Transfer system and semiconductor manufacturing system

Abstract

The present invention provides a transfer technique that can improve the transfer ability when reinforcing and expanding the transfer system, with effectively using the existing system. The transfer system includes tracks that link a plurality of manufacturing equipments, a plurality of carriers having different performances that run on the tracks to transfer objects between the manufacturing equipments and the like in a factory space having a plurality of manufacturing equipments, and the plurality of carriers having different performances are simultaneously provided and run on the same tracks. The plurality of carriers are composed of old carriers and new carriers that provided together and run depending on their own performances (running performance such as running speed, acceleration/deceleration, and the like and transfer performance such as transfer speed and the like).

1 . A transfer system comprising: 
 tracks which link a plurality of manufacturing equipments; and    a plurality of carriers having different performances which run on said tracks to transfer objects to be carried between said manufacturing equipments,    wherein the plurality of carriers having different performances are simultaneously provided and run on the same tracks.    
   
   
       2 . The transfer system according to  claim 1 , 
 wherein said carriers run depending on their own performances.    
   
   
       3 . The transfer system according to  claim 2 , 
 wherein said performance is running performance and transfer performance.    
   
   
       4 . The transfer system according to  claim 3 , 
 wherein said running performance is running speed and acceleration/deceleration.    
   
   
       5 . The transfer system according to  claim 3 , 
 wherein said transfer performance is transfer speed.    
   
   
       6 . The transfer system according to  claim 1 , 
 wherein said plurality of carriers are RGV, AGV, OHT, or OHS, or combination thereof.    
   
   
       7 . A semiconductor manufacturing system comprising: 
 a transfer system including tracks which link a plurality of manufacturing equipments and a plurality of carriers having different performances which run on the tracks to transfer semiconductor wafers between the manufacturing equipments, wherein said plurality of carriers having different performances are simultaneously provided and run on the same tracks; and    a plurality of manufacturing equipments which are arranged along said tracks to treat or inspect semiconductor wafers transferred and delivered by said carriers.    
   
   
       8 . The semiconductor manufacturing system according to  claim 7 , 
 wherein said carriers run depending on their own performances.    
   
   
       9 . The semiconductor manufacturing system according to  claim 8 , 
 wherein said performance is running performance and transfer performance.    
   
   
       10 . The semiconductor manufacturing system according to  claim 9 , 
 wherein said running performance is running speed and acceleration/deceleration.    
   
   
       11 . The semiconductor manufacturing system according to  claim 9 , 
 wherein said transfer performance is transfer speed.    
   
   
       12 . The semiconductor manufacturing system according to  claim 7 , 
 wherein said plural carriers are RGV, AGV, OHT, or OHS, or combination thereof.    
   
   
       13 . A semiconductor manufacturing system comprising: 
 a first semiconductor manufacturing area which has a plurality of first manufacturing equipments, first tracks which link said plurality of first manufacturing equipments, and first carriers which are arranged on said first tracks; and    a second semiconductor manufacturing area which has a plurality of second manufacturing equipments, second tracks which link said plurality of second manufacturing equipments, and second carriers having the performances different from those of said first carriers and arranged on said second tracks,    wherein said first tracks and said second tracks are linked so as to enable said second carriers to run on said first tracks and enable said first carriers to run on said second tracks.