Processing tool, method of producing processing tool, processing method and processing apparatus

Abstract

A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 μm.

What is claimed is:  
     
         1 . A processing tool for carrying out a fixed-abrasive grinding process on a surface of a silicon work-piece, comprising: 
 abrasive grains made up silica grains.    
     
     
         2 . The silicon processing tool as claimed in  claim 1 , wherein a primary average grain size of the silica grains is 0.8 nm to 10 μm.  
     
     
         3 . The processing tool as claimed in  claim 1 , wherein a content of the silica grains in the abrasive grains is 10 to 70 volume percent.  
     
     
         4 . The processing tool as claimed in  claim 1 , further comprising: 
 a binder bonding the abrasive grains, said binder being made of a material which generates no endothermic reaction during the process carried out on the silicon work-piece.    
     
     
         5 . The processing tool as claimed in  claim 1 , further comprising: 
 an additive mixed to the abrasive grains, said additive being made of a material which generates no endothermic reaction during the process carried out on the silicon work-piece.    
     
     
         6 . The processing tool as claimed in  claim 1 , wherein the abrasive grains form a grindstone.  
     
     
         7 . The processing tool as claimed in  claim 1 , wherein the abrasive grains form a film.  
     
     
         8 . The processing tool as claimed in  claim 7 , wherein the film is flexible.  
     
     
         9 . A method of producing a processing tool having abrasive grains for carrying out a fixed-abrasive grinding process on a surface of a silicon work-piece, said method comprising the step of: 
 (a) mixing a binder and silica grains to form a mixture; and    (b) forming the mixture into the abrasive grains of the processing tool.    
     
     
         10 . The method of producing the processing tool as claimed in  claim 9 , wherein said step (a) uses silica grains having a primary average grain size of 0.8 nm to 10 μm.  
     
     
         11 . The method of producing the processing tool as claimed in  claim 9 , wherein said step (a) uses a content of the silica grains in the abrasive grains in a range of 10 to 70 volume percent.  
     
     
         12 . The method of producing the processing tool as claimed in  claim 9 , wherein said step (a) uses a binder made of a material which generates no endothermic reaction during the process carried out on the silicon work-piece by the processing tool.  
     
     
         13 . A processing method for carrying out a fixed-abrasive grinding process on a surface of a silicon work-piece, comprising the steps of: 
 (a) positioning the silicon work-piece relative to a processing tool having abrasive grains made up silica grains; and    (b) processing the surface of the silicon work-piece by the abrasive grains of the processing tool.    
     
     
         14 . The processing method as claimed in  claim 13 , wherein the silica grains have a primary average grain size of 0.8 nm to 10 μm.  
     
     
         15 . The processing method as claimed in  claim 13 , wherein a content of the silica grains in the abrasive grains in a range of 10 to 70 volume percent.  
     
     
         16 . The processing method as claimed in  claim 13 , wherein the tool includes a binder which bonds the abrasive grains and is made of a material which generates no endothermic reaction during the process carried out on the silicon work-piece.  
     
     
         17 . A processing method for carrying out a process on a disk-shaped or donut-shaped work-piece, comprising the steps of: 
 (a) grinding an outer peripheral surface of the work-piece by a grindstone; and    (b) polishing cutout part on the outer peripheral surface of the work-piece and/or an inner peripheral surface of the work-piece by a polishing film.    
     
     
         18 . The processing method as claimed in  claim 17 , wherein said step (a) uses a grindstone including abrasive grains which generate mechano-chemical reaction with respect to a processing surface of the work-piece.  
     
     
         19 . The processing method as claimed in  claim 18 , wherein the abrasive grains have a primary average grain size of 0.8 nm to 10 μm.  
     
     
         20 . The processing method as claimed in  claim 17 , wherein said step (b) uses a polishing film including abrasive grains which generate mechano-chemical reaction with respect to a processing surface of the work-piece.  
     
     
         21 . The processing method as claimed in  claim 20 , wherein said step (b) uses a flexible polishing film.  
     
     
         22 . The processing method as claimed in  claim 20 , wherein the abrasive grains have a primary average grain size of 0.8 nm to 10 μm.  
     
     
         23 . The processing method as claimed in  claim 17 , wherein said steps (a) and (b) respectively carry out a dry grinding process and a dry polishing process.  
     
     
         24 . A processing apparatus for carrying out a process on a disk-shaped or donut-shaped work-piece, comprising: 
 a grinding unit grinding an outer peripheral surface of the work-piece by a grindstone;    a polishing unit polishing cutout part on the outer peripheral surface of the work-piece and/or an inner peripheral surface of the work-piece by a polishing film; and    a transport unit transporting the work-piece at least between the grinding unit and the polishing unit and positioning the work-piece in the grinding unit and the polishing unit.    
     
     
         25 . The processing apparatus as claimed in  claim 24 , wherein said grinding unit includes a grindstone having abrasive grains which generate mechano-chemical reaction with respect to a processing surface of the work-piece.  
     
     
         26 . The processing apparatus as claimed in  claim 25 , wherein the abrasive grains have a primary average grain size of 0.8 nm to 10 μm.  
     
     
         27 . The processing apparatus as claimed in  claim 24 , wherein said polishing unit includes a polishing film having abrasive grains which generate mechano-chemical reaction with respect to a processing surface of the work-piece.  
     
     
         28 . The processing apparatus as claimed in  claim 27 , wherein said polishing film is flexible.  
     
     
         29 . The processing apparatus as claimed in  claim 27 , wherein the abrasive grains have a primary average grain size of 0.8 nm to 10 μm.  
     
     
         30 . The processing apparatus as claimed in  claim 24 , wherein said grinding unit and said polishing unit respectively carry out a dry grinding process and a dry polishing process.