US2004183196A1PendingUtilityA1

[metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls]

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Priority: Mar 21, 2003Filed: Dec 16, 2003Published: Sep 23, 2004
Est. expiryMar 21, 2023(expired)· nominal 20-yr term from priority
Inventors:Cheng-Chieh YangWen-Long ChenYao-Huang TsaiChih-Liang HuPan-Nan Chen
H10W 72/07336H10W 72/252H10W 72/251H10W 72/073H10W 72/30H10W 72/012H10W 72/20
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Claims

Abstract

A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.

Claims

exact text as granted — not AI-modified
11 . A semiconductor circuit component comprising a circuit die, said circuit die having at least one electrical contact area for connection to the packaging of said semiconductor circuit component, said at least one electrical contact area being bond to the corresponding lead of said packaging by metallic material formed by a metal ball of prescribed feed melted during the fabrication of said component.  
     
     
         12 . The semiconductor circuit component of  claim 11 , wherein said metal ball contains copper.  
     
     
         13 . The semiconductor circuit component of  claim 11  wherein said metal ball contains aluminum.  
     
     
         14 . The semiconductor circuit component of  claim 11 , wherein said metal ball contains tin.  
     
     
         15 . The semiconductor circuit component of  claim 11 , wherein said metal ball contains lead.  
     
     
         16 . The semiconductor circuit component of  claim 11 , further comprising a second metal bump.  
     
     
         17 . The semiconductor circuit component of  claim 16 , wherein said two metal bumps being of different sizes.  
     
     
         18 . The semiconductor circuit component of  claim 16 , wherein said two metal bumps being of different shapes.  
     
     
         19 . The semiconductor circuit component of  claim 16 , wherein said two metal bumps being made of different materials.  
     
     
         20 . The semiconductor circuit component of  claim 11 , further comprising at least one more metal bump.

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