Orifice sealing physical barrier

Abstract

The present invention is a physical barrier for an orifice in a panel member which includes a plastic carrier and a patch adapted to adhere to the carrier and the panel member. The patch is comprised of a heat-activated material. The patch is joined to a portion of the plastic carrier and encapsulates a peripheral edge of the plastic carrier. Joining the patch and the plastic carrier preferably employs use of traditional vacuum-forming techniques. The plastic carrier is attached to the panel member and the patch is heated to generally flow. The patch cools and forms a seal between the interface of the plastic carrier and the panel member while a portion of the patch is disposed between the plastic carrier and the panel member filling any gap therebetween.

1 . A physical barrier for an orifice in a panel member, comprising: 
 a plastic carrier having a peripheral edge;    a patch adapted to adhere to said plastic carrier and the panel member; and    wherein said patch is attached to at least a portion of said plastic carrier and encapsulates said peripheral edge.    
     
     
         2 . The physical barrier of  claim 1 , wherein said patch is configured to seal an interface between said plastic carrier and the orifice upon being heat-activated.  
     
     
         3 . The physical barrier of  claim 2 , wherein a portion of said patch is disposed between said plastic carrier and the panel member to seal the plastic carrier and the orifice upon being heat-activated.  
     
     
         4 . The physical barrier of  claim 1 , wherein said carrier is adapted to be attached to said panel member.  
     
     
         5 . The physical barrier of  claim 4 , further comprising one or more snap-fit fasteners mounted on said carrier and adapted to attach said carrier to said panel member.  
     
     
         6 . The physical barrier of  claim 5 , wherein said snap-fit fasteners include a protrusion defining said peripheral edge of said plastic carrier and having a bottom surface, said patch is wrapped around said protrusion to encapsulate said peripheral edge and is attached to said bottom surface.  
     
     
         7 . The physical barrier of  claim 5 , wherein said snap-fit fasteners include a lip defining said peripheral edge of said plastic carrier and having a bottom surface, said patch is wrapped around said lip to encapsulate said peripheral edge and is attached to said bottom surface.  
     
     
         8 . The physical barrier of  claim 5 , wherein said fasteners are a plurality of S-shaped clips.  
     
     
         9 . The physical barrier of  claim 8 , wherein said S-shaped clips include a tail defining said peripheral edge of said plastic carrier and having a bottom surface, said patch is wrapped around said tail to encapsulate said peripheral edge and is attached to said bottom surface.  
     
     
         10 . The physical barrier of  claim 1 , wherein said patch comprises 10-40 wt % ethylene-vinyl acetate (EVA), 5-35 wt % styrene butadiene rubber (SBR), 5-22 wt % talc, 10-45 wt % mica, and 10-30 wt % tall oil rosin.  
     
     
         11 . The physical barrier of  claim 8 , wherein said patch comprises 29 wt % EVA, 16 wt % SBR, 12 wt % talc, 26 wt % mica, and 17 wt % tall oil rosin.  
     
     
         12 . A method of sealing an orifice in a panel member, comprising: 
 joining a patch made of a heat-activated material to a portion of a plastic carrier such that the patch encapsulates a peripheral edge of the plastic carrier;    attaching the plastic carrier to the panel member; and    adhering the plastic carrier to the panel member with a portion of the patch disposed between the plastic carrier and the panel member.    
     
     
         13 . The method of sealing an orifice of  claim 12 , wherein the heat-activated material of the patch comprises 10-40 wt % ethylene-vinyl acetate (EVA) and 5-35 wt % styrene butadiene rubber (SBR), with the balance comprising fillers of talc, mica and tall oil rosin.  
     
     
         14 . The method of sealing an orifice of  claim 13 , wherein the heat-activated material of the patch comprises fillers of 5-22 wt % talc, 10-45 wt % mica, and 10-30 wt % tall oil rosin.  
     
     
         15 . The method of sealing an orifice of  claim 13 , wherein the heat-activated material of the patch comprises 29 wt % EVA, 16 wt % SBR, 12 wt % talc, 26 wt % mica, and 17 wt % tall oil rosin.  
     
     
         16 . The method of sealing an orifice of  claim 12 , wherein the heat-activated material of the patch comprises 10-40 wt % ethylene-vinyl acetate (EVA), 5-35 wt % styrene butadiene rubber (SBR), 5-22 wt % talc, 10-45 wt % mica, and 10-30 wt % tall oil rosin.  
     
     
         17 . The method of sealing an orifice of  claim 12 , wherein joining the patch to the plastic carrier includes vacuum-forming the patch to the plastic carrier to encapsulate the peripheral edge of the carrier.  
     
     
         18 . The method of sealing an orifice of  claim 12 , wherein adhering the plastic carrier to the panel member includes heating the patch such that the heat-activated material of the patch generally flows.  
     
     
         19 . The method of sealing an orifice of  claim 18 , wherein heating the patch includes heating at a temperature of about 175° Fahrenheit to about 400° Fahrenheit.  
     
     
         20 . The method of sealing an orifice of  claim 18 , further including the step of curing the heat-activated material of the patch to form a seal between the interface of the plastic carrier and the panel member such that a portion of the patch is disposed between the plastic carrier and the panel member.