Resilient flooring structure with encapsulated fabric
Abstract
A laminated fabric floor product having an encapsulated fabric scrim within a vinyl resilient flooring structure. The laminated fabric floor product structure includes a PVC calendered base, a first hot melt film, a fabric, a second hot melt film, a calendered clear film, and a high performance coating. Traditional foamed and non-foamed substrates used in the flooring industry can be used in addition to the calendered base. All types of fabrics and scrims can be encapsulated. The fabrics can be both woven and non-woven types. Open scrims can be used with base layers that are printed or have a visual pattern so that design features and colors can be seen through the open areas of the scrim. The fabric layer can be printed with a design pattern and adhered to the base layer or substrate by the first hot melt adhesive film layer. The clear layer is adhered to the fabric layer by the second hot melt adhesive layer.
Claims
exact text as granted — not AI-modified1 - 12 . (canceled)
13 . A resilient flooring structure comprising:
a flooring substrate; a scrim layer adhered to the substrate; and a clear layer adhered to the scrim layer opposite the substrate, wherein the scrim layer and substrate can be seen through the clear layer.
14 . (canceled)
15 . The resilient flooring structure of claim 13 wherein the clear layer is a wear layer.
16 . The resilient flooring structure of claim 13 wherein the scrim layer is a non-woven material.
17 . The resilient flooring structure of claim 13 wherein the scrim layer is colored or comprises a pattern or solid color printed on the upper surface of the scrim.
18 . The resilient flooring structure of claim 13 wherein the scrim layer has a thickness from about 5 mils to about 20 mils.
19 . The resilient flooring structure of claim 13 wherein the substrate comprises a visible pattern or printed design.
20 . The resilient flooring structure of claim 13 further comprising a high performance top coat layer adhered to the clear layer opposite the scrim.
21 . The resilient flooring structure of claim 13 wherein the substrate comprises a polyvinyl chloride calendered base layer.
22 . The resilient flooring structure of claim 21 wherein the substrate has a thickness from about 20 mils to about 60 mils.
23 . The resilient flooring structure of claim 13 wherein the substrate comprises a foam layer.
24 . The resilient flooring structure of claim 13 wherein the clear layer comprises a calendered clear film.
25 . The resilient flooring structure of claim 24 wherein the calendered clear film has a thickness from about 10 mils to about 20 mils.
26 - 63 . (canceled)Join the waitlist — get patent alerts
Track US2005090167A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.