US2004107807A1PendingUtilityA1
Ultramicrotome device
Priority: Dec 19, 1997Filed: Aug 22, 2003Published: Jun 10, 2004
Est. expiryDec 19, 2017(expired)· nominal 20-yr term from priority
Inventors:Daniel Studer
G01N 1/06Y10T83/04G01N 2001/063Y10T83/97Y10T83/6508G01N 1/36B26D 7/086Y10T83/0538
42
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Claims
Abstract
In a process for cutting sections from a probe for microscopic analysis, an ultramicrotome device is used having a blade with a cutting edge, the cutting edge extending at least approximately in a first direction. The process includes the steps of: vibrating said blade in the first direction; and moving the blade relative to the probe to be cut in a second direction, the second direction being perpendicular to the first direction. This eliminates, or at least strongly reduces, compression of the cut sections.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1 . A process for cutting sections from a probe for microscopic analysis, by using an ultramicrotome device having a blade with a cutting edge, the cutting edge in a non-vibrated position extending at least approximately in a first direction, the process comprising the steps of: vibrating the blade in the first direction; and moving the blade relative to the probe to be cut in a second direction, the second direction being perpendicular to the first direction.
2 . The process according to claim 1 , wherein the probe is cut in sections having a thickness of about 10 to about 100 nm.
3 . The process according to claim 1 , wherein the blade is vibrated with a maximum amplitude of the vibration of the blade of about 1 μm.
4 . The process according to claim 1 , wherein force is applied to a block of the ultramicrotome device, the block holding the blade.
5 . The process according to claim 1 , wherein the probe is vibrated in a third direction perpendicular to the first and the second direction.
6 . The process according to claim 5 , wherein the blade is vibrated in a first frequency and the probe is vibrated in a second frequency, the second frequency being twice the first frequency.
7 . The process according to claim 1 , wherein the probe is vibrated in a third direction at least approximately parallel to the first direction.
8 . The process according to claim 7 , wherein the probe and the blade are vibrated, such that when the blade reaches its reversal points, the probe is still moving and vice versa.
9 . The process according to claim 8 , wherein the probe and the blade are vibrated at the same frequency, but in a different phase.
10 . The process according to claim 7 , wherein the blade is moved relative to the probe in the second direction with a substantially constant cutting speed over a distance larger than a cross-sectional dimension of the probe in the third direction.
11 . The process according to claim 1 , wherein in the third direction, an amplitude b o of vibration is used with
b o ≧v c /2ω,
wherein ω is the frequency in radians of the first vibrator and v c is the cutting speed in the third direction.
12 . The process according to claim 1 , wherein in the first direction, an amplitude a o of vibration is used with
a o ≧10 v c /ω,
wherein ω is the frequency in radians of the first vibrator and v c is the cutting speed in the third direction.
13 . The process according to claim 1 , wherein a diamond blade is used.
14 . The process according to claim 1 , wherein the blade is moved relative to the probe in the second direction with a substantially constant cutting speed.Join the waitlist — get patent alerts
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