Compositions and methods for thermosetting molecules in organic compositions
Abstract
In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of producing a low dielectric constant polymer, comprising:
providing a thermosetting monomer having the structure wherein Y is selected from a cage compound and a silicon atom, and R 1 , R 2 , R 3 , and R 4 are independently selected from an aryl, a branched aryl, and an arylene ether, and wherein at least one of the aryl, the branched aryl, and the arylene ether has a triple bond; and incorporating the thermosetting monomer into a polymer thereby forming the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of the triple bond.
2 . The method of claim 1 wherein Y is selected from the group consisting of an adamantane, and a diamantane.
3 . The method of claim 1 wherein the aryl comprises a moiety selected from the group consisting of a tolanyl, a phenylethynylphenylethynylphenyl, and a p-tolanylphenyl.
4 . The method of claim 1 wherein the branched aryl comprises a 1,2-bis(phenylethynyl)phenyl.
5 . The method of claim 1 wherein the arylene ether comprises a p-tolanylphenyl ether.
6 . The method of claim 1 wherein at least three of the aryl, the branched aryl, and the arylene ether have a triple bond, and wherein the incorporation into the polymer comprises a chemical reaction of the at least three triple bonds.
7 . The method of claim 1 wherein all of the aryl, the branched aryl, and the arylene ether have a triple bond, and wherein the incorporation into the polymer comprises a chemical reaction of all of the triple bonds.
8 . The method of claim 1 wherein R 1 , R 2 , R 3 and R 4 have a total length L, and the low dielectric constant polymer has a dielectric constant K, and wherein K decreases when L increases.
9 . The method of claim 1 wherein the polymer comprises a poly(arylene ether).
10 . The method of claim 1 wherein the step of incorporating the thermosetting monomer into the polymer takes place without participation of an additional molecule.
11 . A method of producing a low dielectric constant polymer, comprising:
providing a thermosetting monomer having the structure wherein Ar is an aryl, and R′ 1 , R′ 2 , R′ 3 , R′ 4 , R′ 5 , and R′ 6 are independently selected from an aryl, a branched aryl, an arylene ether, and nothing, and wherein each of the aryl, the branched aryl, and the arylene ether have at least one triple bond; and incorporating the thermosetting monomer into a polymer thereby forming the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of the at least one triple bond.
12 . The method of claim 11 wherein the aryl comprises a phenyl group.
13 . The method of claim 12 wherein Ar is selected from the group consisting of a phenyl group and a sexiphenylene.
14 . The method of claim 11 wherein R′ 1 , R′ 2 , R′ 3 , R′ 4 , R′ 5 and R′ 6 have a total length L, and the low dielectric constant polymer has a dielectric constant K, and wherein K decreases when L increases.
15 . The method of claim 11 wherein the step of incorporating the thermosetting monomer into the polymer takes place without participation of an additional molecule.
16 . The method of claim 11 wherein the polymer comprises a poly(arylene ether).
17 . A thermosetting monomer having the structure
wherein Y is selected from a cage compound and a silicon atom, and R 1 , R 2 , R 3 , and R 4 are independently selected from an aryl, a branched aryl, and an arylene ether, and wherein at least one of the aryl, the branched aryl, and the arylene ether has a triple bond.
18 . A thermosetting monomer having the structure
wherein Ar is an aryl, and R′ 1 , R′ 2 , R′ 3 , R′ 4 , R′ 5 , and R′ 6 are independently selected from an aryl, a branched aryl, an arylene ether, and nothing, and wherein each of the aryl, the branched aryl, and the arylene ether have at least one triple bond.
19 . A thermosetting monomer having a structure according to formula TM-1:
wherein n=1-3.
20 . A thermosetting monomer having a structure according to formula TM-2:
wherein n=1-3.
21 . A thermosetting monomer having a structure according to formula TM-3:
22 . An electrical device including a dielectric layer comprising a polymer fabricated from at least one thermosetting monomer from the group consisting of:
wherein Y is selected from a cage compound and a silicon atom, and R 1 , R 2 , R 3 , and R 4 are independently selected from an aryl, a branched aryl, and an arylene ether, and wherein at least one of the aryl, the branched aryl, and the arylene ether has a triple bond;
wherein Ar is an aryl, and R′ 1 , R′ 2 , R′ 3 , R′ 4 , R′ 5 , and R′ 6 are independently selected from an aryl, a branched aryl, an arylene ether, and nothing, and wherein each of the aryl, the branched aryl, and the arylene ether have at least one triple bond;Cited by (0)
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