Heat-dissipating device

Abstract

The invention discloses an annular heat-dissipating device formed by a plurality of fins combined together, all of which are arranged around a base, wherein one side of each of the plurality of fins is coupled to the base, respectively. The heat-dissipating device of the invention can greatly increase the heat-dissipating area so as to effectively dissipate heat generated from the electronic elements to the outside.

What is claimed is:  
     
         1 . A heat-dissipating device comprising: 
 a base; and    a plurality of fins mounted around a periphery of the base,    wherein a first end of each of the plurality of fins is coupled to the base after the base is formed.    
     
     
         2 . The heat-dissipating device of  claim 1 , wherein the fins are formed as rectangular, triangular, trapezoid, polygonal or irregular shapes.  
     
     
         3 . The heat-dissipating device of  claim 1 , wherein the plurality of fins are made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy or a mixture thereof or other material with high thermal conductivity.  
     
     
         4 . The heat-dissipating device of  claim 1 , wherein the plurality of fins are coupled to the base by welding, adhesion, riveting, engaging or fastening.  
     
     
         5 . The heat-dissipating device of  claim 1 , wherein a second end of each of the plurality of fins is connected to each other so as to strengthen the heat-dissipating device.  
     
     
         6 . The heat-dissipating device of  claim 5 , wherein the second end of each of the plurality of fins is provided with a flange that is formed with at least a concave portion and at least an engagement portion, which are respectively fastened to an engagement portion and a concave portion of another fin.  
     
     
         7 . The heat-dissipating device of  claim 5 , wherein the second end of each of the fin is provided with at least a concave portion and at least an engagement portion, which are respectively fastened to an engagement portion and a concave portion of another fin.  
     
     
         8 . The heat-dissipating device of  claim 1 , further comprising a plurality of bridge portions respectively connected between corresponding ends of each two fins.  
     
     
         9 . The heat-dissipating device of  claim 8 , wherein the bridge portions and the fins are formed integrally as a unit.  
     
     
         10 . The heat-dissipating device of  claim 1 , further comprising at least a rim portion mounted on second ends of the plurality of fins to strengthen the heat-dissipating device.  
     
     
         11 . The heat-dissipating device of  claim 1 , wherein the base is a pillar base with a circular, rectangular, triangular, trapezoid, polygonal or irregular shape.  
     
     
         12 . The heat-dissipating device of  claim 1 , wherein the base is made from aluminum, copper, magnesium, an aluminum alloy, a copper alloy or a mixture thereof or a thermal conductivity material with high thermal conductivity.