US2005077030A1PendingUtilityA1

Transport line with grooved microchannels for two-phase heat dissipation on devices

Priority: Oct 8, 2003Filed: Sep 9, 2004Published: Apr 14, 2005
Est. expiryOct 8, 2023(expired)· nominal 20-yr term from priority
H10W 40/73F28D 15/046F28D 15/043
33
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Grooved microchannels are used to enhance the capillary action in the transport line of two-phase heat dissipation devices, such as loop heat pipes, capillary pump loops, or spray cooling devices, or others. Efficient heat dissipations achieved by enhancing the capillary pumping force for the liquid flow without significantly increasing the friction force. The effective cross-sectional area of the liquid line is made smaller than that of the condensation section, either by inserting a plug or shrinking the liquid line, to provide additional pumping force for the coolant recycling.

Claims

exact text as granted — not AI-modified
1 . A transport line for use in a two-phase dissipation device, comprising: 
 a vapor line section for flowing a coolant in vapor phase from an evaporator in the main body of said two-phase heat dissipation device, a condensation section for condensing the vapor phase from said vapor section into liquid phase, and a liquid line section for refluxing said liquid phase coolant from said condenser section back to said evaporator; and    grooved microchannels made along the inner wall of said liquid line section to enhance capillary action.    
   
   
       2 . The transport line for use in a two-phase heat dissipation device as described in  claim 1 , further comprising: 
 grooved microchannels made along the inner wall of said condensation section to enhance capillary action.    
   
   
       3 . The transport line as described in  claim 2 , further comprising a layer of wire mesh covering said grooved microchannels.  
   
   
       4 . The transport line as described in  claim 1 , wherein the cross-section of said transport line is circular.  
   
   
       5 . The transport line as described in  claim 1 , wherein said grooved microchannels have a cross-section selected from the group consisting of: V-shaped, triangular, rectangular, trapezoidal, and wavy.  
   
   
       6 . The transport line as described in  claim 1 , wherein said grooved microchannels are formed by corrugating the inner wall of said section.  
   
   
       7 . The transport line as described in  claim 1 , wherein said grooved microchannels are formed by lining the inner wall of said section with corrugated wire mesh.  
   
   
       8 . The transport line as described in  claim 7 , further comprising a layer of wire mesh placed against said corrugated wire mesh to form closed grooved microchannels.  
   
   
       9 . The transport line as described in  claim 1 , further comprising a capillary material inserted in said liquid line section.  
   
   
       10 . The transport line as described in  claim 1 , further comprising a plug, inserted in said liquid line section to make an effective cross-sectional area smaller.  
   
   
       11 . The transport line as described in  claim 10  wherein said grooved microchannels are formed on the surface of said plug.  
   
   
       12 . The transport line as described in  claim 11 , further comprising a capillary material inserted in said liquid line section.  
   
   
       13 . The transport line as described in  claim 1 , wherein said liquid line section shrinks to make an effective cross-sectional area smaller.  
   
   
       14 . The transport line as described in  claim 13 , further comprising a plug, inserted in said liquid line section to further make an effective cross-sectional area smaller.  
   
   
       15 . The transport line as described in  claim 13 , further comprising a capillary material inserted in said liquid line section.  
   
   
       16 . A transport line for use in a twO-phase heat dissipation device, comprising: 
 a vapor line section for flowing a coolant in vapor phase from an evaporator in the main body of said tw0-phase heat dissipation device, a condensation section for condensing the vapor phase from said vapor section into liquid phase, and a liquid line section for refluxing said liquid phase coolant from said condenser section back to said evaporator, and the effective cross-sectional area of said liquid line section is smaller than the cross-sectional area of said vapor section.    
   
   
       17 . The transport line as described in  claim 16 , further comprising a later of wire mesh placed against the inner wall of at least said condensation section.  
   
   
       18 . The transport line as described in  claim 16 , wherein the effective cross-sectional area of said liquid line section is made smaller by inserting a plug.  
   
   
       19 . The transport line as described in  claim 16 , wherein the effective cross-sectional area of said liquid line section is made smaller by shrinking said liquid line section.  
   
   
       20 . The transport line as described in  claim 16 , further comprising a capillary material inserted in said liquid line section.  
   
   
       21 . The transport line as described in  claim 20 , wherein the effective cross-sectional area of said liquid line section is made further smaller by inserting a plug.

Join the waitlist — get patent alerts

Track US2005077030A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.