Heat sinks and method of formation

Abstract

A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.

1 . A heat sink comprising: 
 a core having a central axis; and    a plurality of cooling fins extended at an angle from the core, wherein said fins are shaped to capture a tangential component of air from the fan and wherein an upper portion of each of said fins is bent.    
   
   
       2 . The heat sink recited in  claim 1 , wherein the fins are angled toward the tangential component.  
   
   
       3 . The heat sink recited in  claim 1 , wherein the upper portion of each of the fins is bent into a vertical position.  
   
   
       4 - 5 . (Canceled).  
   
   
       6 . The heat sink recited in  claim 1 , wherein each of said fins is provided in a swept manner about said core.  
   
   
       7 . A heat sink for use with an axial flow fan comprising: 
 a core having a central axis; and    a plurality of cooling fins arranged about the core, wherein each of said fins is arranged at an angle from said core and at least one portion of each of said fins is bent.    
   
   
       8 . The heat sink recited in  claim 7 , wherein an upper portion of each of the fins is bent.  
   
   
       9 - 12 . (Canceled).  
   
   
       13 . An electronic assembly comprising: 
 a substrate;    an electronic component mounted on a surface of the substrate;    an axial flow fan to move air towards the substrate, the air having an axial component and a tangential component; and    a heat sink including: 
 a first face in thermal contact with the electronic component;  
 a second face facing the fan;  
 a core having a central axis; and  
 a plurality of cooling fins arranged about the core, wherein each of said fins is extended at an angle from the core and at least one portion of each of said fins is bent.  
   
   
   
       14 . The electronic assembly recited in  claim 13 , wherein an upper portion of each of the fins is bent.  
   
   
       15 - 16 . (Canceled).  
   
   
       17 . The electronic assembly recited in  claim 13 , wherein each of said fins is provided in a swept manner about said core.  
   
   
       18 . The electronic assembly recited in  claim 13 , wherein the electronic component comprises an integrated circuit (IC).  
   
   
       19 . An electronic system comprising: 
 a circuit board;    a processor integrated circuit (IC) mounted on the circuit board;    at least one chipset mounted on the circuit board and electrically coupled to the processor IC for operation in conjunction with the processor IC;    at least one axial flow fan to move air towards the circuit board; and    at least one heat sink including 
 a first face in thermal contact with either the processor IC or the chipset;  
 a second face facing the at least one fan;  
 a core having a central axis; and  
 a plurality of cooling fins arranged about the core, wherein each of said fins is extended at an angle from the core and at least one portion of each of said fins is bent.  
   
   
   
       20 . The electronic system recited in  claim 19 , wherein an upper portion of each of the fins is bent.  
   
   
       21 - 22 . (Canceled).  
   
   
       23 . The electronic system recited in  claim 19 , wherein each of said fins is provided in a swept manner about said core.  
   
   
       24 . A method of forming a heat sink, said method comprising: 
 obtaining a quantity of thermally conductive metal;    forming from the quantity a plurality of fins extending outwardly at an angle from a core, the core having a central axis, each fin having a base coupled to the core; and    forming a bend in each of said fins.    
   
   
       25 . The method in  claim 24 , wherein forming said bend in each of said fins comprises coupling said heat sink to a die and rotating said die relative to a fixed position so as to create said bend in each of said fins.  
   
   
       26 . The method recited in  claim 24 , wherein forming said bend in each of said fins comprises coupling said heat sink to a first die and to a second die, and rotating said first die relative to said second die so as to create said bend in each of said fins.  
   
   
       27 . The method recited in  claim 24 , wherein before forming said bend, said method comprises: 
 separating a portion of each fin from the core.    
   
   
       28 . The method recited in  claim 24 , wherein forming said plurality of fins comprises extruding the quantity of thermally conductive metal through an extrusion die.  
   
   
       29 . The method recited in  claim 28 , wherein the thermally conductive metal comprises aluminum.  
   
   
       30 - 31 . (Canceled).  
   
   
       32 . The method recited in  claim 24 , wherein forming said bend comprises forming a vertical bend in an upper portion of each of the fins.  
   
   
       33 . A method of making an electronic assembly, the method comprising: 
 mounting an electronic component on a circuit board;    providing an axial flow fan, the fan capable of moving air; and    mounting a heat sink between the electronic component and the fan, the heat sink comprising a plurality of cooling fins arranged at an angle about a core having a central axis, each fin having a base coupled to the core, wherein an upper portion of each of said fins is bent.    
   
   
       34 . The method recited in  claim 32 , wherein the electronic component is from the group consisting of a processor, a chipset integrated circuit (IC), a digital switching circuit, a radio frequency (RF) circuit, a memory circuit, a custom circuit, an application specific IC (ASIC), and an amplifier.  
   
   
       35 . The method recited in  claim 32 , wherein each fin has a tip, wherein a first face of the heat sink is in thermal contact with the electronic component and has a periphery that is defined by the fin tips, and wherein a second face of the heat sink, substantially opposite the first face, faces the fan and has a periphery that is defined by the fin tips.  
   
   
       36 . The heat sink recited in  claim 7 , wherein the fins are arranged in a swept manner.  
   
   
       37 . The heat sink recited in  claim 7 , wherein each of the fins includes a vertical portion and a swept portion, wherein the lower portion is the swept portion.  
   
   
       38 . The heat sink recited in  claim 37 , wherein the swept portion of each of the fins is angled in the same direction.  
   
   
       39 . The heat sink recited in  claim 37 , wherein the vertical portion and the swept portion form another angle.  
   
   
       40 . The heat sink recited in  claim 7 , wherein the angle is the same for each of the fins.  
   
   
       41 . The heat sink recited in  claim 7 , wherein the angle is different for each of the fins.  
   
   
       42 . A heat sink comprising: 
 a core having a central axis; and    a plurality of cooling fins extending radially away from the core at an angle, the angled fins additionally being bent.    
   
   
       43 . The heat sink recited in  claim 42 , the fins having a first portion and a second portion, wherein the first portion is a bent portion and the second portion is an angled portion, wherein the bent portion is in a vertical direction.  
   
   
       44 . The heat sink recited in  claim 43 , wherein the first and second portions form another angle.