Process for fabricating, and light emitting device resulting from, a homogenously mixed powder/pelletized compound

Abstract

The present invention comprises a process of mixing a luminous substance in powder form to a transferable grade molding compound in a pelletized or powder form, such as a clear epoxy, to derive a homogeneous mixture that can be pressed and sintered into solid pellets. The solid pellets are further processed so as to permit their deposition on and around a light emitting semiconductor driver so as to obtain a white light emitting semiconductor device. This white light emitting device can be used in a variety of lighting applications.

What is claimed is:  
     
         1 . A light emitting device package, comprising: 
 a semiconductor junction operable to emit light when biased;    an homogenous composition deposited on the semiconductor junction adapted to filter and combine predetermined wavelengths of light from the semiconductor surface.    
     
     
         2 . The light emitting device package of  claim 1 , the homogenous composition further comprising a sintered and pelletized mixture of a molding compound and a luminous substance.  
     
     
         3 . The light emitting device package of  claim 2 , wherein the molding compound is in pelletized form prior to sintering and pelletization.  
     
     
         4 . The light emitting device package of  claim 3 , the pelletized molding compound further comprising a clear epoxy.  
     
     
         5 . The light emitting device package of  claim 2 , wherein the luminous substance is in powder form prior to sintering and pelletization.  
     
     
         6 . The light emitting device package of  claim 5 , wherein the luminous powder is less than or equal to 5 microns in size prior to sintering and pelletization.  
     
     
         7 . The light emitting device package of  claim 6 , wherein the luminous powder is spherical or flake-like in shape prior to sintering and pelletization.  
     
     
         8 . The light emitting device package of  claim 2 , the molding compound further comprising a clear epoxy.  
     
     
         9 . The light emitting device package of  claim 8 , the clear epoxy further incorporating a thixotorpic agent to thicken the epoxy casting resin.  
     
     
         10 . The light emitting device package of  claim 2 , the luminous substance further comprising a Cerium doped garnet.  
     
     
         11 . The light emitting device package of  claim 2 , the luminous substance further comprising YAG:Ce.  
     
     
         12 . The light emitting device package of  claim 2 , the luminous substance having admixed a predetermined amount of mineral diffuser so as to optimize the luminous pattern of the composition.  
     
     
         13 . The light emitting device package of  claim 12 , the mineral diffuser comprising CaF2.  
     
     
         14 . The light emitting device package of  claim 2 , the molding compound and luminous substance composition further including a processing adjuvant.  
     
     
         15 . The light emitting device package of  claim 2 , further comprising a predetermined chromaticity of light based on the luminous powder's percentage by weight of the composition and micron size, before admixing and pelletizing.  
     
     
         16 . A method of fabricating a light emitting device, comprising: 
 admixing a luminous substance to a transferable grade molding compound to derive a homogeneous mixture;    pressing and sintering the homogeneous mixture into solid pellets;    processing the solid pellets for application on a semiconductor surface; and    depositing the processed solid pellets on the semiconductor surface.    
     
     
         17 . The method of fabricating a light emitting device of  claim 16  wherein the molding compound is in a pelletized form prior to pressing and sintering the homogeneous mixture into solid pellets.  
     
     
         18 . The method of fabricating a light emitting device of  claim 16  wherein the pelletized molding compound further comprises a clear epoxy.  
     
     
         19 . The method of fabricating a light emitting device of  claim 16  wherein the molding compound is in a powdered form prior to pressing and sintering the homogeneous mixture into solid pellets.  
     
     
         20 . The method of fabricating a light emitting device of  claim 19  wherein the powdered molding compound further comprises a clear epoxy.  
     
     
         21 . The method of fabricating a light emitting device of  claim 16  wherein the luminous substance is in powdered form prior to pressing and sintering the homogeneous mixture into solid pellets.  
     
     
         22 . The method of fabricating a light emitting device of  claim 16  wherein the light emitted by the light emitting device comprises a white light.  
     
     
         23 . A method of fabricating a light emitting chip comprising depositing an admixed substance of epoxy and a luminous substance around an LED chip located on a copper lead frame.