Low-friction moving interfaces in micromachines and nanomachines

Abstract

A low-friction device having a moving interface comprising first and second members. Each of the members has a maximum dimension of about 100 μm or less between any two points. At least the first member is formed of diamond and the first and second members are in sliding contact or meshing contact.

1 . A low-friction device having a moving interface, the low-friction device comprising first and second members wherein: 
 each of the members has a maximum dimension of about 100 μm or less between any two points;    at least the first member is formed of diamond; and    the first and second members are in sliding contact.    
   
   
       2 . The low-friction device of  claim 1  wherein the second member is formed of a material chosen from the group consisting of diamond, silicon, quartz, and a III-V semiconductor material.  
   
   
       3 . The low-friction device of  claim 2  wherein one of the members has a cylindrical shape with an aperture.  
   
   
       4 . The low-friction device of  claim 3  wherein the other of the members has a spindle shape.  
   
   
       5 . The low-friction device of  claim 2  wherein: 
 one of the members has a ball end and the other of the members has a socket; and    the first and second members form a ball-and-socket joint.    
   
   
       6 . The low-friction device of  claim 2  wherein; one of the members is a bushing and the other of the members is a spindle.  
   
   
       7 . The low-friction device of  claim 2  wherein each of the members has a maximum dimension of about 50 μm or less between any two points.  
   
   
       8 . The low-friction device of  claim 2  wherein each of the members has a maximum dimension of about 25 μm or less between any two points.  
   
   
       9 . The low-friction device of  claim 2  wherein each of the members has a maximum dimensions of about 5 μm or less between any two points.  
   
   
       10 . A low-friction device having a moving interface comprising: 
 a toothed member having a maximum dimension of about 100 μm or less between any two points; and    a tooth-engaging member having a maximum dimension of about 100 μm or less between any two points;    at least one of the toothed member and tooth-engaging member being diamond; and    the toothed member and the tooth-engaging member being in meshing contact.    
   
   
       11 . The low-friction device of  claim 10  wherein the other of the toothed member and tooth-engaging member is chosen from the group consisting of diamond, silicon, quartz, and a III-V semiconductor material.  
   
   
       12 . The low-friction device of  claim 11  wherein the toothed member is a gear.  
   
   
       13 . The low-friction device of  claim 12  wherein the tooth-engaging member is a gear.  
   
   
       14 . The low-friction device of  claim 12  wherein the tooth-engaging member is a rack.  
   
   
       15 . The low-friction device of  claim 12  wherein the tooth-engaging member is a worm gear.  
   
   
       16 . The low-friction device of  claim 14  and further comprising a piezoelectric transducer coupled to the rack, wherein the piezoelectric transducer causes the rack to be translated causing the gear to rotate.  
   
   
       17 . The low-friction device of  claim 14  and further comprising a thermal expansion/contraction device coupled to the rack, wherein the device causes the rack to be translated causing the gear to rotate.  
   
   
       18 . The low-friction device of  claim 14  and further comprising an electric linear actuator coupled to the rack, wherein the actuator causes the rack to be translated causing the gear to rotate.  
   
   
       19 . The low-friction device of  claim 11  wherein each of the gear and the tooth-engaging member has a maximum dimension of about 50 μm or less between any two points.  
   
   
       20 . The low-friction device of  claim 11  wherein the each of the gear and the tooth-engaging member has a maximum dimension of about 25 μm or less between any two points.  
   
   
       21 . The low-friction device of  claim 11  wherein each of the gear and the tooth-engaging member has a maximum dimension of about 5 μm or less between any two points.  
   
   
       22 . A low-friction device having a moving interface comprising: 
 a diamond gear having a maximum dimension of about 100 μm or less between any two points; and    a silicon gear having a maximum dimension of about 100 μm or less between any two points;    wherein the diamond gear and the silicon gear are in meshing contact.    
   
   
       23 . A low-friction moving interface comprising: 
 a diamond bearing having a maximum dimension of about 100 μm or less between any two points; and    a silicon spindle having a maximum dimension of about 100 μm or less between any two points;    wherein the bearing and spindle are in sliding contact.    
   
   
       24 . A low-friction device having a moving interface comprising: 
 a silicon plate having a diamond coated aperture, the coated aperture having a diameter in the range of about 100 μm to about 5 μm; and    a spindle fitted into the diamond coated aperture in sliding contact, the spindle having a maximum dimension of about 100 μm or less between any two points.    
   
   
       25 . A low-friction device having a moving interface comprising: 
 a silicon plate formed with an aperture having a diameter in the range of about 100 μm to about 5 μm;    a diamond bushing inside the aperture; and    a spindle having a maximum dimension of about 100 μm or less between any two points;    wherein the diamond bushing and the spindle are in sliding contact.    
   
   
       26 . The low-friction device of  claim 25  wherein the spindle is chosen from the group consisting of diamond, silicon, quartz, and a III-V semiconductor material.  
   
   
       27 . A low-friction device having a moving interface comprising first, second, and third plates, wherein: 
 each of the first, second, and third plates has a maximum dimension of about 100 μm or less between any two points; and the third plate is diamond; and    the third plate has a rotational degree of freedom and is in sliding contact with the first and second plates.    
   
   
       28 . The low-friction device of  claim 27  wherein the first and second plates are chosen from the group consisting of diamond, silicon, quartz, and a III-V semiconductor material.  
   
   
       29 . The low-friction device of  claim 28  wherein the first, second, and third plates are a fluid pump.  
   
   
       30 . A low-friction device comprising first and second plates, wherein: 
 each of the first and second plates has a maximum dimension of about 100 μm or less between any two points;    one of the first and second plates is diamond;    the other of the first and second plate is silicon; and    the first and second plates are in sliding contact.    
   
   
       31 . The low-friction device of  claim 30  wherein the first and second plates are chosen from the group consisting of diamond, silicon, quartz, and a III-V semiconductor material.  
   
   
       32 . The low-friction device of  claim 31  wherein the second plate has a slot, and portions of the first plate are in the slot.  
   
   
       33 . The low-friction device of  claim 32  wherein the first and second plates are a fluid pump.