Optoelectronic packaging assembly

Abstract

Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.

1 . An optoelectronic packaging assembly, comprising: 
 a submount having a cavity defined by a floor, sidewalls, a back wall, and a front wall, wherein at least one of said sidewalls retains pins, said submount further including an optical input receptacle which extends from said front wall;    a base having sidewalls with top surfaces and a front wall with a slot, wherein said base is configured to receive said submount such that said submount extends over said sidewalls of said base and such that said optical input receptacle extends from said slot; and    an external cover over said submount.    
     
     
         2 - 75 . (Cancelled)