Printed wiring board for mounting semiconductor

Abstract

A printed wiring board for mounting a semiconductor, which printed wiring board has a taper-shaped through hole connecting an upper surface circuit and a lower surface circuit, and/or an internal layer circuit, the taper-shaped through hole being obtained by plating an inner wall surface and a small-diameter side end of a taper-shaped penetration hole with a metal to plate the inner wall surface and seal the small-diameter side end, wherein a ball pad or a bump pad is formed at at least a small-diameter side end of the taper-shaped through hole.

1 . A printed wiring board for mounting a semiconductor, which printed wiring board has a taper-shaped through hole connecting an upper surface circuit and a lower surface circuit, and/or an internal layer circuit, 
 the taper-shaped through hole being obtained by plating an inner wall surface and a small-diameter side end of a taper-shaped penetration hole with a metal to plate the inner wall surface and seal the small-diameter side end,    wherein a ball pad or a bump pad is formed at at least a small-diameter side end of the taper-shaped through hole.    
   
   
       2 . The printed wiring board according to  claim 1 , 
 wherein the diameter of the small-diameter side end of the taper-shaped penetration hole is 5 to 70 μm and the diameter of a large-diameter side end of the taper-shaped penetration hole is larger than that of the small-diameter side end by at least 10 μm and is 200 μm at maximum.    
   
   
       3 . The printed wiring board according to  claim 1 , 
 wherein the taper-shaped penetration hole is made by laser-processing.    
   
   
       4 . The printed wiring board according to  claim 3 , 
 wherein the laser-processing is UV-laser processing.    
   
   
       5 . The printed wiring board according to  claim 1 , 
 wherein the plating is carried out by electroless plating, or electroplating and electroless plating or direct plating.    
   
   
       6 . The printed wiring board according to  claim 1 , 
 wherein the metal used for the plating is at least one metal selected from the group consisting of gold, silver, copper, nickel and palladium.    
   
   
       7 . The printed wiring board according to  claim 1 , 
 wherein the plated and sealed taper-shaped through hole is filled with an insulating material.    
   
   
       8 . The printed wiring board according to  claim 1 , 
 wherein a ball pad for connecting a mother board is formed at the plated and sealed small-diameter side end.    
   
   
       9 . The printed wiring board according to  claim 1 , 
 wherein a bump pad for connecting a semiconductor element is formed at the plated and sealed small-diameter side end.    
   
   
       10 . The printed wiring board according to  claim 1 , 
 wherein the taper-shaped through hole is filled by plating.    
   
   
       11 . The printed wiring board according to  claim 1 , 
 wherein the ball pad is formed at one of a large-diameter side end and the small-diameter side end of the taper-shaped through hole and the bump pad is formed at the other end.    
   
   
       12 . The printed wiring board according to  claim 1 , 
 wherein the ball pad and/or the bump pad are formed by solder mask.    
   
   
       13 . A printed wiring board for mounting a semiconductor, comprising a plurality of taper-shaped through holes electrically conducting an upper surface circuit and a lower surface circuit, and ball pads and/or bump pads respectively provided on upper portions and lower portions of the taper-shaped through holes, 
 the taper-shaped through holes being obtained by plating internal wall surfaces and small-diameter side ends of taper-shaped penetration holes with a metal to plate the internal-wall surfaces and seal the small-diameter side ends,    wherein the center position of at least one through hole of the through holes is one-sided within the ball pad and/or the bump pad corresponding to the at least one through hole or within a peripheral area which is 100 μm or less outside from the edge of the ball pad and/or the bump pad corresponding to the at least one through hole.    
   
   
       14 . The printed wiring board according to  claim 13 , 
 which has an internal layer circuit and a taper-shaped throughhole electrically connecting the upper surface circuit, the lower surface circuit and the internal layer circuit.