Heat dissipation device having a load centering mechanism

Abstract

A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.

1 . A heat dissipation device, comprising: 
 a base having a first base surface;    at least one fin extending from said first base surface;    a spring clip channel defined proximate said at least one fin; and    a load centering mechanism within said spring clip channel, said load centering mechanism integrally associated with said first base surface.    
     
     
         2 . (canceled).  
     
     
         3 . The heat dissipation device of  claim 1 , wherein said spring clip channel further includes at least one sloped side adapted to orient a spring clip on said load centering mechanism.  
     
     
         4 . (canceled).  
     
     
         5 . The heat dissipation device of  claim 1 , further including at least one depression defined in said base from said first base surface that defines said load centering mechanism.  
     
     
         6 . A microelectronic assembly, comprising: 
 a microelectronic device; and    a heat dissipation device, including a base having a first base surface and an opposing second surface, wherein said heat dissipation device makes thermal contact with said microelectronic device, and including at least one fin extending from said first base surface, a spring clip channel defined proximate said at least one fin, and a load centering mechanism within said spring clip channel, said load centering mechanism integrally associated with said first base surface.    
     
     
         7 . (canceled).  
     
     
         8 . The microelectronic assembly of  claim 6 , wherein said spring clip channel further includes at least one sloped side adapted to orient a spring clip on said load centering mechanism.  
     
     
         9 . (canceled).  
     
     
         10 . The microelectronic assembly of  claim 6 , further including at least one depression defined in said base from said first base surface that defines said load centering mechanism.  
     
     
         11 . A method for fabricating a heat dissipation device, comprising: 
 forming a base having a first base surface;    forming at least one fin extending from said first base surface;    forming a spring clip channel defined proximate said at least one fin; and    forming a load centering mechanism within said spring clip channel, said load centering mechanism integrally associated with said first base surface.    
     
     
         12 . (canceled).  
     
     
         13 . (canceled).  
     
     
         14 . The method of  claim 11 , wherein forming said load centering mechanism comprises attaching said load centering mechanism to said base first surface within said spring clip channel.  
     
     
         15 . The method of  claim 11 , wherein forming said base, forming said at least one fin, and forming said spring clip channel occur substantially simultaneously in a extrusion process, and forming said load centering mechanism comprises milling away a portion of said spring clip channel.  
     
     
         16 . The method of  claim 11 , wherein forming said load centering mechanism comprises forming at least one depression extending into said base from said base first surface within said spring clip channel.  
     
     
         17 . The method of  claim 11 , wherein forming said spring clip channel further includes forming at least one sloped side adapted to orient a spring clip on said load centering mechanism.  
     
     
         18 . (canceled).  
     
     
         19 . A method for fabricating a microelectronic assembly, comprising: 
 providing a microelectronic device;    providing a heat dissipation device including a base having a first base surface and an opposing second base surface, at least one fin extending from said first base surface, a spring clip channel defined proximate said at least one fin, and a load centering mechanism within said spring clip channel, said load centering mechanism integrally associated with said first base surface;    placing said heat dissipation device second base surface in thermal contact and microelectronic device; and    placing a spring clip within said spring clip channel.    
     
     
         20 . The method of  claim 19 , further including placing said microelectronic device in a socket, and securing said spring clip to said socket.