Plating apparatus and method

Abstract

A plating apparatus continuously plates a surface of a substrate with metal and performs its supplementary process in one housing unit. The plating apparatus comprises a cassette stage for placing a substrate cassette thereon, a pre-treatment unit for pre-treating a surface of a substrate, and a plating unit for plating a surface of the substrate pre-treated in the pre-treatment unit. The plating apparatus further comprises a first substrate stage disposed between the cassette stage and the pre-treatment unit, a cleaning and drying unit disposed between the cassette stage and the first substrate stage, a first transfer device, and a second transfer device. The first transfer device transfers a substrate between the substrate cassette, the cleaning and drying unit, and the first substrate stage. The second transfer device transfers a substrate between the first substrate stage, the pre-treatment unit, and the plating unit.

What is claimed is:  
     
         1 . A plating apparatus for continuously plating a surface of a substrate with metal and performing its supplementary process in one housing unit, said plating apparatus comprising: 
 a cassette stage for placing a substrate cassette thereon, said substrate cassette accommodating a substrate;    a pre-treatment unit for pre-treating a surface of a substrate;    a plating unit for plating a surface of said substrate pre-treated in said pre-treatment unit;    a first substrate stage disposed between said cassette stage and said pre-treatment unit for holding a substrate placed thereon;    a cleaning and drying unit disposed between said cassette stage and said first substrate stage for cleaning a plated substrate with pure water and drying said substrate;    a first transfer device for transferring a substrate between said substrate cassette, said cleaning and drying unit, and said first substrate stage; and    a second transfer device for transferring a substrate between said first substrate stage, said pre-treatment unit, and said plating unit.    
     
     
         2 . A plating apparatus according to  claim 1 , wherein said first substrate stage comprises two substrate stages; and 
 at least one of said two substrate stages in said first substrate stage is constituted so as to place a substrate thereon and clean a substrate.    
     
     
         3 . A plating apparatus according to  claim 1 , wherein said housing unit has a partition wall for dividing said housing unit into a plating section and a clean section; 
 said plating section has said pre-treatment unit, said plating unit, said fist substrate stage, and said second transfer device therein;    said clean section has another unit therein;    said partition wall has a shutter for passing a substrate therethrough;    air can individually be supplied into and exhausted from each of said plating section and said clean section; and    the pressure of said clean section is controlled so as to be higher than the pressure of said plating section.    
     
     
         4 . A plating apparatus according to  claim 1 , wherein a container for accommodating a substrate for trial operation is disposed in said housing unit; and 
 one of said transfer devices takes out said substrate for trial operation from said container and returns said substrate for trial operation to said container.    
     
     
         5 . A plating apparatus according to  claim 4 , wherein said container for accommodating a substrate for trial operation is disposed in the vicinity of said first substrate stage; and 
 said second transfer device takes out said substrate for trial operation from said container and returns said substrate for trial operation to said container.    
     
     
         6 . A plating apparatus for continuously plating a surface of a substrate with metal and performing its supplementary process in one housing unit, said plating apparatus comprising: 
 a cassette stage for placing a substrate cassette thereon, said substrate cassette accommodating a substrate;    a pre-treatment unit for pre-treating a surface of a substrate;    a plating unit for plating a surface of said substrate pre-treated in said pre-treatment unit;    a first substrate stage disposed between said cassette stage and said pre-treatment unit for holding a substrate placed thereon;    a chemical liquid cleaning unit disposed between said cassette stage and said first substrate stage for cleaning a plated substrate with chemical liquid;    a cleaning and drying unit disposed between said cassette stage and said chemical liquid cleaning unit for cleaning a plated substrate with pure water and drying said substrate;    a second substrate stage disposed between said chemical liquid cleaning unit and said cleaning and drying unit for holding a substrate placed thereon;    a first transfer device for transferring a substrate between said substrate cassette, said cleaning and drying unit, and said second substrate stage;    a second transfer device for transferring a substrate between said first substrate stage, said pre-treatment unit, and said plating unit; and    a third transfer device for transferring a substrate between said first semiconductor stage, said chemical liquid cleaning unit, and said second substrate stage.    
     
     
         7 . A plating apparatus according to  claim 6 , wherein at least one of said first substrate stage and said second substrate stage comprises two substrate stages; and 
 at least one of said two substrate stages in said at least one of said first substrate stage and said second substrate stage is constituted so as to place a substrate thereon and clean a substrate.    
     
     
         8 . A plating apparatus according to  claim 6 , wherein said housing unit has a partition wall for dividing said housing unit into a plating section and a clean section; 
 said plating section has said pre-treatment unit, said plating unit, said fist substrate stage, and said second transfer device therein;    said clean section has another unit therein;    said partition wall has a shutter for passing a substrate therethrough;    air can individually be supplied into and exhausted from each of said plating section and said clean section; and    the pressure of said clean section is controlled so as to be higher than the pressure of said plating section.    
     
