Energy curable sealant composition

Abstract

An energy-curable sealing material composition which is reduced in odor during the production, application, and curing thereof, and upon curing has satisfactory low-temperature flexibility. It comprises a phenyl-containing (meth)acrylate monomer having a molecular weight of 200 or higher and a photoreaction initiator.

1 . An energy curable sealant composition comprising: 
 (a) a (meth)acrylate monomer having a phenyl group and having a molecular weight of 200 or more, represented by the following formula:      CH 2 CXCOO [CH   2 CH(Y)O] n -PhR    wherein each of X and Y independently represents H or CH 3 ; n represents an integer of 2 to 10; Ph represents a phenyl group; R represents C m H 2m+1 ; and m represents an integer of 0 to 12,    (b) an acetophenone as a photoreaction initiator, and    (c) a thermoplastic resin selected from the group consisting of a styrene-butadiene-styrene block copolymer, a styrene-ethylene-butylene-styrene block copolymer, a styrene-ethylene-propylene-styrene block copolymer, a styrene-1,4-butadiene-butylene-styrene block copolymer and polystyrene.    
     
     
         2 . The composition according to  claim 1 , wherein said component (b) further comprises an acylphosphine oxide compound.  
     
     
         3 . The composition according to  claim 1 , further comprising: (a 1 ) a (meth)acrylate monomer having no phenyl group and having a glass transition temperature of −20° C. or lower as measured with respect to the homopolymer thereof; (e) an epoxy resin; and (f) a latent curing agent.  
     
     
         4 . The composition according to  claim 2 , further comprising: (a 1 ) a (meth)acrylate monomer having no phenyl group and having a glass transition temperature of −20° C. or lower as measured with respect to the homopolymer thereof; (e) an epoxy resin; and (f) a latent curing agent.  
     
     
         5 . The composition according to  claim 3 , which contains (i) 100 parts by weight of the sum of said component (a) and said component (a 1 ), or 100 parts by weight of the sum of said component (a), said component (a 1 ), and said component (c); and (ii) 20 to 200 parts by weight of the sum of said component (e) and said component (f).  
     
     
         6 . The composition according to  claim 4 , which contains (i) 100 parts by weight of the sum of said component (a) and said component (a 1 ), or 100 parts by weight of the sum of said component (a), said component (a 1 ), and said component (c); and (ii) 20 to 200 parts by weight of the sum of said component (e) and said component (f).