Copper alloy

Abstract

A copper alloy having superior thermal conductivity comparable to that of conventional materials, can be produced at low cost. An oxygen free copper, a base material of a Cu—B alloy were melted in vacuo by a casting method, B and at least one element selected from Mg, Ni, Co, Al, Si, Fe, Zr, and Mn are added into the molten metal wherein the content of each element or the alloy of Ni—B, Fe—B, Cu—Mg, and so forth becoming the predetermined content. This alloy is cast into an ingot of 12 mm square, heated at 600 to 900° C. for 1 hour, and the cast was rolled to be 3 mm by hot rolling. After these steps, heat treatment at 600 to 900° C. was provided and processed into predetermined shape.

What is claimed is:  
     
         1 . A copper alloy comprising: 
 0.01 to 10.0% by weight of B, and    the balance being Cu and inevitable impurities.    
     
     
         2 . A copper alloy according to  claim 1  comprising: 
 0.1 to 8.1% by weight of B, and  
 the balance being Cu and inevitable impurities, and  
 the total volume ratio of elemental B and Cu—B intermetallic compound is 0.6 to 39.0% by volume based on total volume.  
 
     
     
         3 . A copper alloy comprising: 
 0.01 to 10.0% by weight of B, and    at least one element selected from the group of Mg, Ni, Co, Al, Si, Fe, Zr, and Mn at 0.05 to 40.0% by weight in total amount,    the balance being Cu and inevitable impurities, and    total volume ratio of elemental B and an intermetallic compound B with at least one element selected from a group of Cu, Mg, Ni, Co, Al, Si, Fe, Zr, and Mn at 1 to 80% by volume based on total volume, and    the content of Mg by weight is not more than 5 times of the content of B by weight, and    the content of Al by weight is not more than 10 times of the content of B by weight.    
     
     
         4 . A copper alloy comprising: 
 0.1 to 9.8% by weight of B, and    at least one element selected from the group of Mg, Ni, Co, Al, Si, Fe, Zr, and Mn at 0.5 to 40.0% by weight in total weight,    the balance being Cu and inevitable impurities, and    total volume ratio of elemental B and an intermetallic compound B with at least one element selected from the group of Cu, Mg, Ni, Co, Al, Si, Fe, Zr, and Mn is from 3.0 to 74.5% by volume based on total volume.    the content of Mg by weight is not more than 5 times of the content of B by weight, and    the content of Al by weight is not more than 10 times of the content of B by weight.    
     
     
         5 . A copper alloy according to  claim 3 , further comprising a Mg—B intermetallic compound.  
     
     
         6 . A copper alloy according to  claim 3 , further comprising an Al—B intermetallic compound is formed.  
     
     
         7 . A copper alloy according to  claim 1 , wherein the alloy is manufactured by a casting process.  
     
     
         8 . A copper alloy according to  claim 1 , wherein the alloy is manufactured by a powder sintering method.  
     
     
         9 . A lead frame comprising a copper alloy according to  claim 1 .  
     
     
         10 . An optical communication connector case comprising a copper alloy according to  claim 1 .  
     
     
         11 . An optical amplifier case comprising a copper alloy according to  claim 1 .  
     
     
         12 . An heat sink for semiconductor devices comprising a copper alloy according to  claim 1.