     
         9 . A plating apparatus according to  claim 6 , wherein a container for accommodating a substrate for trial operation is disposed in said housing unit; and 
 one of said transfer devices takes out said substrate for trial operation from said container and returns said substrate for trial operation to said container.    
     
     
         10 . A plating apparatus according to  claim 9 , wherein said container for accommodating a substrate for trial operation is disposed in the vicinity of said first substrate stage; and 
 said second transfer device takes out said substrate for trial operation from said container and returns said substrate for trial operation to said container.    
     
     
         11 . A processing apparatus for processing a semiconductor substrate with chemical liquid or pure water, said processing apparatus comprising: 
 an inverting mechanism for inverting a semiconductor substrate.    
     
     
         12 . A plating apparatus for plating a surface of a semiconductor substrate, said plating apparatus comprising: 
 a pre-treatment unit for pre-treating a semiconductor substrate to be plated with chemical liquid or pure water, said pre-treatment unit having an inverting mechanism for inverting said semiconductor substrate; and    a plating unit for plating a surface of said semiconductor substrate pre-treated in said pre-treatment unit.    
     
     
         13 . A plating method for continuously plating a surface of a substrate with metal and performing its supplementary process in one housing unit, said plating method comprising: 
 placing a substrate cassette accommodating a substrate on a cassette stage;    transferring said substrate in said substrate cassette to a first substrate stage by a first transfer device;    transferring said substrate on said first substrate stage to a pre-treatment unit from said first substrate stage by a second transfer device;    transferring said substrate pre-treated in said pre-treatment unit to a plating unit by said second transfer device; and    transferring said substrate plated in said plating unit to a cleaning and drying unit.    
     
     
         14 . A plating method for continuously plating a surface of a substrate with metal and performing its supplementary process in one housing unit, said plating method comprising: 
 placing a substrate cassette accommodating a substrate on a cassette stage;    transferring a substrate in said substrate cassette to a first substrate stage by a first transfer device;    transferring said substrate on said first substrate stage to a pre-treatment unit from said first substrate stage by a second transfer device;    transferring said substrate pre-treated in said pre-treatment unit to a plating unit by said second transfer device;    transferring said substrate plated in said plating unit to said first substrate stage by said second transfer device;    transferring said substrate on said first substrate stage to a chemical liquid cleaning unit from said first substrate stage by a third transfer device;    transferring said substrate cleaned with chemical liquid in said chemical liquid cleaning unit to said second substrate stage; and    transferring said substrate on said second substrate stage to a cleaning and drying unit from said second substrate stage.    
     
     
         15 . A plating unit having a plating process container, said plating process container comprising: 
 a plating container having a plating chamber therein for holding a plating solution in said plating chamber, said plating chamber having an anode at its bottom;    a plurality of plating solution supply nozzles for ejecting said plating solution toward the central portion of said plating chamber;    a regulating ring provided in the vicinity of the peripheral portion of said plating chamber;    a first plating solution discharge port for discharging said plating solution in said plating chamber from the bottom of said plating chamber; and    a second plating solution discharge port for discharging said plating solution overflowing the peripheral portion of said plating chamber.    
     
     
         16 . A plating unit according to  claim 15 , wherein said anode is held by an anode support detachably mounted on said plating container.  
     
     
         17 . A plating unit comprising: 
 a rotatable housing having a substrate holding member provided at the lower end thereof, said substrate holding member projecting radially inwardly and abutting a peripheral portion of a substrate to hold said substrate; and    a pressing member disposed in said housing for pressing the peripheral portion of said substrate against said substrate holding member to hold said substrate, said pressing member being rotatable together with said housing.    
     
     
         18 . A plating unit according to  claim 17 , wherein a plurality of air vent holes are formed in said substrate holding member provided at the lower end of said housing.  
     
     
         19 . A plating unit according to  claim 17 , wherein said pressing member comprises a chuck mechanism disposed at the peripheral portion thereof for detachably holding said substrate on the lower surface of said pressing member.  
     
     
         20 . A plating unit according to  claim 17 , wherein a contact for a cathode electrode is disposed on said substrate holding member of said housing; 
 a feeding contact is disposed at the outer circumferential side of said pressing member;    said contact for said cathode electrode is energized when a substrate is held by said substrate holding member and said pressing member; and    said feeding contact energizes said contact for said cathode electrode when said pressing member is lowered to bring said contact for said cathode electrode into contact with said feeding contact.    
     
     
         21 . A plating unit comprising: 
 a head having a rotatable housing;    a vertically movable pressing member housed in said housing;    a substrate holding member disposed in said housing for holding a peripheral portion of a substrate between said pressing member ring and said substrate holding member; and    a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has a liquid level for plating which is higher than a position of a substrate held by said housing, and a liquid level for transferring the substrate which is lower than a position of a substrate held by said housing.    
     
     
         22 . A plating unit comprising: 
 a head having a rotatable housing;    a vertically movable pressing ring housed in said housing;    a substrate holding member disposed in said housing for holding a peripheral portion of a substrate between said pressing ring and said substrate holding member; and    a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has a liquid level for plating which is higher than a position of a substrate held by said housing, and a liquid level for transferring the substrate which is lower than a position of a substrate held by said housing.    
     
