Semiconductor device and method of fabricating the same

Abstract

A semiconductor device is disclosed which has a first substrate with wiring formed thereon, a second substrate mounted above the first substrate with a conductive plug buried in the second substrate to penetrate between upper and lower surfaces thereof, a plurality of semiconductor chips mounted above the second substrate and having a terminal electrode as electrically connected to the first substrate through the conductive plug of the second substrate, and a resin buried in an empty space or gap between adjacent ones of the plurality of semiconductor chips.

1 .- 6 . (Canceled)  
     
     
         7 . A method of fabricating a semiconductor device comprising: 
 mounting above a first substrate with wiring formed thereon a second substrate with a conductive plug buried therein to penetrate between upper and lower surfaces thereof;    mounting above said second substrate a plurality of semiconductor chips having a terminal electrode as electrically connected through said conductive plug to said wiring; and    burying a resin in an empty space between adjacent ones of said plurality of semiconductor chips.    
     
     
         8 . The method according to  claim 7 , further comprising: 
 performing resin sealing between said second substrate and said first substrate; and    performing resin sealing between said semiconductor chips and said second substrate.    
     
     
         9 . The method according to  claim 8 , wherein 
 said burying the resin in the empty space between said plurality of semiconductor chips is done as a causing a resin component extruded during resin sealing between said second substrate and said semiconductor chips to fill said empty space.