US2005082042A1PendingUtilityA1

Heat-dissipating structure and method of manufacturing the same

Assignee: MALICO INCPriority: Aug 22, 2003Filed: Aug 17, 2004Published: Apr 21, 2005
Est. expiryAug 22, 2023(expired)· nominal 20-yr term from priority
Inventors:Robert Liang
H10W 40/73F28D 15/0233F28F 3/02
37
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Claims

Abstract

A heat-dissipating structure and a manufacturing method thereof are provided The heat-dissipating structure includes a heat piece and a heat sink, wherein the heat piece includes an opening, a containing space, a wall surrounding the containing space, and a relatively high-volatility liquid is filled in the containing space. The manufacturing method includes steps of connecting the heat sink with the wall of the containing space for sealing the containing space by the heat sink, filling the containing space with the relatively high-volatility liquid through the opening, and closing the opening.

Claims

exact text as granted — not AI-modified
1 . A heat-dissipating structure comprising: 
 a heat piece comprising a containing space with a wall surrounding therearound; and    a heat sink connected with said heat piece through said wall for sealing up said containing space.    
   
   
       2 . The heat-dissipating structure according to  claim 1  wherein said heat piece is made of one of a metal having a high conduction coefficient and an alloy thereof.  
   
   
       3 . The heat-dissipating structure according to  claim 2  wherein said metal is copper (Cu).  
   
   
       4 . The heat-dissipating structure according to  claim 2  wherein said metal is aluminum (Al).  
   
   
       5 . The heat-dissipating structure according to  claim 1  wherein inner surfaces of said heat piece and said wall further comprise a metal powder layer disposed thereon.  
   
   
       6 . The heat-dissipating structure according to  claim 5  wherein said metal powder is a copper (Cu) powder.  
   
   
       7 . The heat-dissipating structure according to  claim 1  wherein said heat piece further comprises a relatively high-volatility liquid filled in said containing space.  
   
   
       8 . The heat-dissipating structure according to  claim 1  wherein said heat sink is made of one of a metal having a high conduction coefficient and an alloy thereof.  
   
   
       9 . The heat-dissipating structure according to  claim 8  wherein said metal is copper (Cu).  
   
   
       10 . The heat-dissipating structure according to  claim 8  wherein said metal is aluminum (Al).  
   
   
       11 . A method of manufacturing a heat-dissipating structure, wherein said heat-dissipating structure comprises a heat piece and a heat sink, said heat piece comprises an opening and a containing space with a wall surrounding therearound and said containing space is filled by a relatively high-volatility liquid, said method comprising steps of: 
 (a) connecting said heat sink with said wall of said containing space for sealing said containing space by said heat sink;    (b) filling said containing space with said relatively high-volatility liquid through said opening; and    (c) closing said opening.    
   
   
       12 . The method according to  claim 11  wherein said step (a) further comprises a step of: forming a metal powder layer on inner surfaces of said heat piece and said wall.  
   
   
       13 . The method according to  claim 11  wherein said step (a) is performed by welding for connecting said heat sink with said wall of said containing space.  
   
   
       14 . The method according to  claim 11  wherein said step (b) is performed through creating a vacuum so as to fill said containing space with said relatively high-volatility liquid.

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