Multi-layered structures and methods for manufacturing the multi-layered structures

Abstract

Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.

What is claimed is:  
     
         1 . A method of forming a multi-layered laminate for use in an in-mold process, the method comprising: 
 shaping the substrate into a desired shape;    applying a decorative feature to at least one surface of a substrate; and    depositing a metal layer onto at least one surface of the decorated and shaped substrate.    
     
     
         2 . The method of  claim 1  wherein the metal layer has a sufficient thickness to shield electromagnetic interference.  
     
     
         3 . The method of  claim 1  wherein the metal layer has a thickness between approximately 1 micron and 50 microns.  
     
     
         4 . The method of  claim 1  wherein shaping comprises thermoforming the substrate.  
     
     
         5 . The method of  claim 1  wherein applying comprises using printable masks, silk screening, heat transfer molding, sublimation ink-transfer, or pad printing.  
     
     
         6 . The method of  claim 1  further comprising injection molding a resin onto at least one of the decorative feature, metal layer, and substrate.  
     
     
         7 . The method of  claim 1  wherein shaping comprises placing the substrate over a vacuum mold.  
     
     
         8 . The method of  claim 1  wherein applying is carried out after shaping.  
     
     
         9 . The method of  claim 1  wherein applying is carried out before shaping.  
     
     
         10 . The method of  claim 1  wherein applying comprises decorating both a first surface and a second surface of the substrate.  
     
     
         11 . The method of  claim 1  wherein applying comprises decorating only a first surface of the substrate.  
     
     
         12 . The method of  claim 1  wherein depositing comprises vacuum metallizing the metal layer onto the substrate.  
     
     
         13 . The method of  claim 11  wherein depositing comprises painting, sputtering, electroplating, deposition coating, electroless plating, laminated conductive layers the metal layer onto the substrate.  
     
     
         14 . The method of  claim 1  wherein the metal layer provides a reflective surface.  
     
     
         15 . A method of forming a multi-layered structure, the method comprising: 
 placing a pre-shaped metallized insert into an injection molding chamber; and    injection molding a resin on the metallized insert.    
     
     
         16 . The method of  claim 15  wherein the metallized substrate comprises a film and at least one metal layer, wherein the at least one metal layer is sufficient to block electromagnetic interference.  
     
     
         17 . The method of  claim 15  wherein the metallized substrate comprises a film and at least one metal layer, wherein the at least one metal layer with a thickness between approximately 1 micron and 50 microns.  
     
     
         18 . The method of  claim 15  wherein providing comprises: 
 shaping the substrate; and  
 depositing a metal layer onto at least one surface of the shaped substrate to form the metallized substrate.  
 
     
     
         19 . The method of  claim 18  wherein depositing comprises vacuum metallizing the metal layer onto the shaped substrate.  
     
     
         20 . The method of  claim 18  wherein depositing comprises painting the metal layer onto the shaped substrate.  
     
     
         21 . The method of  claim 18  comprising applying at least one layer of decoration onto the substrate prior to shaping of the substrate.  
     
     
         22 . The method of  claim 15  wherein the metallized substrate further comprises at least one layer of decoration.  
     
     
         23 . The method of  claim 15  wherein the metallized substrate comprises a film and a metal layer, wherein injection molding comprises bonding the resin to the metal layer.  
     
     
         24 . The method of  claim 23  comprising depositing an undercoat over the metal layer prior to bonding the resin to the metal layer.  
     
     
         25 . The method of  claim 15  wherein the metallized substrate comprises a film and a metal layer, wherein injection molding comprises bonding the resin with the film.  
     
     
         26 . The method of  claim 25  comprising depositing a topcoat over the metal layer.  
     
     
         27 . The method of  claim 26  wherein the topcoat comprises urethane.  
     
     
         28 . The method of  claim 15  wherein the metallized substrate comprises a shaped thermoform and a metal layer.  
     
     
         29 . The method of  claim 15  wherein the resin is clear or black.  
     
     
         30 . The method of  claim 15  wherein the metallized substrate creates a reflective surface.  
     
     
         31 . The method of  claim 15  wherein the metallized substrate is colored.  
     
     
         32 . The method of  claim 15  wherein the metallized substrate comprises a non-conductive film and a conductive metal layer.  
     
     
         33 . A method of forming a multi-layered structure, the method comprising: 
 shaping a substrate into a desired shape;    depositing a metal layer onto at least one surface of the shaped substrate.    placing a metallized substrate into an injection molding chamber; and    injection molding a resin on the metallized substrate.    
     
     
         34 . The method of  claim 33  wherein shaping comprises thermoforming the substrate.  
     
     
         35 . The method of  claim 33  wherein depositing comprises vacuum metallizing the metal layer onto the shaped substrate.  
     
     
         36 . The method of  claim 33  wherein injection molding comprises bonding the resin to the metal layer.  
     
     
         37 . The method of  claim 33  wherein injection molding comprises bonding the resin to the shaped substrate.  
     
     
         38 . The method of  claim 33  further comprising applying a decorative feature to at least one of the substrate and metal layer.  
     
     
         39 . The method of  claim 33  comprising applying one of an undercoat and an overcoat to the metal layer.  
     
     
         40 . A method of forming a multi-layered structure, the method comprising: 
 applying a decorative layer to at least one side of a substrate;    shaping the decorated substrate into a desired shape;    depositing a metal layer onto at least one surface of the decorated and shaped substrate.    placing a metallized substrate into an injection molding chamber; and    injection molding a resin on the metallized substrate.    
     
