Heat sink and display panel including heat sink

Abstract

A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor device; a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface; combining portions having combining apertures each adapted to receive a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining apertures being arranged through the first surface and the second surface; and a protrusion arranged at a location of the first surface matching a point on an upper portion of the at least one semiconductor device; wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.

1 . A heat sink comprising: 
 a first surface adapted to match and contact at least one semiconductor device;    a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface;    combining portions having combining holes adapted to be applied to a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining holes being arranged through the first surface and the second surface; and    a protrusion arranged at a location of the first surface matching a point on an upper portion of the at least one semiconductor device;    wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.    
   
   
       2 . The heat sink of  claim 1 , wherein the protrusion comprises a strip.  
   
   
       3 . The heat sink of  claim 2 , wherein the protrusion comprises a strip having a width equal to 40% of a thickness of the at least one semiconductor device.  
   
   
       4 . The heat sink of  claim 1 , wherein the protrusion comprises a bent structure accommodating a portion of the upper portion of the at least one semiconductor device.  
   
   
       5 . A heat sink comprising: 
 a first surface arranged to match and contact at least one semiconductor device;    a second surface having a fin structure and adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface;    combining portions having combining apertures each adapted to receive a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining apertures being formed through the first surface and the second surface; and    at least one protrusion arranged on the first surface adjacent to a periphery of the at least one semiconductor device;    wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.    
   
   
       6 . The heat sink of  claim 5 , wherein the at least one protrusion is arranged adjacent to a periphery of an upper portion of the at least one semiconductor device.  
   
   
       7 . The heat sink of  claim 5 , wherein the at least one protrusion is arranged adjacent to a periphery of a side surface of the at least one semiconductor device.  
   
   
       8 . The heat sink of  claim 5 , wherein the at least one protrusion is arranged at least one of adjacent to a periphery of an upper portion of the at least one semiconductor device or adjacent to a periphery of a side surface of the at least one semiconductor device.  
   
   
       9 . A display panel including a heat sink, the heat sink comprising: 
 a first surface arranged to match and contact at least one semiconductor device;    a second surface having a fin structure and adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface;    combining portions having combining holes and adapted to be applied to a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining holes formed through the first surface and the second surface; and    at least one protrusion arranged on the first surface adjacent to a periphery of an upper portion of the at least one semiconductor device;    wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.    
   
   
       10 . The display panel of  claim 9 , wherein the at least one protrusion comprises a strip.  
   
   
       11 . The display panel of  claim 10 , wherein the at least one protrusion comprises a strip having a width equal to 40% of a thickness of the at least one semiconductor device.  
   
   
       12 . The display panel of  claim 9 , wherein the at least one protrusion comprises a bent structure accommodating a portion of the upper portion of the at least one semiconductor device.  
   
   
       13 . A display panel including a heat sink, the heat sink comprising: 
 a first surface adapted to match and contact at least one semiconductor device;    a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface;    combining portions having combining holes adapted to be applied to a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining holes being arranged through the first surface and the second surface; and    a protrusion arranged at a location of the first surface matching a point on an upper portion of the at least one semiconductor device;    wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.    
   
   
       14 . The display panel of  claim 13 , wherein the at least one protrusion is arranged adjacent to a periphery of an upper portion of the at least one semiconductor device.  
   
   
       15 . The display panel of  claim 13 , wherein the at least one protrusion is arranged adjacent to a periphery of a side surface of the at least one semiconductor device.  
   
   
       16 . The display panel of  claim 13 , wherein the at least one protrusion is arranged at least one of adjacent to a periphery of an upper portion of the at least one semiconductor device or adjacent to a periphery of a side surface of the at least one semiconductor device.  
   
   
       17 . A heat sink comprising: 
 a main body adapted to absorb heat generated by at least one heat generating device and to externally dissipate the absorbed heat, the main body being affixed to the at least one heat generating device;    at least one stop extending from the main body and adapted to prevent displacement of the at least one heat generating device from a predetermined location on the main body upon the at least one heat generating device and the main body being affixed together.    
   
   
       18 . The heat sink of  claim 17 , wherein the main body comprises at least one aperture adapted to receive a respective at least one combining element passing therethrough, the at least one combining element adapted to affix the respective at least one heat generating device to the main body.  
   
   
       19 . The heat sink of  claim 18 , wherein the at least one combining element comprises a screw.  
   
   
       20 . The heat sink of  claim 17 , wherein the at least one stop extending from the main body toward the at least one heat generating device is arranged to contact at least one side of the respective at least one heat generating device.