US2004158981A1PendingUtilityA1
Techniques for connecting a lead to a conductor
Est. expiryJun 29, 2021(expired)· nominal 20-yr term from priority
Y10T29/49169B23K 1/0008B23K 2101/32H01R 4/182Y10T29/49174Y10T29/49181H01R 4/184Y10T29/49179
42
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Claims
Abstract
A connector device is shaped or formed to include bendable flaps for securing one or more conductors when the flaps are crimped. Typically, the connector device includes a base having an external surface that is eventually affixed to a complementary shaped surface. Accordingly, a conductor can be attached to the complementary shaped surface. For example, one or more conductors can be crimped via the connector device, which is thereafter attached to a complementary surface.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A method of producing a device for securing conductors, the method comprising the steps of:
shaping a connector device to include bendable flaps for securing a conductor; and forming the connector device to include an external surface that is eventually affixed to a substantially complementary shaped surface, at least a portion of the conductor secured in the connector device also being affixed to the substantially complementary shaped surface, the conductor being bent near the connector device in a manner so that at least a portion of the conductor and the external surface of the connector device lie in a common contour.
2 . A method as in claim 1 , wherein the external surface is substantially flat and at least a portion of the conductor and external surface lie in a common plane.
3 . A method as in claim 1 further comprising the steps of:
providing a strip of flat metal; and
bending the strip of flat metal to form the bendable flaps of a connector device, a portion of the strip of flat metal forming the external surface that is eventually attached to the complementary surface.
4 . A method as in claim 1 , wherein the connector device includes two or more sets of bendable flaps.
5 . A method as in claim 1 , wherein the connector device is electrically conductive.
6 . A method as in claim 1 , wherein the external surface of the connector device is soldered to a complementary shaped surface.
7 . A method as in claim 1 , wherein a lead is crimped to the conductor via the connector device.
8 . A method as in claim 1 further comprising the step of:
shaping the connector device to include a tongue for attaching a lead wire.
9 . A method as in claim 8 , wherein a lead wire can be removably attached to the tongue.
10 . A method as in claim 9 , wherein the tongue is disposed above a corresponding surface to which the connector device is attached.
11 . A method of attaching conductors comprising the steps of:
providing a connector device having bendable flaps for securing a conductor strip when the flaps are crimped, the connector device including an external surface for attachment to a substantially complementary shaped surface; crimping at least a portion of the conductor strip to the connector device by bending the flaps; and attaching the connector device and at least a portion of the conductor strip to the substantially complementary surface, the conductor being bent near the connector device in a manner so that at least a portion of the conductor and the external surface of the connector device lie in a common contour.
12 . A method as in claim 11 , wherein the step of crimping further comprises:
bending the set of flaps of the connector device inwards towards each other to secure a lead wire to the conductor strip.
13 . A method as in claim 11 , wherein the connector device is crimped around a lengthwise portion of the conductor strip to attach a distal end of a lead wire to the conductor strip.
14 . A method as in claim 11 , wherein the connector device is electrically conductive.
15 . A method as in claim 11 further comprising the steps of:
disposing a lead wire above the conductor strip and thereafter crimping the flaps of the connector device to attach the lead wire to the conductor strip; and
bending a portion of the conductor strip extending through the connector device such that at least a portion of the conductor strip lies in a common plane with the external surface of the connector device.
16 . A method as in claim 15 , wherein the step of bending a portion of the conductor strip includes applying a force on a portion of the conductor strip extending beyond an edge of the connector device.
17 . A method as in claim 11 , wherein the conductor strip includes a braided wire.
18 . A method as in claim 11 , wherein the conductor strip comprises a braided wire with a solder core.
19 . A method as in claim 11 further comprising the steps of:
contacting the external surface of the connector device to the complementary shaped surface; and
applying heat to the connector device for soldering the connector device to the complementary shaped surface.
20 . A method as in claim 19 , wherein the complementary shaped surface is a layer of glass.
21 . A method as in claim 11 further comprising the step of:
applying heat to the conductor strip and connector device for attachment to glass.
22 . A method as in claim 11 further comprising the step of:
bending the flaps of the connector device to crimp a lead wire to a braid of wire.
23 . A method as in claim 22 further comprising the steps of:
heating the braid of wire; and
applying solder to the braid of wire.
24 . A method as in claim 11 further comprising the step of:
attaching individual solder masses along the conductor strip.
25 . A method of forming an assembly comprising:
providing a conductor; securing a connector device to the conductor by crimping bendable flaps extending from the connector device, the connector device having an external surface; and bending the conductor near the connector device in a manner so that at least a portion of the conductor and the external surface of the connector device lie in a common contour for attaching to a surface.Cited by (0)
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