US2004206943A1PendingUtilityA1

Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same

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Assignee: SONY CHEMICALS CORPPriority: Aug 12, 1999Filed: May 12, 2004Published: Oct 21, 2004
Est. expiryAug 12, 2019(expired)· nominal 20-yr term from priority
Inventors:Masao SaitoOsamu TakamatsuTakayuki Matsushima
C09J 133/068C08L 2312/00C08L 71/12Y10T428/31935C09J 2463/00H05K 3/323Y10T428/14C08F 290/062C09J 163/10C09J 9/02C08L 2205/02H05K 2201/0239Y10T428/1462C08L 2666/02C09J 11/08H10P 72/74H10W 72/07331H10W 72/07251H10W 72/354H10W 72/073H10W 72/20C09J 4/00H10W 72/30C09J 2203/326C09J 7/00C09J 2301/314C09J 7/10
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Claims

Abstract

An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A low-temperature setting adhesive, comprising as main components: 
 a cured product of an epoxy acrylate represented by the following formula:                          a resin component having no unsaturated double bond;    a bis(methacryloyloxyethyl) hydrogen phosphate; and    a radical polymerization initiator,    wherein the epoxy acrylate is present in the amount of 15-85% by weight of adhesive, the resin component having no unsaturated double bond is present in the amount of 30 to 90% by weight of the adhesive, and the bis(methacryloyloxyethyl) hydrogen phosphate is present in the amount of 0.01 to 20% by weight of the adhesive, and wherein n has a value in the range from 0-6.    
     
     
         2 . The low-temperature setting adhesive according to  claim 1 , wherein a phosphate-based coupling agent is further mixed therein.  
     
     
         3 . The low-temperature setting adhesive according to  claim 1 , wherein said phosphoric acid-containing resin has a radical polymerizable reactive group.  
     
     
         4 . The low-temperature setting adhesive according to  claim 2 , wherein said phosphoric acid-containing resin component has a radical polymerizable reactive group.  
     
     
         5 . An anisotropically electroconductive adhesive, comprising: 
 a low-temperature setting adhesive, comprising as main components: a cured product of an epoxy acrylate represented by the following formula:                          a resin component having no unsaturated double bond,    bis(methacryloyloxyethyl) hydrogen phosphate,    a radical polymerization initiator; and    an electroconductive particle being dispersed in said low-temperature setting adhesive,    wherein the epoxy acrylate is present in the amount of 15-85% by weight of adhesive, the resin component having no unsaturated double bond is present in the amount of 30 to 90% by weight of the adhesive, and the bis(methacryloyloxyethyl) hydrogen phosphate is present in the amount of 0.01 to 20% by weight of the adhesive, and wherein n has a value in the range from 0-6.    
     
     
         6 . The anisotropically electroconductive adhesive according to  claim 5 , wherein a phosphate-based coupling agent is further mixed in said low-temperature setting adhesive.  
     
     
         7 . The anisotropically electroconductive adhesive according to  claim 5 , wherein said phosphoric acid-containing resin has a radical polymerizable reactive group.  
     
     
         8 . The anisotropically electroconductive adhesive according to  claim 6 , wherein said phosphoric acid-containing resin component has a radical polymerizable reactive group.  
     
     
         9 . The anisotropically electroconductive adhesive according to  claim 5 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.  
     
     
         10 . The anisotropically electroconductive adhesive according to  claim 6 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.  
     
     
         11 . The anisotropically electroconductive adhesive according to  claim 7 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.  
     
     
         12 . The anisotropically electroconductive adhesive according to  claim 8 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.  
     
     
         13 . The anisotropically electroconductive adhesive according to  claim 9 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.  
     
     
         14 . The anisotropically electroconductive adhesive according to  claim 10 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.  
     
     
         15 . The anisotropically electroconductive adhesive according to  claim 11 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.  
     
     
         16 . The anisotropically electroconductive adhesive according to  claim 12 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.  
     
     
         17 . An insulating adhesive film, comprising: 
 a peeling sheet; and    a low-temperature setting adhesive, said adhesive being provided on said sheet by coating and drying, and comprising as main components: a cured product of an epoxy acrylate represented by the following formula:                          a resin component having no unsaturated double bond, an acryloyloxy ester-ashed phosphate, and a radical polymerization initiator.    
     
     
         18 . The insulating adhesive film according to  claim 17 , wherein a phosphate-based coupling agent is further mixed therein.  
     
     
         19 . The insulating adhesive film according to  claim 17 , wherein said phosphoric acid-containing resin component has a radical polymerizable reactive group.  
     
     
         20 . The insulating adhesive film according to  claim 18 , wherein said phosphoric acid-containing resin component has a radical polymerizable reactive group.  
     
     
         21 . An anisotropically electroconductive adhesive film, comprising: 
 a peeling sheet;    a low-temperature setting adhesive provided on said sheet by coating and drying, and comprising as main components: a cured product of an epoxy acrylate represented by the following formula:                          a resin component having no unsaturated double bond, an acryloyloxy ester-ashed phosphate, and a radical polymerization initiator; and    an electroconductive particle dispersed in said low-temperature setting adhesive.    
     
     
         22 . The anisotropically electroconductive adhesive film according to  claim 21 , wherein a phosphate-based coupling agent is further mixed in said low-temperature setting adhesive.  
     
     
         23 . The anisotropically electroconductive adhesive film according to  claim 21 , wherein said phosphoric acid-containing resin component has a racdical polymerizable reactive group.  
     
     
         24 . The anisotropically electroconductive adhesive film according to  claim 22 , wherein said phosphoric acid-containing resin component has a radical polymerizable reactive group.  
     
     
         25 . The anisotropically electroconductive adhesive film according to  claim 21 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.  
     
     
         26 . The anisotropically electroconductive adhesive film according to  claim 22 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.  
     
     
         27 . The anisotropically electroconductive adhesive film according to  claim 23 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.  
     
     
         28 . The anisotropically electroconductive adhesive film according to  claim 24 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.  
     
     
         29 . The anisotropically electroconductive adhesive film according to  claim 25 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.  
     
     
         30 . The anisotropically electroconductive adhesive film according to  claim 26 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.  
     
     
         31 . The anisotropically electroconductive adhesive film according to  claim 27 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.  
     
     
         32 . The anisotropically electroconductive adhesive film according to  claim 28 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.  
     
     
         33 . The low-temperature setting adhesive according to  claim 1 , wherein the resin component having no unsaturated double bond is present in the amount of 30-80% by weight of the adhesive.  
     
     
         34 . The anisotropicallly electroconductive adhesive according to  claim 5 , wherein the resin component having no unsaturated double bond is present in the amount of 30-80% by weight of the adhesive.

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