Fan sink heat dissipation device

Abstract

A heat dissipation device, having a base plate for making contact with a heat producing integrated circuit; several fins disposed on and partially covering the base plate, the fins forming flow channels and the fins and the flow channels having proximal ends and distal ends. The device also includes a fan mounted on the base plate for delivering air flow to the fins, the fan being configured to deliver air to the proximal ends of the fins. The device also includes a shroud disposed over the fins and the fan. The shroud has an aperture that has a shape generally matching the overall shape of the fan, where the aperture acts as an air inlet for the fan. The device also includes members for fastening the heat dissipation device against the heat producing integrated circuit. The fastening members hold in alignment the shroud and the base plate against a printed circuit board having the heat producing integrated circuit.

1 . A heat dissipation device, comprising: 
 a base plate for making contact with a heat producing integrated circuit;    a plurality of fins disposed on and partially covering said base plate, said fins forming flow channels and said fins and said flow channels having proximal ends and distal ends;    a fan mounted on said base plate for delivering air flow to said plurality of fins, said fan configured to deliver air to said proximal ends of said fins;    a shroud disposed over said fins and said fan, said shroud having an aperture having a shape generally matching the overall shape of said fan, said aperture acting as an air inlet for said fan; and    means for fastening said heat dissipation device against the heat producing integrated circuit, wherein said means for fastening hold in alignment said shroud and said base plate against a printed circuit board having the heat producing integrated circuit.    
   
   
       2 . The device of  claim 1  wherein said flow channels extend radially outward in a fanned-out manner from said proximal ends to said distal ends, said proximal ends being arranged along an arc which is complimentarily shaped with a portion of said aperture of said shroud.  
   
   
       3 . The device of  claim 2  wherein a first flow channel of said plurality of fins is generally parallel with a longitudinal axis of said printed circuit board and a last flow channel of said plurality is nonparallel and angled with respect to said first flow channel, and the remaining flow channels between said first and said last flow channel are incrementally angled away from said first channel and incrementally aligned with said last flow channel, so to form a radially extending fan-shaped plurality of flow channels formed by said plurality of fins.  
   
   
       4 . The device of  claim 2  wherein said plurality of fins comprise a corrugated fin section having a generally corrugated shape, such that said corrugated shaped fins when disposed on said base plate form said flow channels for delivering air flow provided by the fan.  
   
   
       6 . The device of claim  5  wherein said inverted U-shaped folded fins have an aperture formed in their top portions.  
   
   
       7 . The device of  claim 2  wherein said plurality of fins comprise a plurality of individual C-shaped fins, said plurality of C-shaped fins arranged in a stacked manner to form a stacked fin array to form said flow channels.  
   
   
       8 . The device of  claim 2  wherein said plurality of fins are arranged such that the fins are spaced at a distance of 2 to 3 times that of the fin's thickness.  
   
   
       9 . The device of  claim 1  further comprising a back plate for making contact with the back side of the printed circuit board, wherein said back plate, and said base plate are held in alignment against opposite sides of a board having a heat producing integrated circuit using said shroud.  
   
   
       10 . The device of  claim 1  wherein the top internal surface of said shroud is located a distance above the top of the fins so as to create a flow channel for directing airflow provided by said fan over said top of said fins.  
   
   
       11 . The device of  claim 1  wherein said shroud comprises openings along its periphery, wherein said openings are aligned with and project outward over the distal ends of said fins, so as to direct the air flow existing the flow channels to exit from said device along said openings.  
   
   
       12 . The device of  claim 11  further comprising a plurality of stiffeners, said stiffeners extending vertically downward from the top internal surface of said shroud and inward from and along said openings, wherein said stiffeners are aligned with the flow channels formed by said fins.  
   
   
       13 . The device of  claim 1  further comprising an intake shroud, having a proximal end and a distal end, said distal end of said intake air shroud configured to be coupled with said aperture of said shroud, said proximal end of said intake air shroud configured to receive air from the outside of a chassis of a workstation holding the printed circuit board, said intake air shroud configured to provide unheated air form the outside of a chassis of a workstation holding the board into the fins via the fan.  
   
   
       14 . The device of  claim 1  further comprising a heat pipe in thermal contact with said base plate.  
   
   
       15 . The device of  claim 1  wherein said base plate and said fins are made of the same high thermal conductivity material.  
   
   
       16 . The device of  claim 1  wherein said base plate and said fins are made of different high thermal conductivity materials.  
   
   
       17 . The device of  claim 1  having a temperature rise of no more than approximately 0.7 degrees C. per watt.  
   
   
       18 . The device of  claim 1  having a temperature rise of no more than approximately 0.6 degrees C. per watt.  
   
   
       19 . The device of  claim 1  having an overall width that is less than the width of a single personal computer interface expansion slot.  
   
   
       20 . A heat dissipation device, comprising: 
 a base plate for making contact with a heat producing integrated circuit;    a plurality of fins disposed on and partially covering said base plate, said fins forming flow channels and said fins and said flow channels having proximal ends and distal ends, wherein said plurality of fins comprise a plurality of individual C-shaped fins, said plurality of C-shaped fins arranged in a stacked manner to form a stacked fin array to form said flow channels;    a fan mounted on said base plate for delivering air flow to said plurality of fins, said fan configured to deliver air to said proximal ends of said fins;    a shroud disposed over said fins and said fan, said shroud having an aperture having a shape generally matching the overall shape of said fan, said aperture acting as an air inlet for said fan; and    means for fastening said heat dissipation device against the heat producing integrated circuit, wherein said means for fastening hold in alignment said shroud and said base plate against a printed circuit board having the heat producing integrated circuit,    wherein said flow channels extend radially outward in a fanned-out manner from said proximal ends to said distal ends, said proximal ends being arranged along an arc which is complimentarily shaped with a portion of said aperture of said shroud, and    wherein a first flow channel of said plurality of fins is generally parallel with a longitudinal axis of the printed circuit board and a last flow channel of said plurality is nonparallel and angled with respect to said first flow channel, and the remaining flow channels between said first and said last flow channel are incrementally angled away from said first channel and incrementally aligned with said last flow channel, so to form a radially extending fan-shaped plurality of flow channels formed by said plurality of fins.