US2005036223A1PendingUtilityA1

Magnetic discrete track recording disk

40
Priority: Nov 27, 2002Filed: Nov 27, 2002Published: Feb 17, 2005
Est. expiryNov 27, 2022(expired)· nominal 20-yr term from priority
Inventors:David WachenschwanzGerardo A. BerteroDavid TrevesAndrew M. HomolaJames L. ChaoChristopher H. Bajorek
Y10T29/49025G11B 5/8404Y10T29/49021G11B 5/858G11B 5/855
40
PatentIndex Score
0
Cited by
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References
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Claims

Abstract

A method of forming a discrete track recording pattern in a magnetic recording disk. In one embodiment, the discrete track recording pattern may be formed in a NiP layer continuous throughout the discrete track recording pattern. Alternatively, the discrete track recording pattern may be formed in a substrate.

Claims

exact text as granted — not AI-modified
1 . (Canceled)  
     
     
         2 . The method of  claim 5 , wherein forming further comprises a subtractive process.  
     
     
         3 . A method of fabricating a magnetic recording disk, comprising: 
 forming a discrete track recording pattern on a substrate, wherein forming comprises: 
 coating the substrate with an embossable layer; and  
 imprinting the embossable layer with the discrete track recording pattern; and  
   disposing a magnetic recording layer above the substrate.    
     
     
         4 . The method of  claim 3 , wherein imprinting comprises imprint lithography.  
     
     
         5 . The method of  claim 4 , wherein forming further comprises etching the embossable layer down to the substrate to form a first plurality of raised zones and recessed zones.  
     
     
         6 . The method of  claim 2 , wherein the subtractive process comprises etching into the substrate to form a second plurality of raised zones and recessed zones in the substrate that forms the discrete track recording pattern.  
     
     
         7 . The method of  claim 6 , wherein forming further comprises removing the embossable layer.  
     
     
         8 . The method of  claim 7 , wherein forming further comprises polishing the substrate after removing the embossable layer.  
     
     
         9 . The method of  claim 7 , wherein forming further comprises texturing the substrate after removing the embossable layer.  
     
     
         10 . The method of  claim 3 , wherein forming further comprises polishing the substrate before coating the substrate with the embossable layer.  
     
     
         11 . The method of  claim 3 , wherein forming further comprises texturing the substrate before coating the substrate with the embossable layer.  
     
     
         12 . The method of  claim 7 , wherein forming further comprises depositing a soft magnetic underlayer material over the second plurality of raised zones and recessed zones in the substrate.  
     
     
         13 . The method of  claim 5 , wherein forming further comprises an additive process.  
     
     
         14 - 16 . (Canceled)  
     
     
         17 . The method of  claim 13 , wherein the additive process comprises depositing the first plurality of recessed zones with a substrate material to form a second plurality of raised and recessed zones in the substrate that forms the discrete track recording pattern.  
     
     
         18 . The method of  claim 17 , wherein depositing further comprises electroplating.  
     
     
         19 . The method of  claim 17 , wherein depositing further comprises electroless plating.  
     
     
         20 . The method of  claim 17 , wherein forming further comprises removing the embossable layer.  
     
     
         21 . The method of  claim 20 , wherein forming further comprises polishing the substrate.  
     
     
         22 . The method of  claim 21 , wherein forming further comprises texturing the substrate.  
     
     
         23 . The method of  claim 20 , wherein forming further comprises depositing a soft magnetic underlayer material over the second plurality of raised zones and recessed zones in the substrate.  
     
     
         24 . The method of  claim 13 , wherein the additive process comprises depositing a substrate material on the first plurality of raised and recessed zones by vacuum deposition.  
     
     
         25 . The method of  claim 12 , wherein forming further comprises polishing a surface of the soft magnetic underlayer material.  
     
     
         26 . The method of  claim 12 , wherein forming further comprises texturing a surface of the soft magnetic underlayer material.  
     
     
         27 - 40 . (Cancelled).  
     
     
         41 . A method of fabricating a magnetic recording disk, the method comprising: 
 disposing a nickel-phosphorous (NiP) layer on a substrate; and    forming a discrete track recording pattern on the NiP layer, wherein the NiP layer is continuous throughout the discrete track recording pattern.    
     
     
         42 . The method of  claim 41 , wherein forming comprises a subtractive process.  
     
     
         43 . The method of  claim 42 , wherein forming further comprises: 
 coating the NiP layer with an embossable layer; and    imprinting the embossable layer with the discrete track recording pattern.    
     
     
         44 . The method of  claim 43 , wherein imprinting comprises imprint lithography.  
     
     
         45 . The method of  claim 44 , wherein forming further comprises etching the embossable layer down to the NiP layer to form a first plurality of raised zones and recessed zones.  
     
     
         46 . The method of  claim 45 , wherein forming further comprises etching into the NiP layer to form a second plurality of raised zones and recessed zones in the NiP layer that forms the discrete track recording pattern.  
     
     
         47 . The method of  claim 45 , wherein forming further comprises removing the embossable layer.  
     
     
         48 . The method of  claim 47 , wherein forming further comprises polishing the NiP layer after removing the embossable layer.  
     
     
         49 . The method of  claim 47 , wherein forming further comprises texturing the NiP layer after removing the embossable layer.  
     
     
         50 . The method of  claim 47 , wherein forming further comprises depositing a soft magnetic underlayer material over the second plurality of raised zones and recessed zones in the NiP layer.  
     
     
         51 . The method of  claim 50 , wherein forming further comprises polishing a surface of the soft magnetic underlayer.  
     
     
         52 . The method of  claim 50 , wherein forming further comprises texturing a surface of the soft magnetic underlayer.  
     
     
         53 . The method of  claim 50 , wherein forming further comprises disposing a second NiP layer on the soft magnetic underlayer.  
     
     
         54 . The method of  claim 53 , wherein forming further comprises polishing a surface of the second NiP layer.  
     
     
         55 . The method of  claim 53 , wherein forming further comprises texturing a surface of the second NiP layer.  
     
     
         56 . The method of  claim 43 , wherein forming further comprises texturing the NiP layer before coating the NiP layer with the embossable layer.  
     
     
         57 . The method of  claim 41 , wherein forming comprises an additive process.  
     
     
         58 . The method of  claim 57 , wherein forming further comprises: 
 coating the NiP layer with an embossable layer; and    imprinting the embossable layer with the discrete track recording pattern.    
     
     
         59 . The method of  claim 58 , wherein imprinting comprises imprint lithography.  
     
     
         60 . The method of  claim 59 , wherein forming further comprises etching the embossable layer down to the NiP layer to form a first plurality of raised zones and recessed zones.  
     
     
         61 . The method of  claim 60 , wherein forming further comprises depositing the first plurality of recessed zones with NiP to form a second plurality of raised and recessed zones in the NiP layer that forms the discrete track recording pattern.  
     
     
         62 . The method of  claim 61 , wherein depositing further comprises electroplating.  
     
     
         63 . The method of  claim 61 , wherein depositing further comprises electroless plating.  
     
     
         64 . The method of  claim 61 , wherein forming further comprises removing the embossable layer.  
     
     
         65 . The method of  claim 64 , wherein forming further comprises polishing the NiP layer.  
     
     
         66 . The method of  claim 64 , wherein forming further comprises texturing the NiP layer.  
     
     
         67 . The method of  claim 60 , further comprising depositing NiP on the first plurality of raised and recessed zones by vacuum deposition.  
     
     
         68 - 110 . (Cancelled).

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