Wafer electroplating apparatus and method

Abstract

A wafer electroplating apparatus and method, comprising a wafer turning assembly, a vertical movement assembly, a wafer tilting assembly, and a frame. The wafer turning assembly has a turning shaft and a clasp for holding a wafer. The wafer tilting assembly has a tilting table being driven by a driving system, e.g. a cylinder, carrying an electroplating unit and wafer turning assembly. Thus the clasp holding a wafer and the electroplating unit are simultaneously inclined at preset angle against the horizontal plane, allowing for a large inclination angle. Therefore, gas bubbles generated during electroplating readily escape, and quality of electroplating is improved.

1 . A wafer electroplating method, comprising the steps of: 
 A. inserting a wafer into a clasp;    B. holding said wafer in said clasp;    C. lowering said wafer to a location of electroplating;    D. inclining of a tilting table to incline said wafer;    E. slowly turning said wafer and electroplating;    F. completing of electroplating;    G. raising said wafer from said location of electroplating;    H. reversing inclination of said tilting table;    I. fast turning of said wafer for drying;    J. stopping of said wafer;    K. opening said clasp; and    L. removing said wafer.    
     
     
         2 . A wafer electroplating apparatus, comprising: 
 a frame, having a main body, on which a piping system and a control unit are installed;    a wafer turning assembly, having a casing and a lower end, to which a clasp for holding a wafer is attached;    a vertical movement assembly, mounted on a side of said wafer turning assembly, having a vertical column, on which a vertical driving device is installed, driving said wafer turning device in a vertical movement; and    a wafer tilting assembly, having two seats, which are fastened on two opposite sides of said main body, with a tilting table inserted between and held by said two seats, said tilting table being inclined at a tilting angle, as driven by a driving system via a connecting rod, said tilting table carrying said vertical shifting assembly and an electroplating unit;    wherein a suitable value of said tilting angle is set using said driving system, with said clasp and said electroplating unit being simultaneously tilted and, by tilting to any angles, the clearance between the two is kept constant, thereby not hindering fluid patent be changed. The tilting angle of the wafer can be tilted to a larger angles. Gas bubbles generated during electroplating of said wafer is readily to escape from surface.    
     
     
         3 . The wafer electroplating apparatus according to  claim 2 , wherein said wafer turning assembly further comprises a gas inlet, a turning shaft, electrical connectors and a driving unit, with a gas pressure cylinder being installed inside said turning shaft, holding said clasp.  
     
     
         4 . The wafer electroplating apparatus according to  claim 2 , wherein said clasp has a cathode at a suitable position and a liquid blocking ring.