Heat sink structure
Abstract
An improved heat sink structure, having a heat dissipating member and a board member on which the heat dissipating member is mounted. The board member has an upper board and a lower board. A plurality of recessed connecting structures is formed on the top surface of the upper board. The heat dissipating member has a plurality of fins and air circulating channels between the fins. A plurality of protruding embedding structures is formed on the bottom of the fins, such that the heat dissipating member can be secured to the top surface by the connecting parts and the inserting parts. Thereby, the heat dissipating member can be secured to the board member as an integral unit. The structure strength, attachment and conducting performance can thus be enhanced.
Claims
exact text as granted — not AI-modified1 . An improved heat dissipating structure, comprising a heat dissipating member and a board member, wherein the board member includes an upper board and a lower board, and the upper board includes a plurality of recessed connecting structures formed on a top surface thereof, the heat dissipating member includes a plurality of fins parallel to and spaced with each other to form a plurality of air circulating channels, each of the fins includes an embedding part along a bottom edge thereof engageable with the connecting structure to securely mount the heat dissipating structure on the board member.
2 . The heat dissipating structure according to claim 1 , wherein the upper board includes a hollow cuboid with an open bottom.
3 . The heat dissipating structure according to claim 1 , wherein the lower board includes a hollow cuboid with an open top.
4 . The heat dissipating structure according to claim 1 , wherein the upper board is made of aluminum or copper.
5 . The heat dissipating structure according to claim 1 , wherein the lower board is made of aluminum or copper.
6 . The heat dissipating structure according to claim 1 , wherein the recessed connecting structures include dovetail slots.
7 . The heat dissipating structure according to claim 1 , wherein the recessed connecting structures include rectangular slots.
8 . The heat dissipating structure according to claim 1 , wherein the heat dissipating member includes an aluminum-extruded heat sink.
9 . The heat dissipating structure according to claim 1 , wherein the heat dissipating member includes a stack-type heat sink.
10 . The heat dissipating structure according to claim 1 , further comprising a fan mounted on the heat dissipating member.Join the waitlist — get patent alerts
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