Electroplating composition

Abstract

Compositions useful for electrodepositing a metal are provided. These compositions contain one or more metal salts, electrolyte, two or more brightener compounds and optionally one or more of leveler compounds and wetting agents. Also provided are methods of depositing a metal layer using these compositions.

What is claimed is:  
     
         1 . A composition comprising one or more sources of metal ions, an electrolyte, and two or more brightening agents, wherein at least one brightening agent is an organosulfonic acid compound and at least one brightening agent is a dithiocarbonate-containing compound.  
     
     
         2 . The composition of  claim 1  wherein the metal is copper.  
     
     
         3 . The composition of  claim 1  wherein the organosulfonic acid compound and the dithiocarbonate-containing compound are present in a weight ratio of ≧3:1.  
     
     
         4 . A method of depositing a metal layer on a substrate comprising the steps of contacting the substrate with the composition of  claim 1  and applying sufficient current density for a period of time to deposit the layer of metal.  
     
     
         5 . A method of manufacturing an electronic device comprising the step of depositing a layer of metal on a substrate by contacting the substrate with the composition of  claim 1  and applying sufficient current density for a period of time to deposit the layer of metal.  
     
     
         6 . The method of  claim 5  wherein the electronic device is an integrated circuit.  
     
     
         7 . The method of  claim 5  wherein the metal is copper.  
     
     
         8 . The method of  claim 5  wherein the substrate has one or more apertures having a size of ≦2 μm.  
     
     
         9 . A method of depositing a copper layer on a substrate having one or more apertures having a size of ≦2 μm, comprising the steps of contacting the substrate with an electroplating composition comprising one or more sources of metal ions, an electrolyte, and two or more brightening agents, and applying sufficient current density for a period of time to deposit the layer of copper, wherein the copper layer has an arithmetic surface roughness of ≦5 nm, as determined by atomic force microscopy.  
     
     
         10 . The method of  claim 9  wherein at least one brightening agent is an organosulfonic acid compound and at least one brightening agent is a dithiocarbonate-containing compound.