     
         23 . A plating unit comprising: 
 a head having a rotatable housing;    a clamp mechanism with a swing link housed in said housing, said swing link being swingable in the horizontal direction;    a substrate holding member disposed in said housing for holding a peripheral portion of a substrate between said swing link and said substrate holding member; and    a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has a liquid level for plating which is higher than a position of a substrate held by said housing, and a liquid level for transferring the substrate which is lower than a position of a substrate held by said housing.    
     
     
         24 . A plating unit comprising: 
 a head having a rotatable housing, said housing having an elastic member therein elastically deformable by pneumatic pressure;    a substrate holding member disposed in said housing for holding a peripheral portion of a substrate between said elastic member and said substrate holding member; and    a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has a liquid level for plating which is higher than a position of a substrate held by said housing, and a liquid level for transferring the substrate which is lower than a position of a substrate held by said housing.    
     
     
         25 . A plating unit comprising: 
 a head having a rotatable housing, said housing having a substrate holding member for holding a substrate; and    a plating process container disposed below said head for holding a plating solution so that the liquid surface of said plating solution has at least two levels.    
     
     
         26 . A plating unit comprising: 
 a head having a substrate holding member for holding a substrate;    a plating process container disposed below said head for holding a plating solution; and    a plating solution suction mechanism for removing a plating solution remaining at a portion abutting on the peripheral portion of a substrate at the inner circumferential end of said substrate holding member.    
     
     
         27 . A plating apparatus for continuously plating a surface of a substrate with metal and performing its supplementary process in one housing unit, said plating apparatus comprising: 
 a cassette stage for placing a substrate cassette thereon, said substrate cassette accommodating a substrate;    a pre-plating unit for pre-plating a surface of a substrate;    a plating unit for plating a surface of said substrate pre-plated in said pre-plating unit;    a first substrate stage disposed between said cassette stage and said pre-plating unit for holding a substrate placed thereon;    a cleaning and drying unit disposed between said cassette stage and said first substrate stage for cleaning a plated substrate with pure water and then drying said substrate;    a first transfer device for transferring a substrate between said substrate cassette, said cleaning and drying unit, and said first substrate stage; and    a second transfer device for transferring a substrate between said first substrate stage, said pre-plating unit, and said plating unit.    
     
     
         28 . A plating apparatus for continuously plating a surface of a substrate with metal and performing its supplementary process in one housing unit, said plating apparatus comprising: 
 a cassette stage for placing a substrate cassette thereon, said substrate cassette accommodating a substrate;    a pre-plating unit for pre-plating a surface of a substrate;    a plating unit for plating a surface of said substrate pre-plated in said pre-plating unit;    a first substrate stage disposed between said cassette stage and said pre-plating unit for holding a substrate placed thereon;    a chemical liquid cleaning unit disposed between said cassette stage and said first substrate stage for cleaning a plated substrate with chemical liquid;    a cleaning and drying unit disposed between said cassette stage and said chemical liquid cleaning unit for cleaning a plated substrate with pure water and then drying said substrate;    a second substrate stage disposed between said chemical liquid cleaning unit and said cleaning and drying unit for holding a substrate placed thereon;    a first transfer device for transferring a substrate between said substrate cassette, said cleaning and drying unit, and said second substrate stage;    a second transfer device for transferring a substrate between said first substrate stage, said pre-plating unit, and said plating unit; and    a third transfer device for transferring a substrate between said first semiconductor stage, said chemical liquid cleaning unit, and said second substrate stage.    
     
     
         29 . A plating apparatus for continuously plating a surface of a substrate with metal and performing its supplementary process in one housing unit, said plating apparatus comprising: 
 a cassette stage for placing a substrate cassette thereon, said substrate cassette accommodating a substrate;    a pre-treatment unit for pre-treating a surface of a substrate;    a plating unit for plating a surface of said substrate pre-treated in said pre-treatment unit;    a first substrate stage for holding a substrate placed thereon;    a cleaning and drying unit for cleaning a plated substrate with pure water and drying said substrate;    a first transfer device for transferring a substrate; and    a second transfer device for transferring a substrate;    wherein said housing unit has a partition wall for dividing said housing unit into a plating section and a clean section;    said plating section has at least said pre-treatment unit, said plating unit, said fist substrate stage, and said second transfer device therein;    said clean section has another unit therein; and    the pressure of said clean section is controlled so as to be higher than the pressure of said plating section.    
     
     
         30 . A plating apparatus according to  claim 29 , wherein said first substrate stage comprises two substrate stages; and 
 at least one of said two substrate stages in said first substrate stage is constituted so as to place a substrate thereon and clean a substrate.    
     
     
         31 . A plating apparatus according to  claim 29 , wherein a container for accommodating a substrate for trial operation is disposed in said housing unit; and 
 one of said transfer devices takes out said substrate for trial operation from said container and returns said substrate for trial operation to said container.