Semiconductor component in a wafer assembly

Abstract

Semiconductor components in a wafer assembly, in which the components are connected to a frame by means of in each case one holder and are formed from the same silicon wafer. The holder connects the respective component to the frame on one side and has a desired breaking point. The desired breaking point is designed as a V-shaped groove, the surfaces of which form crystal planes. According to the method, the patterning for production of the holder takes place on the wafer back surface, with subsequent wet chemical anisotropic etching of the V-groove. In this way, the holder is produced independently of the processing of the wafer front surface, and when the semiconductor component is removed a defined broken edge is formed without there being any risk of the semiconductor component being damaged.

1 . A wafer assembly comprises a frame, at least one semiconductor component, holder means for connecting the at least one semiconductor component to the frame wherein the holder means and the semiconductor component are formed of the same material, the holder means has one end connected to the frame and is provided with a desired breaking point.  
     
     
         2 . The wafer assembly as claimed in  claim 1 , wherein the holder means has a large-area thickened portion connected to the frame and the desired breaking point is formed by a groove between the frame and the semiconductor component.  
     
     
         3 . The wafer assembly as claimed in  claim 2 , wherein the groove is of V-shaped design.  
     
     
         4 . The wafer assembly as claimed in  claim 3 , wherein the groove has surfaces which form crystal planes.  
     
     
         5 - 9 . (canceled)