Method of cleaning a substrate

Abstract

To clean contaminants on a substrate including a metal wiring formed thereon, a cleaning solution including diluted aqueous sulfuric acid solution is applied onto the substrate. Mega-sonic energy is applied to the cleaning solution on the substrate. The contaminants are removed from the substrate in accordance with the reaction between the diluted aqueous sulfuric acid solution and the contaminant while the mega-sonic energy is applied to the substrate. The corrosion of the metal wiring is prevented because of the cleaning solution including the diluted aqueous sulfuric acid solution. Additionally, the damage of the substrate is reduced because the mega-sonic energy is appropriately applied to the substrate.

What is claimed is:  
     
         1 . A method of cleaning a substrate comprising: 
 applying an aqueous sulfuric acid solution diluted by deionized water onto the substrate; and    cleaning contaminants on the substrate in accordance with a reaction between the diluted aqueous sulfuric acid solution with the contaminants by applying a mega-sonic energy to the substrate including the diluted aqueous sulfuric acid solution.    
     
     
         2 . The method of  claim 1 , wherein the substrate includes a metal wiring or a metal thin film.  
     
     
         3 . The method of  claim 1 , wherein the diluted aqueous sulfuric acid solution comprises the deionized water and sulfuric acid by a volume ratio of about 500:1 to about 8,000:1.  
     
     
         4 . The method of  claim 3 , wherein the sulfuric acid has a concentration of about 10 ppm to about 1,000 ppm.  
     
     
         5 . The method of  claim 1 , wherein the mega-sonic energy is generated using a power of about 5 Watts to about 15 Watts.  
     
     
         6 . The method of  claim 1 , wherein cleaning the contaminants is performed for about 30 seconds to about 120 seconds.  
     
     
         7 . The method of  claim 6 , wherein cleaning the contaminants is performed at a temperature of about 20 degrees C. to about 30 degrees C.  
     
     
         8 . The method of  claim 1 , wherein cleaning the contaminants is performed using a spin scrubber.  
     
     
         9 . The method of  claim 8 , wherein the substrate is provided into the spin scrubber in a batch type, the diluted aqueous sulfuric solution is applied by a spray process, and the mega-sonic energy is applied through a bar facing the substrate.  
     
     
         10 . The method of  claim 8 , wherein the substrate rotates at a speed of about 8 rpm to about 50 rpm.  
     
     
         11 . The method of  claim 1 , further comprising rinsing the substrate using deionized water, and drying the substrate.  
     
     
         12 . A method of cleaning a substrate comprising: 
 providing an aqueous sulfuric acid solution diluted by deionized water in a bath;    immersing the substrate into the diluted aqueous sulfuric acid solution; and    cleaning contaminants on the substrate in accordance with a reaction between the diluted aqueous sulfuric acid solution and the contaminants by applying a mega-sonic energy to the substrate including the diluted aqueous sulfuric acid solution.    
     
     
         13 . The method of  claim 12 , wherein the diluted aqueous sulfuric acid solution comprises the deionized water and sulfuric acid by a volume ratio of about 500:1 to about 8,000:1.  
     
     
         14 . The method of  claim 12 , wherein the sulfuric acid has a concentration of about 10 ppm to about 1,000 ppm.