US2005039888A1PendingUtilityA1
Two-phase cooling apparatus and method for automatic test equipment
Priority: Aug 21, 2003Filed: Aug 21, 2003Published: Feb 24, 2005
Est. expiryAug 21, 2023(expired)· nominal 20-yr term from priority
H10W 40/73F28D 15/0266F25B 23/006
33
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Claims
Abstract
A two-phase cooling apparatus for cooling an electronic assembly is disclosed. The apparatus comprises an evaporator having a single-phase inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant. A local condenser is disposed proximate the evaporator and has a two-phase inlet coupled to the evaporator outlet. The local condenser includes a single-phase liquid coolant outlet. The apparatus further includes a pump having an output coupled to the evaporator inlet, and an input coupled to the local condenser outlet.
Claims
exact text as granted — not AI-modified1 . A two-phase cooling apparatus for cooling an electronic assembly, the apparatus comprising:
an evaporator having a single-phase inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant; a local condenser disposed proximate the evaporator and having a two-phase inlet coupled to the evaporator outlet, the local condenser including a single-phase liquid coolant outlet; and a pump having an output coupled to the evaporator inlet, and an input coupled to the local condenser outlet.
2 . A two-phase cooling apparatus according to claim 1 wherein:
the pump comprises a local pump disposed proximate the evaporator inlet.
3 . A two-phase cooling apparatus according to claim I and further comprising:
a single-phase liquid coolant inlet line coupled to the evaporator inlet; and a single-phase liquid coolant outlet line coupled to the local condenser outlet.
4 . A two-phase cooling apparatus according to claim 3 and further comprising:
at least one single-phase coolant path disposed in parallel with the evaporator and condenser for carrying out single-phase heat transfer.
5 . A method of cooling an electronic assembly, the method comprising the steps:
pumping a single-phase liquid coolant onto the electronic assembly; exchanging heat proximate a first electronic device on the electronic assembly with the single-phase liquid coolant, and evaporating a portion of the single-phase liquid coolant to form a two-phase coolant; condensing the two-phase coolant back to a single-phase liquid coolant; and routing the condensed single-phase liquid coolant off the electronic assembly.
6 . A method according to claim 5 and further comprising the step:
directing a portion of the single phase coolant proximate a second electronic device on the electronic assembly to effect single phase cooling for the second electronic device.
7 . A two-phase cooling apparatus for cooling an electronic assembly, the apparatus comprising:
an evaporator having a single-phase inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant; means for condensing the two-phase coolant to a single-phase coolant, the means for condensing disposed on the electronic assembly; and a remote pump having an output coupled to the evaporator inlet, and an input coupled to the means for condensing.
8 . A two-phase cooling apparatus according to claim 7 wherein the means for condensing comprises:
a local condenser disposed proximate the evaporator and having a two-phase inlet coupled to the evaporator outlet, the local condenser including a single-phase liquid coolant outlet.
9 . A two-phase cooling apparatus according to claim 7 wherein the means for condensing comprises:
a single-phase coolant path disposed in parallel with the evaporator, the single-phase coolant path coupled to the evaporator outlet to mix sufficient single-phase coolant with the two-phase coolant and condense the two-phase coolant to a single-phase coolant.
10 . A two-phase cooling apparatus for cooling an electronic assembly, the apparatus comprising:
means for pumping a single-phase liquid coolant onto the electronic assembly; means for exchanging heat proximate an electronic device on the electronic assembly with the single-phase liquid coolant, and evaporating a portion of the single-phase liquid coolant to form a two-phase coolant; means for condensing the two-phase coolant back to a single-phase liquid coolant; and means for routing the condensed single-phase liquid coolant off the electronic assembly.
11 . A two-phase cooling apparatus according to claim 10 and further comprising:
means for directing a portion of the single phase coolant proximate a second electronic device on the electronic assembly to effect single phase cooling for the second electronic device.
12 . A two-phase cooling apparatus according to claim 10 wherein the means for pumping comprises a remote pump.
13 . A two-phase cooling apparatus according to claim 10 wherein the means for pumping comprises a local pump disposed proximate the means for exchanging heat.
14 . A two-phase cooling apparatus according to claim 10 wherein the means for exchanging heat comprises an evaporator having a single-phase inlet for receiving a single-phase liquid coolant, and a two-phase coolant outlet.
15 . A two-phase cooling apparatus according to claim 10 wherein the means for condensing comprises a local condenser disposed proximate the means for exchanging heat and having a two-phase inlet coupled to the means for exchanging heat, the local condenser including a single-phase liquid coolant outlet.
16 . A two-phase cooling system for cooling a plurality of electronic assemblies in a semiconductor tester, the two-phase cooling system comprising:
a liquid pump having an inlet and an outlet; an inlet manifold coupled to the pump outlet; a plurality of cooling assemblies having respective inlets coupled to the inlet manifold, each of the cooling assemblies including
an evaporator having a single-phase inlet coupled to the cooling assembly inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant; and
a local condenser disposed proximate the evaporator and having a two-phase inlet coupled to the evaporator outlet, the local condenser including a single-phase liquid coolant outlet;
an outlet manifold coupled to the cooling assembly outlets, the outlet manifold disposed in liquid communication with the liquid pump inlet.
17 . A two-phase cooling apparatus according to claim 16 wherein:
the liquid pump comprises a local pump disposed proximate the evaporator inlet.
18 . A two-phase cooling apparatus according to claim 16 and further comprising:
a single-phase liquid coolant inlet line coupled to each evaporator inlet; and a single-phase liquid coolant outlet line coupled to each local condenser outlet.
19 . A two-phase cooling apparatus according to claim 16 and further comprising:
at least one single-phase coolant path disposed in parallel with each evaporator and condenser for carrying out single-phase heat transfer.Join the waitlist — get patent alerts
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