US2004158981A1PendingUtilityA1

Techniques for connecting a lead to a conductor

42
Assignee: ANTAYA TECHNOLOGIES CORPPriority: Jun 29, 2001Filed: Feb 18, 2004Published: Aug 19, 2004
Est. expiryJun 29, 2021(expired)· nominal 20-yr term from priority
Y10T29/49169B23K 1/0008B23K 2101/32H01R 4/182Y10T29/49174Y10T29/49181H01R 4/184Y10T29/49179
42
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Claims

Abstract

A connector device is shaped or formed to include bendable flaps for securing one or more conductors when the flaps are crimped. Typically, the connector device includes a base having an external surface that is eventually affixed to a complementary shaped surface. Accordingly, a conductor can be attached to the complementary shaped surface. For example, one or more conductors can be crimped via the connector device, which is thereafter attached to a complementary surface.

Claims

exact text as granted — not AI-modified
What is claimed:  
     
         1 . A method of producing a device for securing conductors, the method comprising the steps of: 
 shaping a connector device to include bendable flaps for securing a conductor; and    forming the connector device to include an external surface that is eventually affixed to a substantially complementary shaped surface, at least a portion of the conductor secured in the connector device also being affixed to the substantially complementary shaped surface, the conductor being bent near the connector device in a manner so that at least a portion of the conductor and the external surface of the connector device lie in a common contour.    
     
     
         2 . A method as in  claim 1 , wherein the external surface is substantially flat and at least a portion of the conductor and external surface lie in a common plane.  
     
     
         3 . A method as in  claim 1  further comprising the steps of: 
 providing a strip of flat metal; and  
 bending the strip of flat metal to form the bendable flaps of a connector device, a portion of the strip of flat metal forming the external surface that is eventually attached to the complementary surface.  
 
     
     
         4 . A method as in  claim 1 , wherein the connector device includes two or more sets of bendable flaps.  
     
     
         5 . A method as in  claim 1 , wherein the connector device is electrically conductive.  
     
     
         6 . A method as in  claim 1 , wherein the external surface of the connector device is soldered to a complementary shaped surface.  
     
     
         7 . A method as in  claim 1 , wherein a lead is crimped to the conductor via the connector device.  
     
     
         8 . A method as in  claim 1  further comprising the step of: 
 shaping the connector device to include a tongue for attaching a lead wire.  
 
     
     
         9 . A method as in  claim 8 , wherein a lead wire can be removably attached to the tongue.  
     
     
         10 . A method as in  claim 9 , wherein the tongue is disposed above a corresponding surface to which the connector device is attached.  
     
     
         11 . A method of attaching conductors comprising the steps of: 
 providing a connector device having bendable flaps for securing a conductor strip when the flaps are crimped, the connector device including an external surface for attachment to a substantially complementary shaped surface;    crimping at least a portion of the conductor strip to the connector device by bending the flaps; and    attaching the connector device and at least a portion of the conductor strip to the substantially complementary surface, the conductor being bent near the connector device in a manner so that at least a portion of the conductor and the external surface of the connector device lie in a common contour.    
     
     
         12 . A method as in  claim 11 , wherein the step of crimping further comprises: 
 bending the set of flaps of the connector device inwards towards each other to secure a lead wire to the conductor strip.    
     
     
         13 . A method as in  claim 11 , wherein the connector device is crimped around a lengthwise portion of the conductor strip to attach a distal end of a lead wire to the conductor strip.  
     
     
         14 . A method as in  claim 11 , wherein the connector device is electrically conductive.  
     
     
         15 . A method as in  claim 11  further comprising the steps of: 
 disposing a lead wire above the conductor strip and thereafter crimping the flaps of the connector device to attach the lead wire to the conductor strip; and  
 bending a portion of the conductor strip extending through the connector device such that at least a portion of the conductor strip lies in a common plane with the external surface of the connector device.  
 
     
     
         16 . A method as in  claim 15 , wherein the step of bending a portion of the conductor strip includes applying a force on a portion of the conductor strip extending beyond an edge of the connector device.  
     
     
         17 . A method as in  claim 11 , wherein the conductor strip includes a braided wire.  
     
     
         18 . A method as in  claim 11 , wherein the conductor strip comprises a braided wire with a solder core.  
     
     
         19 . A method as in  claim 11  further comprising the steps of: 
 contacting the external surface of the connector device to the complementary shaped surface; and  
 applying heat to the connector device for soldering the connector device to the complementary shaped surface.  
 
     
     
         20 . A method as in  claim 19 , wherein the complementary shaped surface is a layer of glass.  
     
     
         21 . A method as in  claim 11  further comprising the step of: 
 applying heat to the conductor strip and connector device for attachment to glass.  
 
     
     
         22 . A method as in  claim 11  further comprising the step of: 
 bending the flaps of the connector device to crimp a lead wire to a braid of wire.  
 
     
     
         23 . A method as in  claim 22  further comprising the steps of: 
 heating the braid of wire; and  
 applying solder to the braid of wire.  
 
     
     
         24 . A method as in  claim 11  further comprising the step of: 
 attaching individual solder masses along the conductor strip.  
 
     
     
         25 . A method of forming an assembly comprising: 
 providing a conductor;    securing a connector device to the conductor by crimping bendable flaps extending from the connector device, the connector device having an external surface; and    bending the conductor near the connector device in a manner so that at least a portion of the conductor and the external surface of the connector device lie in a common contour for attaching to a surface.

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