US2005031795A1PendingUtilityA1

Method for creating adhesion during fabrication of electronic devices

37
Priority: Oct 9, 2001Filed: Aug 2, 2004Published: Feb 10, 2005
Est. expiryOct 9, 2021(expired)· nominal 20-yr term from priority
Inventors:Manoj K. ChaudhuryAndrew GoodwinYeong Joo LeeBhukandas ParbhooGeoffrey Bruce Gardner
H10W 72/07337H10W 72/354H10W 72/352H10W 72/351H10W 72/325H10W 72/073H10W 72/30H10W 99/00C09J 5/02H10W 74/00H05K 3/305C09J 2400/226C09J 2483/006H05K 3/381
37
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Claims

Abstract

A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.

Claims

exact text as granted — not AI-modified
1 . A method comprising: 
 A) plasma treatment of a polymeric material, where the polymeric material comprises a silicone organic copolymer,    b) plasma treatment of an adherend, and    c) thereafter contacting the polymeric material and the adherend;    thereby creating adhesion of the polymeric material and the adherend;    where the method is carried out during fabrication of an electronic device, an electronic device package, a photonic device, or an optoelectronic device.    
     
     
         2 . The method of  claim 1 , where steps A) and B) are carried out concurrently.  
     
     
         3 . The method of  claim 1 , where steps A) and B) are carried out sequentially in any order.  
     
     
         4 . The method of  claim 1 , further comprising: storing the polymeric material after step A) and before step C), or storing the adherend after step B) and before step C), or both.  
     
     
         5 . The method of  claim 1 , further comprising repeating steps A), B), and C) one or more times.  
     
     
         6 . The method of  claim 5 , wherein steps A), B), and C) are repeated once to add a second adherend to the polymeric material.  
     
     
         7 . The method of  claim 1 , wherein the polymeric material has a modulus of at least about 0.1 megaPascal.  
     
     
         8 . The method of  claim 1 , wherein the polymeric material has a modulus of up to about 5 gigaPascals.  
     
     
         9 . The method of  claim 8 , wherein the polymeric material has a modulus of up to about 1 gigaPascal.  
     
     
         10 . The method of  claim 9 , wherein the polymeric material has a modulus of up to about 300 megaPascals.  
     
     
         11 . The method of  claim 1 , wherein step A) and step B) are each independently carried out using a plasma treatment selected from corona discharge treatment, dielectric barrier discharge treatment, and glow discharge treatment.  
     
     
         12 . The method of  claim 11 , wherein the glow discharge treatment is carried out using plasma selected from low pressure glow discharge or atmospheric pressure glow discharge.  
     
     
         13 . The method of  claim 1 , wherein step A) and step B) are each independently carried out at a pressure of up to about atmospheric pressure.  
     
     
         14 . The method of  claim 1 , wherein step A) and step B) are each independently carried out for a time of at least about 1 millisecond.  
     
     
         15 . The method of  claim 1 , wherein step A) and step B) are each independently carried out for a time of up to about 30 minutes.  
     
     
         16 . The method of  claim 1 , wherein step C) is carried out at a temperature of at least about 15° C.  
     
     
         17 . The method of  claim 1 , wherein step C) is carried out at a temperature of up to about 400° C.  
     
     
         18 . The method of  claim 1 , wherein step C) is carried out by applying pressure for a time of at least about 0.1 second.  
     
     
         19 . The method of  claim 1 , wherein step C) is carried out by applying pressure for a time of up to about 12 hours.  
     
     
         20 . A method comprising: 
 A) plasma treatment of a polymeric material;    B) plasma treatment of an adherend;    wherein steps A) and B) are carried out using a gas comprising air oxygen, helium, argon carbon dioxide, or combinations thereof; and    C) thereafter contacting the polymeric material and the adherend;    thereby creating adhesion of the polymeric material and the adherend.    
     
     
         21 . The method of  claim 20 , where steps A) and B) are carried out concurrently.  
     
     
         22 . The method of  claim 20 , where steps A) and B) are carried out sequentially in any order.  
     
     
         23 . The method of  claim 20 , further comprising: storing the polymeric material after step A) and before step C), or storing the adherend after step B) and before step C), or both.  
     
     
         24 . The method of  claim 20 , further comprising repeating steps A), B), and C) one or more times.  
     
     
         25 . The method of  claim 24 , wherein steps A), B), and C) are repeated once to add a second adherend to the polymeric material.  
     
     
         26 . The method of  claim 20 , wherein the polymeric material has a modulus of at least about 0.1 megaPascal.  
     
     
         27 . The method of  claim 20 , wherein the polymeric material has a modulus of up to about 5 gigaPascals.  
     
     
         28 . The method of  claim 27 , wherein the polymeric material has a modulus of up to about 1 gigaPascal.  
     
     
         29 . The method of  claim 28 , wherein the polymeric material has a modulus of up to about 300 megaPascals.  
     
     
         30 . The method of  claim 20 , wherein step A) and step B) are each independently carried out using a plasma treatment selected from corona discharge treatment, dielectric barrier discharge treatment, and glow discharge treatment.  
     
     
         31 . The method of  claim 30 , wherein the glow discharge treatment is carried out using plasma selected from low pressure glow discharge or atmospheric pressure glow discharge.  
     
     
         32 . The method of  claim 20 , wherein step A) and step B) are each independently carried out at a pressure of up to about atmospheric pressure.  
     
     
         33 . The method of  claim 20 , wherein step A) and step B) are each independently carried out for a time of at least about 1 millisecond.  
     
     
         34 . The method of  claim 20 , wherein step A) and step B) are each independently carried out for a time of up to about 30 minutes.  
     
     
         35 . The method of  claim 20 , wherein step C) is carried out at a temperature of at least about 15° C.  
     
     
         36 . The method of  claim 20 , wherein step C) is carried out at a temperature of up to about 400° C.  
     
     
         37 . The method of  claim 20 , wherein step C) is carried out by applying pressure for a time of at least about 0.1 second.  
     
     
         38 . The method of  claim 20 , wherein step C) is carried out by applying pressure for a time of up to about 12 hours.  
     
     
         39 . A method comprising: 
 A) plasma treatment of a polymeric material or plasma treatment of an adherend, or both, where plasma treatment of the polymeric material or plasma treatment of the adherend, or both, is performed using a plasma jet; and    B) thereafter contacting the polymeric material and the adherend;    thereby creating adhesion of the polymeric material and the adherend.    
     
     
         40 . A method comprising: 
 A) plasma treatment of a side of a semiconductor die using a plasma jet,    B) plasma treatment of a polymeric die attach material, and    C) contacting the plasma treated side of the semiconductor die with the plasma treated surface of the polymeric die attach material thereby bonding the semiconductor die with the polymeric die attach material.

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