Methods of forming pluralities of microelectronic lids

Abstract

The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.

1 - 50 . (canceled).  
     
     
         51 . (previously presented): A method of forming a plurality of microelectronic lids, comprising: 
 forming a lid stock material into a shape of a bar having a side, and a groove extending along the side;    after forming the lid stock material into the shape, cutting the bar into a plurality of separated microelectronic lids; and    wherein the lid stock material comprises aluminum or copper, and further comprising electroplating the separated microelectronic lids with nickel.    
     
     
         52 . (previously presented): The method of  claim 51  wherein the forming the lid stock material into the shape comprises extruding the lid stock material into the shape.  
     
     
         53 . (previously presented): The method of  claim 51  wherein the forming the lid stock material into the shape comprises: 
 providing a bar of the lid stock material that lacks the groove in the side; and  
 machining the groove into the side of the bar.  
 
     
     
         54 . (previously presented): The method of  claim 51  wherein the lid stock material comprises aluminum.  
     
     
         55 . (previously presented): The method of  claim 51  wherein the lid stock material comprises copper.  
     
     
         56 . (previously presented): The method of  claim 51  further comprising incorporating at least one of the microelectronic lids into a microelectronic package, the incorporating comprising: 
 providing a chip supported by a base; and  
 adhering the microelectronic lid to the base and over the chip; the chip accordingly being packaged between the microelectronic lid and the base.