Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Abstract

An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.

1 . A semiconductor package, comprising: 
 an integrated circuit chip; and    an inductor loop including a first conductor connecting a bonding pad on the chip to an input/output pin of the package, and a second conductor connecting the bonding pad on the chip to the input/output pin of the package.    
     
     
         2 . The semiconductor package of  claim 1 , wherein the first conductor and the second conductor are bonding wires.  
     
     
         3 . The semiconductor package of  claim 1 , wherein the inductor loop includes at least a third conductor connecting the bonding pad on the chip to the input/output pin of the package.  
     
     
         4 . A semiconductor package, comprising: 
 an integrated circuit chip; and    an inductor loop including:    (a) a first sub-loop which includes a first conductor connecting a bonding pad on the chip to an input/output pin of the package and second conductor connecting the bonding pad on the chip to the input/output pin of the package; and    (b) a second sub-loop which includes one of the first conductor and the second conductor and a third conductor connecting the bonding pad on the chip to the input/output pin of the package.    
     
     
         5 . The semiconductor package of  claim 4 , wherein the first conductor and the second conductor are bonding wires.  
     
     
         6 . A semiconductor package, comprising: 
 an integrated circuit chip including a phase-locked loop; and    an inductor loop having a length corresponding to an output frequency of the phase-locked loop, said inductor loop including a first conductor connecting a bonding pad on the chip to an input/output pin of the package, and a second conductor connecting the bonding pad on the chip to the input/output pin of the package.    
     
     
         7 . The semiconductor package of  claim 6 , wherein the first conductor and the second conductor are bonding wires.  
     
     
         8 . An oscillator circuit, comprising: 
 an active oscillator having two output nodes;    an inductor loop coupled to the output nodes; and    at least one capacitive circuit coupled to one of the output nodes, said capacitive circuit including a capacitor, a resistor, and a first switch, wherein said resistor provides a bias voltage to the capacitor when the first switch is open and wherein said first switch couples and decouples the capacitor to the output nodes of the active oscillator, and wherein the active oscillator and capacitive circuit are included in a semiconductor package which includes an integrated circuit chip, said inductor loop including a first conductor connecting a bonding pad on the chip to an input/output pin of the package and a second conductor connecting the bonding pad on the chip to the input/output pin of the package.    
     
     
         9 . The oscillator circuit of  claim 8 , wherein the first conductor and the second conductor are bonding wires.  
     
     
         10 . The oscillator circuit of  claim 8 , wherein the inductor loop includes at least a third conductor connecting the bonding pad on the chip to the input/output pin of the package.  
     
     
         11 . An oscillator circuit, comprising: 
 an active oscillator having two output nodes;    an inductor loop coupled to the output nodes; and    at least one capacitive circuit coupled to one of the output nodes, said capacitive circuit including a capacitor, a resistor, and a first switch, wherein said resistor provides a bias voltage to the capacitor when the first switch is open and wherein said first switch couples and decouples the capacitor to the output nodes of the active oscillator, and wherein the active oscillator and capacitive circuit are included in a semiconductor package which includes an integrated circuit chip, said inductor loop including:    (a) a first sub-loop which includes a first conductor connecting a bonding pad on the chip to an input/output pin of the package and second conductor connecting the bonding pad on the chip to the input/output pin of the package; and    (b) a second sub-loop which includes one of the first conductor and the second conductor and a third conductor connecting the bonding pad on the chip to the input/output pin of the package.    
     
     
         12 . The oscillator circuit of  claim 11 , wherein the first conductor and the second conductor are bonding wires.