Semiconductor wafer handler

Abstract

A semiconductor wafer handler comprises a ring ( 70 ) attached to a hub ( 80 ) by a plurality of spokes ( 90 ). Vacuum is applied to the surface of the semiconductor wafer through orifices ( 100 ) containing in the ring ( 70 ). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices ( 110 ) contained in the spokes ( 90 ).

We claim:  
     
         1 . An improved wafer handler, comprising: 
 A ring with an upper surface and orifices for applying a vacuum to the surface of a semiconductor wafer;    a hub;    spokes connecting said ring to said hub; and    orifices in said spokes through which water and nitrogen can be passed unto the surface of said semiconductor wafer.    
     
     
         2 . The method of  claim 1  wherein said improved wafer handler is connected to a chemical mechanical polishing tool.  
     
     
         3 . The method of  claim 1  wherein said ring is 0.01 to 0.3 inches thick.  
     
     
         4 . The method of  claim 1  wherein said hub further comprises a diverter valve.  
     
     
         5 . A CMP processing tool with improved wafer handling, comprising: 
 a wafer handler for holding a semiconductor wafer while processing; and    a pedestal for loading and unloading said semiconductor wafer to said wafer handler wherein said pedestal further comprises;    a ring with an upper surface and orifices for applying a vacuum to the surface of a semiconductor wafer;    a hub;    spokes connecting said ring to a hub; and    orifices in said spokes through which water and nitrogen can be passed unto the surface of said semiconductor wafer.    
     
     
         6 . The method of  claim 5  wherein said ring is 0.01 to 0.3 inches thick.  
     
     
         7 . The method of  claim 5  wherein said hub further comprises a diverter valve.  
     
     
         8 . An improved wafer handler, comprising: 
 A ring with an upper surface and orifices for applying a vacuum to the surface of a semiconductor wafer;    a hub comprising a diverter valve.    spokes connecting said ring to said hub; and    orifices in said spokes through which water and nitrogen can be passed unto the surface of said semiconductor wafer.    
     
     
         9 . The method of  claim 8  wherein said improved wafer handler is connected to a chemical mechanical polishing tool.  
     
     
         10 . The method of  claim 8  wherein said ring is 0.01 to 0.3 inches thick.  
     
     
         11 . The method of  claim 8  wherein said diverter valve further comprises: 
 a housing with an internal top surface and an internal bottom surface; and  
 a valve ring contained in said housing wherein said valve ring moves to the internal bottom surface on the application of a vacuum and said valve ring moves to the internal top surface on the application of water or nitrogen.  
 
     
     
         12 . A diverter valve, comprising: 
 a housing with an internal top surface and an internal bottom surface; and    a valve ring contained in said housing wherein said valve ring moves to the internal bottom surface on the application of a vacuum to said housing.    
     
     
         13 . The diverter valve of  claim 12  further comprising: 
 a plurality of tubes connected to said internal bottom surface wherein said valve ring covers said plurality of tubes when a vacuum is applied to said housing.