Method for manufacturing very low roughness electrodeposited copper foil and electrodeposited copper foil manufactured thereby

Abstract

The present invention relates to a method for manufacturing a low roughness electrodeposited copper foil, and an electrodeposited copper foil manufactured thereby, and uses an electrolyte which basically consists of a sulfuric acid, a copper ion and a chloride ion is adapted with an additive which consists of a HEC (Hydroxyethyl Cellulose) of 0.05˜50 ppm, a SPS (bis(sodiumsulfopropyl)disulfide) of 0.05˜20 ppm, and a gelatin of 0.1˜100 ppm. The present invention is adapted to manufacture a low roughness electrodeposited copper foil using a conventional copper foil manufacture facility and the electrodeposited copper foil according to the present invention is adapted as a material for a copper clad laminate for a printed circuit substrate and an electrode material for a lithium ion battery.

We claim:  
     
         1 . In a method for manufacturing an electrodeposited copper foil in which a rotating drum and an anode plate which is formed of a curve distanced from the outer surface of the drum by a certain distance are drowned in an electrolyte, said electrolyte consists of a sulfuric acid, copper ion and chloride ion, and the electrodeposited copper foil is deposited on the surface of the drum as a negative current is applied to the drum, and a positive current is applied to the anode plate, a method for manufacturing an electrodeposited copper foil which is characterized in that an additive which consists of a gelatin of 0.1˜100 ppm, a HEC(Hydroxyethyl Cellulose) of 0.05 ppm˜50 ppm, and a SPS(bis(sodiumsulfopropyl)disulfide) of 0.05˜20 ppm is added to the electrolyte.  
     
     
         2 . The method of  claim 1 , wherein the amount of the addition of the gelatin is 2˜5 ppm.  
     
     
         3 . The method of  claim 1 , wherein the amount of the addition of the HEC is 1˜3 ppm.  
     
     
         4 . The method of  claim 1 , wherein the amount of the addition of the SPS is 0.5˜3 ppm.  
     
     
         5 . The method of one among claims  1  through  4 , wherein a roughness of a matte side of the electrodeposited copper foil is larger than a roughness of a shiny side.  
     
     
         6 . The method of one among claims  1  through  4 , further comprising a post-treatment process.  
     
     
         7 . The method of  claim 6 , wherein said post-treatment process is formed of one or more than one selected from the steps of: 
 a nodule process for forming a nodule on one side or both sides of the electrodeposited copper foil for increasing an adhesion with a resin;    a barrier process for preventing a copper from being diffused into a resin layer;    a corrosion resisting process for preventing an oxidation of the electrodeposited copper foil; and    a silane coupling agent process for enhancing an adhesion reliability with the resin.    
     
     
         8 . The method of either  claim 1  or  claim 2 , wherein a molecular weight of the gelatin is above 10000.  
     
     
         9 . The method of  claim 1 , wherein said electrolyte is formed of a sulfuric acid of 50˜200 g/l, a copper ion of 30˜150 g/l, and a chloride ion of 200 mg/l.  
     
     
         10 . The method of  claim 9 , wherein a temperature of the electrolyte is 20˜80° C.  
     
     
         11 . The method of  claim 9 , wherein a current density of the electrolyte is 20˜150 A/dm 2 .  
     
     
         12 . A low roughness electrodeposited copper foil manufactured by one method selected from the claims  1  through  4 .  
     
     
         13 . The foil of  claim 12 , wherein a roughness of a matte side of the electrodeposited copper foil is larger than a roughness of a shiny side.  
     
     
         14 . The foil of  claim 12 , further comprising a post-treatment process.  
     
     
         15 . The foil of  claim 14 , wherein said post-treatment process is formed of one or more than one selected from the steps of: 
 a nodule process for forming a nodule on one side or both sides of the electrodeposited copper foil for increasing an adhesion with a resin;    a barrier process for preventing a copper from being diffused into a resin layer;    a corrosion resisting process for preventing an oxidation of the electrodeposited copper foil; and    a silane coupling agent process for enhancing an adhesion reliability with the resin.