     
         41 . A multi-layered insert for an in-mold manufacturing process, the insert comprising: 
 a shaped substrate comprising a decorative feature along at least one surface; and    a metallized layer disposed over at least one of the substrate surface and the decorative feature.    
     
     
         42 . The insert of  claim 41  wherein the substrate comprises a thermoform.  
     
     
         43 . The insert of  claim 41  wherein the metallized layer comprises a vacuum metallized layer.  
     
     
         44 . The insert of  claim 41  wherein the metallized layer is bonded to the substrate after shaping of the substrate.  
     
     
         45 . The insert of  claim 41  wherein the metallized layer has a thickness that is sufficient to block electromagnetic interference.  
     
     
         46 . The insert of  claim 41  wherein the metallized layer has a thickness between approximately 1 micron and 50 microns.  
     
     
         47 . The insert of  claim 41  wherein the substrate comprises a first surface and a second surface, wherein the metallized layer is disposed on both the first surface and the second surface.  
     
     
         48 . The insert of  claim 41  wherein the decorative feature is disposed only on a first surface and the metallized layer is disposed on a second surface.  
     
     
         49 . The insert of  claim 48  wherein a second metallized layer is disposed on the decorative feature.  
     
     
         50 . The insert of  claim 41  wherein the metallized layer provides a reflective surface.  
     
     
         51 . A multi-layered laminate comprising: 
 a pre-shaped film;    a metal layer coupled to the pre-shaped film, the metal layer having a thickness sufficient to shield electromagnetic interference; and    an injection molded plastic structure coupled to at least one of the pre-shaped film and metal layer.    
     
     
         52 . The mold of  claim 51  comprising at least one decoration layer coupled to at least one of the pre-shaped film and the metal layer.  
     
     
         53 . The mold of  claim 51  wherein the pre-shaped film comprises a first surface and a second surface, wherein the metal layer is coupled to the first surface, wherein the laminate further comprises a second metal layer coupled to the second surface of the pre-shaped film.  
     
     
         54 . The mold of  claim 51  wherein the metal layer has a thickness between approximately 1 microns and 50 microns.  
     
     
         55 . The mold of  claim 51  wherein the injection molded plastic is directly coupled to the metal layer.  
     
     
         56 . The mold of  claim 51  wherein the injection molded plastic is coupled to the metal layer with an undercoat.  
     
     
         57 . The mold of  claim 51  wherein the injection molded plastic is coupled to the pre-shaped film.  
     
     
         58 . The mold of  claim 51  wherein the pre-shaped film comprises a thermoform.  
     
     
         59 . A shielded plastic housing for an electronic component, the housing comprising: 
 an injection molded layer;    a thermoform layer comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform layer is coupled to the injection molded layer; and    a decorative layer coupled to one of the injection molded layer, the thermoform layer and the metal layer.    
     
     
         60 . The housing of  claim 59  wherein the metal layer is viewable through the injection molded layer.  
     
     
         61 . The housing of  claim 59  wherein the metal layer provides a reflective surface.  
     
     
         62 . An electronic device comprising: 
 a plastic housing comprising: 
 an injection molded layer;  
 a thermoform layer comprising a metal layer that has a thickness sufficient to block transmission of electromagnetic interference, wherein one of the metal layer and thermoform layer is coupled to the injection molded layer; and  
   a printed circuit board disposed within the plastic housing.    
     
     
         63 . The device of  claim 62  wherein the metal layer has a grounding element to establish an electrical contact to a ground on the printed circuit board.  
     
     
         64 . The device of  claim 62  wherein the plastic housing comprises a decorative layer coupled to at least one of the injection molded layer, thermoform and metal layer.  
     
     
         65 . The device of  claim 62  wherein the injection molded layer is clear or colored and the metal layer is viewable through the injection molded layer.  
     
     
         66 . The device of  claim 65  wherein the metal layer provides a reflective surface.  
     
     
         67 . The device of  claim 62  wherein the injection molded layer is substantially clear, wherein the device further comprises a decorative feature that is viewable through the injection molded layer.  
     
     
         68 . A method of shielding an electronic component of a printed circuit board, the method comprising: 
 providing a printed circuit board having an electronic component and a ground trace;    placing an electronic housing around the electronic component;    conforming a polymer insert comprising a metal shielding layer to the electronic housing; and    grounding the metal shielding layer of the polymer insert with the ground trace on the printed circuit board.    
     
     
         69 . The method of  claim 68  wherein the housing comprises ribs, wherein grounding comprises contacting a portion of the metal layer of the polymer insert ribs that conforms with the ribs with the ground trace on the printed circuit board.  
     
     
         70 . The method of  claim 68  wherein providing comprises vacuum metallizing the metal shielding layer onto a polymer insert.  
     
     
         71 . The method of  claim 68  wherein grounding comprises depositing a conductive adhesive or solder between the metal layer and ground trace.  
     
     
         72 . The method of  claim 68  wherein grounding comprises laser heating or ultrasonic welding the metal layer to the ground trace.  
     
     
         73 . A method of shielding an electronic component of a printed circuit board, the method comprising: 
 providing a printed circuit board having an electronic component and a ground trace;    placing a housing comprising a metal shielding layer around the electronic component; and    creating a via through a portion of the housing;    positioning the via over the ground trace; and    depositing at least one of a conductive adhesive and a solder in the via to conductively ground the metal layer in the housing to the ground trace.    
     
     
         74 . The method of  claim 73  wherein the housing is an outer housing of an electronic device.