Self-adhesive dental materials
Abstract
The invention relates to a composition which is self-adhesive to the hard tooth tissue, comprising: (A) 5 to 75 percent by weight of one or more mono or higher functional ethylenically unsaturated compounds which additionally have an acid functional group, wherein one of said compounds has a P—OH group, for instance a phosphoric, phosphonic or phosphinic acid group; (B) 2 to 50 percent by weight of one or more mono or higher functional ethylenically unsaturated compounds without any acid functional group; (C) 22.8 to 85 percent by weight of filling material(s), comprising at least one filling material that may react with component (A) in the sense of causing a ion exchange, neutralization, salt formation and/or chelate formation reaction; (D) 0.1 to 8 percent by weight of one or more initiators and optionally activators; (E) 0.1 to 20 percent by weight of further additives, for example, modifiers, wherein the weight ration in % of component (A) relative to component (B) ranges from 21 to 90:10 to 79.
Claims
exact text as granted — not AI-modified1 . A self-adhesive dental material comprising:
(A) from 5 to 75% by weight of one or more mono- or polyfunctional ethylenically unsaturated compounds which additionally possess at least one acid-functional group, at least one of the compounds containing at least one P—OH group, (B) from 2 to 50% by weight of one or more mono- or polyfunctional ethylenically unsaturated compounds without an acid-functional group, (C) from 22.8 to 85% by weight of filler(s), including at least one filler capable of reacting with component (A) in an ion exchange, neutralization, acid-forming and/or chelate-forming reaction, (D) from 0.1 to 8% by weight of one or more initiators and, if desired, activators, (E) from 0.1 to 20% by weight of additional additives and/or modifiers, the weight ratio in % of component (A) to component (B) being in the range from 21 to 90:10 to 79.
2 . The self-adhesive dental material of claim 1 , wherein the monomer in component (A) having at least one P-OH group is present in a concentration of at least 5% by weight based on the constituents (A) to (E).
3 . The self-adhesive dental material of one of the above claims, wherein the polymerizable groups of component (A) comprise acrylic, methacrylic, vinyl and/or styryl groups and the acid groups are selected from carboxylic acid residues, acid residues of phosphorus, sulfur and/or of boron.
4 . The self-adhesive dental material of one of the above claims, wherein the polymerizable groups of component (B) are acrylic, methacrylic, vinyl and/or styryl groups.
5 . The self-adhesive dental material of one of the above claims, wherein component (C) comprises fillers which are inert toward the acid functions of component (A).
6 . The self-adhesive dental material of one of the above claims, wherein component (D) is selected from photoinitiators and/or redox initiator systems.
7 . The self-adhesive dental material of one of the above claims, wherein component (D) comprises a redox initiator system comprising barbituric acid or thiobarbituric acid and/or a barbituric or thiobarbituric acid derivative, a peroxodisulfate compound and/or a peroxodiphosphate compound, a sulfinic acid compound, and a copper compound.
8 . The self-adhesive dental material of one of the above claims, wherein component (E) is selected from plasticizers, organic and inorganic pigments and/or dyes, stabilizers and/or heavy metal scavengers, thixotropic assistants, ion donor substances, bactericidal or antibiotic substances.
9 . The use of a self-adhesive dental material of one of claims 1 to 8 as filling material, fissure sealant, cement or core buildup material.
10 . The use of a composition as described in one of claims 1 to 8 to produce a self-adhesive dental material for use in a process comprising the steps of a) carrying out a preparation in hard dental tissue, b) directly applying the self-adhesive dental material into the preparation, c) curing the self-adhesive dental material, in which no treatment steps are carried out before step b), especially not: conditioning, etching, priming, bonding.Join the waitlist — get patent alerts
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