
         1 . An electronic circuit-formed article manufacturing method of manufacturing an article with an electronic circuit formed, by comprising covering an area, which has electronic components on an article with an electronic circuit formed having the electronic components, with sheet-like films.  
     
     
         2 . An electronic circuit-formed article manufacturing method of manufacturing an article with an electronic circuit formed, by comprising covering both a front and a back surfaces of a circuit board having electronic components with two sheet-like films, and packaging the circuit board with the sheet-like films.  
     
     
         3 . A method of manufacturing an article with an electronic circuit formed as defined in  claim 2 , wherein the front surface of the circuit board is covered with one sheet-like film out of the two sheet-like films, and then the back surface of the circuit board is covered with the other sheet-like film to package the circuit board.  
     
     
         4 . A method of manufacturing an article with an electronic circuit formed as defined in  claim 2 , wherein the circuit board is packaged by simultaneously covering both the front and the back surfaces of the circuit board with the two sheet-like films.  
     
     
         5 . A method of manufacturing an article with an electronic circuit formed, comprising: 
 printing or applying an electronic component mounting bonding agent on electrodes of a circuit board;    bringing electronic components close to above positions through mechanical application of pressure;    fixing the components on the board through heating; and    packaging the board with the cylindrical film or sheet-like films.    
     
     
         6 . A method of manufacturing an article with an electronic circuit formed as defined in  claim 5 , wherein the electronic component mounting bonding agent is a metallic solder or a thermosetting conductive adhesive.  
     
     
         7 . An article with an electronic circuit formed, manufactured by the method of manufacturing an article with an electronic circuit formed as defined in  claim 5.