Adhesiveless transfer lamination method and materials for producing electronic circuits

Abstract

An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.

1 - 15 . (cancelled).  
     
     
         16 . A substrate having one or more patterned metal objects on one or more sides of the substrate made by the method comprising the steps of: 
 a) applying a metal composition on a thermally resistant temporary substrate in the patterns of the one or more patterned metal objects;    b) curing said metal composition at a temperature below about 450° C. for a time less than about 30 minutes to form the one or more patterned metal objects;    c) transferring the one or more patterned metal objects from said temporary substrate to one side of the substrate    wherein said metal composition is comprised of one or more metal powders in a reactive organic medium, said reactive organic medium consisting of one or more components selected from the group consisting of metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, reagents which can react with said one or more metal powders to form metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, and mixtures thereof.    
     
     
         17 . A patterned metal object on a substrate, made by the method comprising the steps of: 
 a) applying a metal composition on a thermally resistant temporary substrate in the patterns of the one or more patterned metal objects;    b) curing said metal composition at a temperature below about 450° C. for a time less than about 30 minutes to form the one or more patterned metal objects;    c) transferring the one or more patterned metal objects from said temporary substrate to one side of the substrate without the use of a separately supplied adhesive    wherein said metal composition is comprised of one or more metal powders in a reactive organic medium, said reactive organic medium consisting of one or more components selected from the group consisting of metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, reagents which can react with said one or more metal powders to form metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, and mixtures thereof.    
     
     
         18 . The patterned metal object on a substrate of  claim 17  wherein said patterned metal object is selected from the group consisting of strain gauges, Tape Automated Bonding Decals, and thermocouples.