Lapping method and lapping machine

Abstract

An object such as an electronic device can be favorably lapped by a method composed of preparing a lapping machine having a longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board and a supporting means arranged adjacently to the lapping board; placing the object on the lapping board via abrasive grains and further on the supporting means; and activating the ultrasonic oscillation-applying device to apply elliptical vibration to the lapping board whereby the object is caused to rotate on an axis thereof and lapped.

What is claimed is:  
     
         1 . A method for lapping an object which comprises preparing a lapping machine comprising at least one longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board and a supporting means arranged adjacently to the lapping board; placing the object on the lapping board via abrasive grains and further on the supporting means; and activating the ultrasonic oscillation-applying device to apply elliptical vibration to the lapping board whereby the object is caused to rotate on an axis thereof and lapped.  
     
     
         2 . The method of  claim 1 , wherein the rotation of the object is guided by a rotation-guiding means attached to the lapping machine.  
     
     
         3 . The method of  claim 1 , wherein the supporting means is a longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies single-mode vibration to the lapping board and the object is placed on the supporting means via abrasive grains.  
     
     
         4 . The method of  claim 1 , wherein the elliptical vibration is a vibration of progressive wave travelling along the longitudinal or circular lapping board.  
     
     
         5 . The method of  claim 1 , wherein the elliptical vibration is a vibration of standing wave occurring along the longitudinal or circular lapping board.  
     
     
         6 . A method for lapping an object which comprises preparing a lapping machine comprising a pair of longitudinal lapping boards equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board arranged in parallel; placing the object on the lapping boards via abrasive grains; and activating the ultrasonic oscillation-applying device to apply elliptical vibration to the lapping boards whereby the object is caused to rotate on an axis thereof and lapped.  
     
     
         7 . The method of  claim 6 , wherein the rotation of the object is guided by a rotation-guiding means attached to the lapping machine.  
     
     
         8 . The method of  claim 6 , wherein an auxiliary lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical or single-mode vibration to the auxiliary lapping board is arranged between the pair of the lapping boards, and the object is further lapped on the auxiliary lapping board.  
     
     
         9 . The method of  claim 6 , wherein the elliptical vibration is a vibration of progressive wave travelling along the longitudinal lapping board.  
     
     
         10 . The method of  claim 6 , wherein the elliptical vibration is a vibration of standing wave occurring along the longitudinal lapping board.  
     
     
         11 . A method for lapping an object which comprises preparing a lapping machine comprising a pair of circular lapping boards equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board arranged coaxially; placing the object on the lapping boards via abrasive grains; and activating the ultrasonic oscillation-applying device to apply elliptical vibration to the lapping boards whereby the object is caused to rotate on an axis thereof and lapped.  
     
     
         12 . The method of  claim 11 , wherein the object is further moved along the circular lapping boards.  
     
     
         13 . The method of  claim 11 , wherein the elliptical vibration is a vibration of progressive wave travelling along the circular lapping board.  
     
     
         14 . The method of  claim 11 , wherein the elliptical vibration is a vibration of standing wave occurring along the circular lapping board.  
     
     
         15 . A lapping machine comprising at least one longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board and a supporting means arranged adjacently to the lapping board.  
     
     
         16 . The lapping machine of  claim 15  which further comprises means for guiding an object to be lapped.  
     
     
         17 . The lapping machine of  claim 15 , wherein the supporting means is a longitudinal or circular lapping board equipped with a ultrasonic oscillation-applying device which applies single-mode vibration to the lapping board.  
     
     
         18 . A lapping machine comprising a pair of longitudinal lapping boards equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board arranged in parallel.  
     
     
         19 . The lapping machine of  claim 18  which further comprises means for guiding an object to be lapped.  
     
     
         20 . The lapping machine of  claim 18  which further comprises an auxiliary lapping board equipped with a ultrasonic oscillation-applying device which applies elliptical or single-mode vibration to the auxiliary lapping board arranged between the pair of the lapping boards.  
     
     
         21 . A lapping machine comprising a pair of circular lapping boards equipped with a ultrasonic oscillation-applying device which applies elliptical vibration to the lapping board arranged coaxially.  
     
     
         22 . The lapping machine of  claim 21  which further comprises means for guiding an object to be lapped.