US2005039888A1PendingUtilityA1

Two-phase cooling apparatus and method for automatic test equipment

Priority: Aug 21, 2003Filed: Aug 21, 2003Published: Feb 24, 2005
Est. expiryAug 21, 2023(expired)· nominal 20-yr term from priority
H10W 40/73F28D 15/0266F25B 23/006
33
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A two-phase cooling apparatus for cooling an electronic assembly is disclosed. The apparatus comprises an evaporator having a single-phase inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant. A local condenser is disposed proximate the evaporator and has a two-phase inlet coupled to the evaporator outlet. The local condenser includes a single-phase liquid coolant outlet. The apparatus further includes a pump having an output coupled to the evaporator inlet, and an input coupled to the local condenser outlet.

Claims

exact text as granted — not AI-modified
1 . A two-phase cooling apparatus for cooling an electronic assembly, the apparatus comprising: 
 an evaporator having a single-phase inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant;    a local condenser disposed proximate the evaporator and having a two-phase inlet coupled to the evaporator outlet, the local condenser including a single-phase liquid coolant outlet; and    a pump having an output coupled to the evaporator inlet, and an input coupled to the local condenser outlet.    
     
     
         2 . A two-phase cooling apparatus according to  claim 1  wherein: 
 the pump comprises a local pump disposed proximate the evaporator inlet.    
     
     
         3 . A two-phase cooling apparatus according to claim I and further comprising: 
 a single-phase liquid coolant inlet line coupled to the evaporator inlet; and    a single-phase liquid coolant outlet line coupled to the local condenser outlet.    
     
     
         4 . A two-phase cooling apparatus according to  claim 3  and further comprising: 
 at least one single-phase coolant path disposed in parallel with the evaporator and condenser for carrying out single-phase heat transfer.    
     
     
         5 . A method of cooling an electronic assembly, the method comprising the steps: 
 pumping a single-phase liquid coolant onto the electronic assembly;    exchanging heat proximate a first electronic device on the electronic assembly with the single-phase liquid coolant, and evaporating a portion of the single-phase liquid coolant to form a two-phase coolant;    condensing the two-phase coolant back to a single-phase liquid coolant; and    routing the condensed single-phase liquid coolant off the electronic assembly.    
     
     
         6 . A method according to  claim 5  and further comprising the step: 
 directing a portion of the single phase coolant proximate a second electronic device on the electronic assembly to effect single phase cooling for the second electronic device.    
     
     
         7 . A two-phase cooling apparatus for cooling an electronic assembly, the apparatus comprising: 
 an evaporator having a single-phase inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant;    means for condensing the two-phase coolant to a single-phase coolant, the means for condensing disposed on the electronic assembly; and    a remote pump having an output coupled to the evaporator inlet, and an input coupled to the means for condensing.    
     
     
         8 . A two-phase cooling apparatus according to  claim 7  wherein the means for condensing comprises: 
 a local condenser disposed proximate the evaporator and having a two-phase inlet coupled to the evaporator outlet, the local condenser including a single-phase liquid coolant outlet.    
     
     
         9 . A two-phase cooling apparatus according to  claim 7  wherein the means for condensing comprises: 
 a single-phase coolant path disposed in parallel with the evaporator, the single-phase coolant path coupled to the evaporator outlet to mix sufficient single-phase coolant with the two-phase coolant and condense the two-phase coolant to a single-phase coolant.    
     
     
         10 . A two-phase cooling apparatus for cooling an electronic assembly, the apparatus comprising: 
 means for pumping a single-phase liquid coolant onto the electronic assembly;    means for exchanging heat proximate an electronic device on the electronic assembly with the single-phase liquid coolant, and evaporating a portion of the single-phase liquid coolant to form a two-phase coolant;    means for condensing the two-phase coolant back to a single-phase liquid coolant; and    means for routing the condensed single-phase liquid coolant off the electronic assembly.    
     
     
         11 . A two-phase cooling apparatus according to  claim 10  and further comprising: 
 means for directing a portion of the single phase coolant proximate a second electronic device on the electronic assembly to effect single phase cooling for the second electronic device.    
     
     
         12 . A two-phase cooling apparatus according to  claim 10  wherein the means for pumping comprises a remote pump.  
     
     
         13 . A two-phase cooling apparatus according to  claim 10  wherein the means for pumping comprises a local pump disposed proximate the means for exchanging heat.  
     
     
         14 . A two-phase cooling apparatus according to  claim 10  wherein the means for exchanging heat comprises an evaporator having a single-phase inlet for receiving a single-phase liquid coolant, and a two-phase coolant outlet.  
     
     
         15 . A two-phase cooling apparatus according to  claim 10  wherein the means for condensing comprises a local condenser disposed proximate the means for exchanging heat and having a two-phase inlet coupled to the means for exchanging heat, the local condenser including a single-phase liquid coolant outlet.  
     
     
         16 . A two-phase cooling system for cooling a plurality of electronic assemblies in a semiconductor tester, the two-phase cooling system comprising: 
 a liquid pump having an inlet and an outlet;    an inlet manifold coupled to the pump outlet;    a plurality of cooling assemblies having respective inlets coupled to the inlet manifold, each of the cooling assemblies including 
 an evaporator having a single-phase inlet coupled to the cooling assembly inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant; and  
 a local condenser disposed proximate the evaporator and having a two-phase inlet coupled to the evaporator outlet, the local condenser including a single-phase liquid coolant outlet;  
   an outlet manifold coupled to the cooling assembly outlets, the outlet manifold disposed in liquid communication with the liquid pump inlet.    
     
     
         17 . A two-phase cooling apparatus according to  claim 16  wherein: 
 the liquid pump comprises a local pump disposed proximate the evaporator inlet.    
     
     
         18 . A two-phase cooling apparatus according to  claim 16  and further comprising: 
 a single-phase liquid coolant inlet line coupled to each evaporator inlet; and    a single-phase liquid coolant outlet line coupled to each local condenser outlet.    
     
     
         19 . A two-phase cooling apparatus according to  claim 16  and further comprising: 
 at least one single-phase coolant path disposed in parallel with each evaporator and condenser for carrying out single-phase heat transfer.

Join the waitlist — get patent alerts

Track US2005039888A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.