Multi-slide assembly including slide, frame and strip cap, and methods thereof
Abstract
A multi-slide assembly includes various components that alone or in combination facilitate testing of test samples with minimal manipulation of assay components. Moreover, the various device components permit centrifugation, culturing and analysis of each test sample to be performed in the same assembly. A frame retains a plurality of reaction vessel assemblies between a pair of opposing channels that are configured to slidably receive the opposing ends of each reaction vessel assembly. A strip cap seals the openings in each reaction vessel using cap members having sealing rings circumscribing the external walls thereof to form compression seals with internal walls of the reaction vessels. Furthermore, in a method of making a multi-well slide assembly, an ultrasonic welding process removably bonds a plurality of wells to a slide plate to provide an adequate seal therebetween during centrifugation, yet still enable separation thereof by an operator.
Claims
exact text as granted — not AI-modified1 . A method of making a reaction vessel of the type including at least one well defined by a sidewall member removably coupled to a slide plate, the method comprising:
(a) forming a bond between the sidewall member and the slide plate via ultrasonic welding, the bond sufficient to withstand centrifugation forces; and (b) controllably weakening the bond between the sidewall member and the slide plate via ultrasonic welding to permit selective separation of the sidewall member from the slide plate.
2 . The method of claim 1 , wherein the sidewall member includes an energy director disposed along an end thereof, and wherein forming the bond includes welding to a distance slightly less than or substantially equal to a length of the energy director.
3 . The method of claim 2 , wherein the energy director includes a base coupled to a sidewall at the end of the sidewall member, the base having a width and the sidewall having a thickness, wherein weakening the bond includes additionally welding at least to the remaining length of the energy director such that the bond has a width that is between the width of the base of the energy director and the thickness of the sidewall.
4 . The method of claim 2 , wherein the energy director has a length of about 0.019 inches (0.49 mm), and forming the bond includes welding to a distance of about 0.017 inches (0.42 mm), and wherein weakening the bond includes welding to a distance of about 0.004 inches (0.09 mm).
5 . The method of claim 2 , wherein forming the bond includes melting the energy director to a molten state.
6 . The method of claim 1 , wherein weakening the bond includes welding with a greater pressure than that used during forming the bond.
7 . The method of claim 6 , wherein weakening the bond includes welding at about 10 psi greater pressure than that used during forming the bond.
8 . The method of claim 7 , wherein weakening the bond includes welding at about 30 psi, and wherein forming the bond includes welding at about 20 psi.
9 . The method of claim 1 , further comprising cooling the sidewall member and slide plate prior to forming the bond therebetween.
10 . The method of claim 1 , wherein the sidewall member comprises an upper structure defining with the slide plate a plurality of wells.Join the waitlist — get patent alerts
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