Heat sink with integrated electronics

Abstract

A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.

1 . A heat sink assembly with integrated electronics comprising: 
 a cast aluminum cover having at least one side open for exposing an interior cavity, and a track molded in an edge of said open side and having an adhesive applied thereto, said cover being made of a material having the capability of withstanding high temperatures;    at least one hybrid circuit housed in said cavity and having interconnects at said open side of said cover; and    a bottom for attachment to and sealing of said at least one open side of said cover through said adhesive and including a bead molded therein for interconnection with said track in said open side of said cover, said bottom being made from a material having heat sink capabilities and having a plurality of interconnect pins molded therein, said pins providing electrical interconnect capabilities between said at least one hybrid circuit and an external device, said pins being coupled to said interconnects of said at least one hybrid circuit by a wire bond.    
   
   
       2 . (canceled) The heat sink assembly as claimed in  claim 1  wherein said cover further comprises a track molded in an edge of said open side, and wherein said bottom has a bead molded therein for interconnection with said track in said open side of said cover.  
   
   
       3 . (canceled) The heat sink assembly as claimed in  claim 2  wherein an adhesive is applied to said track thereby sealing said bottom to said cover.  
   
   
       4 . (canceled) The heat sink assembly as claimed in  claim 1  wherein said cover is cast aluminum.  
   
   
       5 . The heat sink assembly as claimed in  claim 1  wherein said pins are solderable at another end for connection to said external device.  
   
   
       6 . The heat sink assembly as claimed in  claim 1  wherein said sealed cover and bottom are filled with a dielectric gel material.  
   
   
       7 . The heat sink assembly as claimed in  claim 1  wherein said cover has partitions separating said at least one hybrid circuit from another hybrid circuit housed in said cover, said at least one hybrid circuit and said another hybrid circuit having separate substrates.