Ceramic multilayer substrate and method for manufacturing the same

Abstract

A ceramic multilayer substrate is formed by vertically stacking and firing a plurality of ceramic sheets, in which a connection bar is vertically formed between internal patterns and an external terminal of each ceramic sheet, preventing metallic conductive layers of the internal patterns from being deformed during processing the external terminal. The ceramic multilayer substrate has pattern layers formed on surfaces of at least some of the ceramic sheets. At least one through hole is formed on the edges of the stacked ceramic sheets so as to be opened to the outside. An external terminal is formed on an inner wall of the through hole connected with the pattern layers, and directly contacting the connection bar, whereby the connection bar supports the electrical connection between the external terminal and the pattern layers.

1 - 4 . (canceled)  
   
   
       5 . A method for manufacturing a multilayer substrate by stacking and firing a plurality of ceramic substrates, comprising the steps of: 
 preparing a plurality of ceramic substrates, each of the ceramic substrates having a designated thickness;    forming pattern layers on surfaces of ceramic substrates so as to form circuit elements;    forming via holes longitudinally in the ceramic substrates within a part of the pattern layers extended to edges of the ceramic substrates adjacent to the edges so as to exchange signals with the outside;    forming connection bars by filling the via holes with a material being electrically connected to the pattern layers;    stacking a plurality of the ceramic substrates;    forming at least one through hole longitudinally on the edges of the stacked ceramic substrates so as to expose the connection bars to the outside; and    forming at least one external terminal in the said through hole by deposition.    
   
   
       6 . A method for manufacturing a multilayer substrate by stacking and firing a plurality of ceramic substrates, comprising the steps of: 
 preparing a plurality of ceramic substrates, each of the ceramic substrates having a designated thickness;    forming via holes longitudinally in the ceramic substrates adjacent to edges of the ceramic substrates;    forming connection bars by filling the via holes with a conductive material;    forming pattern layers on surfaces of ceramic substrates so as to form circuit elements such that the connection bars are located within a part of the pattern layers extended to the edges of the ceramic substrates so as to exchange signals with the outside;    stacking a plurality of the ceramic substrates;    forming at least one through hole longitudinally on the edges of the stacked ceramic substrates so as to expose the connection bars to the outside; and    forming at least one external terminal in the said through hole by deposition.    
   
   
       7 . The method for manufacturing a multilayer substrate as set forth in  claim 5 , wherein the pattern layers are made of a metal deposition film, and the connection bars are formed by filling the via holes with a metallic conductor so as to be electrically connected to the pattern layers.  
   
   
       8 . The method for manufacturing a multilayer substrate as set forth in  claim 5 , wherein the connection bars are cylindrical in shape, and a circumference of the through hole passes through the center of the connection bar.  
   
   
       9 . The method for manufacturing a multilayer substrate as set forth in  claim 5 , wherein a diameter of the connection bar is not larger than a width of the pattern layer extended to the edge of the ceramic substrate so as to exchange signals with the outside.  
   
   
       10 . A method for manufacturing multilayer substrates by stacking and firing a plurality of ceramic substrates, comprising the steps of: 
 preparing a plurality of ceramic substrate sheets, each being provided with scribe lines so as to be cut into a plurality of ceramic substrates and having a designated thickness;    forming a plurality of same pattern layers on surfaces of ceramic substrate sheets so as to form circuit elements;    forming via holes longitudinally in the ceramic substrate sheets within a part of the pattern layers extended to the scribe lines of the ceramic substrate sheets adjacent to the scribe lines so as to exchange signals with the outside;    forming connection bars by filling the via holes with a material being electrically connected to the pattern layers;    stacking a plurality of the ceramic substrate sheets;    forming through holes longitudinally on the scribe lines of the stacked ceramic substrates so as to expose the connection bars to the outside;    forming external terminals in the through holes by deposition; and    cutting the stacked ceramic substrate sheets along the scribe lines into a plurality of ceramic multilayer substrates.    
   
   
       11 . A method for manufacturing multilayer substrates by stacking and firing a plurality of ceramic substrates, comprising the steps of: 
 preparing a plurality of ceramic substrate sheets, each being provided with scribe lines so as to be cut into a plurality of ceramic substrates and having a designated thickness;    forming via holes longitudinally in the ceramic substrate sheets adjacent to the scribe lines;    forming connection bars by filling the via holes with conductive material;    forming a plurality of same pattern layers on surfaces of ceramic substrate sheets so as to form circuit elements such that the connection bars are located within a part of the pattern layers extended to the scribe lines of the ceramic substrates so as to exchange signals with the outside;    stacking a plurality of the ceramic substrate sheets;    forming through holes longitudinally on the scribe lines of the stacked ceramic substrates so as to expose the connection bars to the outside;    forming external terminals in the through holes by deposition; and    cutting the stacked ceramic substrate sheets along the scribe lines into a plurality of ceramic multilayer substrates.    
   
   
       12 . The method for manufacturing multilayer substrates as set forth in  claim 10 , wherein the pattern layers are made of a metal deposition film, and the connection bars are formed by filling the via holes with a metallic conductor so as to be electrically connected to the pattern layers.  
   
   
       13 . The method for manufacturing multilayer substrates as set forth in  claim 10 , wherein the connection bars are cylindrical in shape, and a circumference of the through hole passes through the center of the connection bar.  
   
   
       14 . The method for manufacturing multilayer substrate as set forth in  claim 10 , wherein a diameter of the connection bar is not larger than a width of the pattern layer extended to the edge of the ceramic substrate so as to exchange signals with the outside.