Audio sound quality enhancement apparatus

Abstract

An audio sound quality enhancer which provides a transparent sound quality, using solid-state devices, which has previously been available only in vacuum tube audio systems. The invention comprises at least one solid-state component in the audio signal path of an audio circuit, and at least one heat source configured to heat the solid-state components. The invention increases the sound quality of solid-state audio systems by increasing the temperature of the semiconductor components involved in sound production. By intentionally heating the semiconductor components of an audio system above standard operating temperatures, the invention delivers sound quality levels normally only associated with vacuum tube sound systems.

1 - 21 . cancel  
     
     
         22 . An apparatus, comprising: 
 a thermally conductive substrate;    a heating circuit comprising a heat source, wherein the heat source is proximate to the substrate; and    at least one audio semiconductor mounted to the substrate.    
     
     
         23 . The apparatus of  claim 22  wherein the heating circuit further comprises: 
 the heat source proximate to the substrate;  
 a temperature measuring device proximate to the substrate; and  
 a feedback regulator electrically connected to the heat source and the temperature measuring device, whereby the feedback regulator may control the heat source.  
 
     
     
         24 . The apparatus of  claim 22  wherein the heating circuit further comprises a heat sink.  
     
     
         25 . The apparatus of  claim 22  wherein the heat source is a heat sink sized to allow a desired temperature rise with quiescent bias current.  
     
     
         26 . The apparatus of  claim 22  further comprising a plurality of circuit components electrically connected to the at least one audio semiconductor and remotely located from the heat source whereby the plurality of circuit components operate at approximately ambient temperature.  
     
     
         27 . The apparatus of  claim 22  wherein the at least one audio semiconductor is used within a device selected from the group consisting of: 
 microphones;  
 microphone preamps;  
 phono preamplifiers;  
 compact disk players;  
 digital video disk players;  
 amplifiers;  
 line stages;  
 audio mixing boards;  
 televisions; and  
 video cassette recorders.  
 
     
     
         28 . The apparatus of  claim 22  wherein the thermally conductive substrate is located on an amplifying output stage of an audio circuit.  
     
     
         29 . A method for improving performance of an audio circuit, the method comprising the steps of: 
 mounting at least one audio semiconductor to a thermally conductive substrate; and    heating the thermally conductive substrate from a heat source.    
     
     
         30 . The method of  claim 29  further comprising the step of regulating a temperature of the substrate using a temperature measuring device proximate to the substrate.  
     
     
         31 . The method of  claim 29  wherein the step of heating the substrate further comprises the step of maintaining the substrate at an above-ambient temperature using a heat sink.  
     
     
         32 . The method of  claim 29  wherein the step of heating the substrate further comprises the step of allowing a desired temperature rise, with quiescent bias current, using a heat sink.  
     
     
         33 . The method of  claim 29  further comprising the steps of: 
 mounting a plurality of circuit components remotely from the heat source, whereby the plurality of circuit components operate at approximately ambient temperature; and  
 electrically connecting the plurality of circuit components to the at least one audio semiconductor.  
 
     
     
         34 . The method of  claim 29  wherein the at least one audio semiconductor is used within a device selected from the group consisting of: 
 microphones;  
 microphone preamps;  
 phono preamplifiers;  
 compact disk players;  
 digital video disk players;  
 amplifiers;  
 line stages;  
 audio mixing boards;  
 televisions; and  
 video cassette recorders.  
 
     
     
         35 . The method of  claim 29  further comprising the step of locating the thermally conductive substrate on an amplifying output stage of the audio circuit.  
     
     
         36 . A system for improving performance of an audio circuit, the system comprising: 
 means for mounting at least one audio semiconductor to a thermally conductive substrate; and    means for heating the thermally conductive substrate.    
     
     
         37 . The system of  claim 36  further comprising means for regulating a temperature of the substrate.  
     
     
         38 . The system of  claim 36  further comprising means for allowing a desired temperature rise with quiescent bias current.  
     
     
         39 . The system of  claim 36  further comprising means for maintaining at approximately ambient temperature a plurality of circuit components electrically connected to the at least one audio semiconductor.  
     
     
         40 . The system of  claim 36  further comprising means for isolating the at least one audio semiconductor from a plurality of circuit components electrically connected to the at least one audio semiconductor.  
     
     
         41 . The system of  claim 36  further comprising means for maintaining a safe, external temperature.